Low-dielectric-constant polyimide composite resin as well as preparation method and application thereof

A technology of low dielectric constant and polymethylimide resin, which is applied in the direction of circuit substrate materials, printed circuit components, photosensitive materials used in optomechanical equipment, etc., and can solve the problems of low dipole moment and dielectric constant reduction

Active Publication Date: 2019-06-28
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the molecular chain of polymethylimide, it is composed of imine groups instead of imide rings; there is no carbonyl group, so it has a lower dipole moment and a relatively lower dielectric constant

Method used

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  • Low-dielectric-constant polyimide composite resin as well as preparation method and application thereof
  • Low-dielectric-constant polyimide composite resin as well as preparation method and application thereof
  • Low-dielectric-constant polyimide composite resin as well as preparation method and application thereof

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Effect test

Embodiment 1-20

[0081] [Polyimide Composite Resin A-T] was prepared according to the input amount of raw materials in Table 1 and the following experimental procedures:

[0082] Under a nitrogen atmosphere, in a 100mL three-necked flask, dissolve the quantitative diamine compounds and triamine compounds shown in Table 1 in 40g of NMP while stirring, so that the sum of the mass percentages of the amine compounds is 5%-13 %. Then add the quantitative diformaldehyde compounds shown in Table 1, control the temperature of the solution at 0-50°C under nitrogen atmosphere, and react for 4-24h. Add the quantitative tetraformic acid dianhydride compound shown in table 1 three times afterwards in the solution, each addition accounts for 60%, 30%, 10% of total weight respectively; Continue to react 4-48h under nitrogen atmosphere, solution temperature Control at 0-50°C. Finally, the precursor solution of polyimide composite resin is obtained.

[0083] Using a coating machine, the precursor solution o...

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Abstract

The invention discloses low-dielectric-constant polyimide composite resin as well as a preparation method and application thereof. The polyimide composite resin is prepared from a polyimide resin unitand a polymethylenimine resin unit through blending and copolymerization. A net-shaped structure is formed in a copolymer structure, so that the gaps among macromolecular chains are increased. By introducing the polymethylenimine resin, the dipole moment of a polyimide molecular chain is decreased; meanwhile, fluorine-containing monomers are adopted during the polymerization, so that the dielectric constant of the polyimide composite resin is commonly decreased. By designing a flexible polyimide molecular chain through the type of monomers, a high-rigid polymethylenimine molecular chain is balanced, and the rigidity-flexibility of a molecular chain section in the final polyimide composite resin reaches a relatively good balance point, so that the polyimide composite resin has relatively good mechanical property, controllable linear thermal expansion coefficient and good application prospects in the products of flexible copper-clad plates, light-sensitive covering films and circuit board products.

Description

technical field [0001] The invention relates to the technical field of preparation of polyimide composite resin, in particular to a polyimide composite resin obtained by blending and copolymerizing polyimide and polymethylimide, which has the characteristics of low dielectric constant, It has good application in the fields of high-frequency high-speed lines and electronic materials. The polyimide composite resin and the corresponding flexible copper-clad laminate of the present invention are suitable for flexible printed circuit boards for high-frequency transmission, insulating substrates for high-frequency electronic devices, high-fidelity signal transmission, and various electronic and electrical products. Background technique [0002] Polyimide resin is a kind of high-performance engineering plastics. Because of its inherent heat resistance, thermal oxidation resistance, chemical stability and excellent mechanical properties, it is resistant to cold and heat shocks. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08G12/08C08J5/18G03F7/004H05K1/03C08L79/08
Inventor 周慧翁建东李营俞仁杰章陈萍周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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