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Double-sided hot-melt adhesive tape and preparation method thereof

A hot-melt tape, double-sided technology, applied in the direction of adhesives, heat-activated films/sheets, adhesive types, etc., can solve the problems of reduced bonding strength, easy heat conduction, etc., and achieve fast curing speed, high curing strength, The effect of high peel strength

Active Publication Date: 2019-06-07
DONGGUAN AOZON ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the different bonding parts on both sides of the tape, the heat is easily transferred to each other, resulting in a decrease in the bonding strength of one side. Therefore, we propose a double-sided hot-melt tape and its preparation method

Method used

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  • Double-sided hot-melt adhesive tape and preparation method thereof

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Embodiment 1

[0031] A double-sided hot-melt adhesive tape, comprising a first release paper layer, a pressure-sensitive adhesive layer, a heat-insulating base material layer, a heat-activated adhesive layer and a second release paper layer laminated in sequence, the pressure-sensitive adhesive The mixture layer is composed of the following raw materials in parts by weight: 70 parts of 2-ethylhexyl acrylate, 60 parts of dodecyl acrylate, 30 parts of methyl methacrylate, 42 parts of filler, benzoyl diphenyl 15 parts of phosphine, 8 parts of solubilizer;

[0032] The heat-insulating substrate layer is composed of the following raw materials in parts by weight: 55 parts of polyethylene terephthalate, 13 parts of boron carbide, 12 parts of silicon phosphide, and 11 parts of nano-tin oxide;

[0033] The heat-activated adhesive layer is composed of the following raw materials in parts by weight: 80 parts of aromatic polyester polyurethane, 55 parts of polymer polyester resin, 15 parts of activate...

Embodiment 2

[0050] A double-sided hot-melt adhesive tape, comprising a first release paper layer, a pressure-sensitive adhesive layer, a heat-insulating base material layer, a heat-activated adhesive layer and a second release paper layer laminated in sequence, the pressure-sensitive adhesive The mixture layer is composed of the following raw materials in parts by weight: 95 parts of 2-ethylhexyl acrylate, 75 parts of dodecyl acrylate, 35 parts of methyl methacrylate, 50 parts of filler, benzoyl diphenyl 20 parts of phosphine, 11 parts of solubilizer;

[0051] The heat-insulating substrate layer is composed of the following raw materials in parts by weight: 55 parts of polyethylene terephthalate, 15 parts of boron carbide, 14 parts of silicon phosphide, and 13 parts of nano-tin oxide;

[0052] The heat-activated adhesive layer is composed of the following raw materials in parts by weight: 90 parts of aromatic polyester polyurethane, 65 parts of polymer polyester resin, 17 parts of activat...

Embodiment 3

[0069] A double-sided hot-melt adhesive tape, comprising a first release paper layer, a pressure-sensitive adhesive layer, a heat-insulating base material layer, a heat-activated adhesive layer and a second release paper layer laminated in sequence, the pressure-sensitive adhesive The mixture layer is composed of the following raw materials in parts by weight: 120 parts of 2-ethylhexyl acrylate, 90 parts of dodecyl acrylate, 40 parts of methyl methacrylate, 58 parts of filler, benzoyl diphenyl 25 parts of phosphine, 14 parts of solubilizer;

[0070] The heat-insulating substrate layer is composed of the following raw materials in parts by weight: 75 parts of polyethylene terephthalate, 17 parts of boron carbide, 16 parts of silicon phosphide, and 15 parts of nano-tin oxide;

[0071] The heat-activated adhesive layer is composed of the following raw materials in parts by weight: 100 parts of aromatic polyester polyurethane, 75 parts of polymer polyester resin, 18 parts of activ...

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Abstract

The invention relates to the technical field of adhesive tapes, in particular to a double-sided hot melt adhesive tape. The adhesive tape comprises a first release paper layer, a pressure-sensitive adhesive layer, a heat insulation base material layer, a heat activation adhesive layer and a second release paper layer, which are sequentially attached. The heat insulation base material layer is prepared from the following raw materials in parts by weight: polyethylene glycol terephthalate, boron carbide, silicon phosphide and nano tin oxide. According to the invention, through the arrangement ofthe heat insulation base material layer, the situation that due to heat transfer of double-sided viscose, the low-melting-point end face loses the bonding performance due to too high temperature is prevented. The pressure-sensitive adhesive layer has the advantages of good pressure-sensitive property, good initial adhesion, good permanent adhesion and high peel strength, and has strong adhesion when being used as an adhesive layer. Therefore, the adhesive tape is excellent in storage stability, high in curing strength and low in preparation cost, and has outstanding substantive features and remarkable progress.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to a double-sided hot-melt adhesive tape and a preparation method thereof. Background technique [0002] For industrial pressure sensitive tape applications, double sided tapes are very often used in order to bond two materials to each other. Due to the extremely diverse deployment tendencies, the requirements in some cases are very specific, so that demanding requirements are placed on the corresponding adhesive tapes. In the field of lithium batteries, for example, requirements for high temperature stability and high resistance to solvents and fuels are very frequently present. These properties are achieved in a very good form by means of crosslinked pressure-sensitive acrylate adhesives (acrylate PSA). Moreover, also in the industrial field, the substrates which can be bonded vary extremely widely. In some cases it may be advantageous to use a heat-activatable adhesive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/35C09J7/38C09J175/04C09J167/00C09J4/02C09J4/06C09J11/04C09J11/06C08L67/02C08K3/38C08K3/34C08K3/22
Inventor 任寒晟黄敬王杰
Owner DONGGUAN AOZON ELECTRONICS MATERIAL
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