Preparation methods of anisotropic conductive silk screen, block and diaphragm, and product

An anisotropic, conductive wire mesh technology, applied in the microwave field, can solve the problems of low test efficiency, failure to provide, long time consumption, etc., and achieve the effect of reducing the difficulty of production and test installation, improving test efficiency and simple preparation process.
CN109979646AActive Publication Date: 2019-07-05SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
Publication Date
2019-07-05

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Abstract

The invention discloses preparation methods of an anisotropic conductive silk screen, a block and a diaphragm, and a product. The anisotropic electric conduction silk screen is obtained by carrying out net knitting on a conductive wire and an insulating fiber. The anisotropic conductive block is obtained by superposing the silk screen and an insulating medium, and conducting pressing and heating.The anisotropic conductive diaphragm is obtained by carrying out interface slicing on the anisotropic conductive silk screen, carrying out polishing and plating treatment on the end of the conductivewire and carrying out adhesion removal treatment on the surface of the diaphragm. The conductive silk screen manufactured through simple technology is convenient for large-scale manufacturing. The manufactured conductive diaphragm can complete approximately non-damage, high-frequency, high-power and high-efficiency microwave integrated circuit testing. The intermediate products for preparing the diaphragm can be independently used, and convenience is provided for the preparation of subsequent products.
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Description

technical field

[0001] The invention relates to the field of microwave technology, in particular to a preparation method and products of anisotropic conductive wire mesh, blocks and membranes. Background technique

[0002] With the market demand for miniaturization, light weight and multi-functionalization of electronic products, how to quickly and accurately complete the performance test of high-density microwave integrated circuits has become the focus of attention. In the traditional testing method, it is necessary to solder or bond the DUT in package form such as BGA, PGA or QFN on the test board. This method has the following problems: (1) Welding or bonding is a rigid connection, and after the test is passed, it is easy to cause damage to the pad and affect the reliability of the subsequent use process; (2) There are many process steps before and after the test, which consumes The time is long, resulting in low test efficiency.

[0003] If the anisotropic elastic con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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