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Method for preparing high thermal conductivity heating film material

A technology of heating film and high thermal conductivity, which is applied in the field of thermal conductivity materials, can solve the problems of low thermal conductivity and achieve the effects of improving thermal conductivity, reducing resistivity, and improving electrothermal conversion efficiency

Active Publication Date: 2019-05-31
东莞市蓝征智能科技有限公司
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  • Abstract
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Problems solved by technology

[0009] The technical problem to be solved by the present invention: Aiming at the problem of low thermal conductivity of the heating material of the existing electrothermal film, a preparation method of a high thermal conductivity heating film material is provided

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  • Method for preparing high thermal conductivity heating film material

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Embodiment Construction

[0028]In parts by weight, weigh 45-50 parts of n-butanol, 3-5 parts of 200-mesh magnesium powder, and 10-15 parts of 200-mesh aluminum powder in a mortar, grind and disperse to obtain a dispersion slurry, and 1:15, add elemental iodine to the dispersion slurry, stir and mix, and place it at 45-50°C for 1-2 hours to insulate and react for 1-2 hours to obtain a reaction solution; put the reaction solution at 45-55°C and rotary evaporate to the volume of the reaction solution 1 / 5, to obtain the rotary distillation solution and add the rotary distillation solution to absolute ethanol according to the mass ratio of 1:10, stir and mix to obtain the modified solution, and weigh 45 to 50 parts of the modified solution according to parts by weight , 10-15 parts of acetylacetone and 65-70 parts of 75% ethanol solution by mass fraction are placed in a beaker, stirred and mixed and left to stand for 2-3 hours to obtain a sol solution, and the sol solution is dried at 100-110°C for 1-2 hour...

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Abstract

The invention relates to a method for preparing a high thermal conductivity heating film material and belongs to the technical field of thermal conductive materials. The method uses magnesium aluminumpowder as a raw material to prepare an ultrafine composite powder and loads the ultrafine composite powder into a zinc oxide sol film. Since one more electron is located at a position where the Al powder is incorporated into a ZnO film lattice to replace an Zn ion, the carrier concentration in a semiconductor material increases, and the carriers fill the lower energy level in a conduction band sothat the electrons in a valence band can only transition to a higher energy level and the resistivity of the film is lowered, thereby improving the electrical properties of the film and improving theelectrothermal stability of the heating film material. The material is doped with the magnesium-aluminum composite powder for loading, and the ceramic powder has excellent thermal conductivity and connection properties such that the magnesium-aluminum composite powder is dispersed inside the film to form anchor points that are linked to each other, and the electrothermal conversion efficiency ofthe material is improved by the effective combination between the anchor points.

Description

technical field [0001] The invention relates to a preparation method of a high thermal conductivity heating film material, which belongs to the technical field of thermal conductivity materials. Background technique [0002] The traditional method of using resistance wire for heating has the disadvantages of small electric heating area, low electric heating efficiency, easy oxidation of resistance wire after long-term use, and short service life. Therefore, more and more electric heating films have begun to enter people's field of vision. [0003] Semiconductor conductive films have been widely used in glass defrosting of automobiles, airplanes, refrigerators and other equipment. However, it is mainly prepared by magnetron sputtering and spraying thermal decomposition. However, the equipment used in the preparation process is very expensive. In addition, due to the extremely complex shapes of household appliances, it is difficult to composite the semiconductor conductive f...

Claims

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Application Information

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IPC IPC(8): H05B3/34H05B3/12
Inventor 龙爱冬
Owner 东莞市蓝征智能科技有限公司
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