Preparation methods of anisotropic conductive silk screen, block and diaphragm, and product

An anisotropic, conductive wire mesh technology, applied in the microwave field, can solve the problems of low test efficiency, failure to provide, long time consumption, etc., and achieve the effect of reducing the difficulty of production and test installation, improving test efficiency and simple preparation process.

Active Publication Date: 2019-07-05
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the following problems: (1) Welding or bonding is a rigid connection, and after the test is passed, it is easy to cause damage to the pad and affect the reliability of the subsequent use process; (2) There are many process steps before and after the test, which consumes Long time, resulting in low test efficiency
This processing method can achieve large-scale industrial production, but the thickness of the obtained membrane is too thin (1-100 microns), and its application range is limited
At the same time

Method used

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  • Preparation methods of anisotropic conductive silk screen, block and diaphragm, and product
  • Preparation methods of anisotropic conductive silk screen, block and diaphragm, and product
  • Preparation methods of anisotropic conductive silk screen, block and diaphragm, and product

Examples

Experimental program
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Effect test

Embodiment 1

[0049] This embodiment discloses a wire mesh weaving method for preparing an anisotropic conductive wire mesh, the weaving method includes:

[0050] Conductive wires coated on the surface are woven with insulating fiber wires in a mesh shape. During the weaving process, the direction of the conductive wires is guaranteed to be consistent to obtain a two-dimensional unidirectional conductive wire mesh.

[0051] In one embodiment, the weaving method is as follows:

[0052] Coating the surface of the conductive wire used for weaving to obtain a conductive wire with coating protection;

[0053] The coated conductive wire and insulating fiber wire are mixed and woven to form a mesh structure; during the weaving process, the direction of the conductive wire is guaranteed to be consistent. In this way, a two-dimensional unidirectional conductive mesh is obtained.

[0054] The so-called plating treatment refers to coating a protective layer on the surface of an object to prevent the...

Embodiment 2

[0057] This embodiment discloses a wire mesh weaving method for preparing an anisotropic conductive wire mesh, the weaving method includes:

[0058] One or more of stainless steel wires, beryllium copper wires, tungsten wires, molybdenum copper wires, aluminum wires, etc. are coated with one or more coatings of gold, nickel gold, nickel cadmium, etc. The coating material in this embodiment has good electrical conductivity, thermal conductivity and wear resistance.

[0059] The two-dimensional unidirectional conductive wire mesh is obtained by weaving the coated conductive thread with one or more of polyester fiber, acrylic fiber, vinylon fiber, spandex fiber, nylon fiber, etc. in warp and weft directions.

[0060] In a specific embodiment, the diameter of the conductive filament can be selected from 5-300 microns according to the difficulty of preparation and the application scenario, and the diameter of the fiber filament can be selected from 5-500 microns. For example, in t...

Embodiment 3

[0062] Based on the above embodiments, this embodiment discloses a method for preparing an anisotropic conductive bulk material, including the following steps:

[0063] Stack the above-mentioned two-dimensional unidirectional conductive wire mesh and the insulating medium in a specified order, for example, stack them alternately to form a laminated structure, and keep the direction of the conductive wires of each layer of the wire mesh consistent during the finishing process;

[0064] Pressurize and heat the laminated structure, so that the wire mesh and the insulating medium are closely bonded to obtain a unidirectional conductive block.

[0065] Through the above embodiments, an anisotropic conductive bulk material can be obtained.

[0066] In a specific embodiment, the above insulating medium is selected from rubber or resin. The rubber is one or a combination of silicone rubber, butadiene rubber, ethylene propylene rubber, polyurethane rubber, etc. The resin is one or mo...

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Abstract

The invention discloses preparation methods of an anisotropic conductive silk screen, a block and a diaphragm, and a product. The anisotropic electric conduction silk screen is obtained by carrying out net knitting on a conductive wire and an insulating fiber. The anisotropic conductive block is obtained by superposing the silk screen and an insulating medium, and conducting pressing and heating.The anisotropic conductive diaphragm is obtained by carrying out interface slicing on the anisotropic conductive silk screen, carrying out polishing and plating treatment on the end of the conductivewire and carrying out adhesion removal treatment on the surface of the diaphragm. The conductive silk screen manufactured through simple technology is convenient for large-scale manufacturing. The manufactured conductive diaphragm can complete approximately non-damage, high-frequency, high-power and high-efficiency microwave integrated circuit testing. The intermediate products for preparing the diaphragm can be independently used, and convenience is provided for the preparation of subsequent products.

Description

technical field [0001] The invention relates to the field of microwave technology, in particular to a preparation method and products of anisotropic conductive wire mesh, blocks and membranes. Background technique [0002] With the market demand for miniaturization, light weight and multi-functionalization of electronic products, how to quickly and accurately complete the performance test of high-density microwave integrated circuits has become the focus of attention. In the traditional testing method, it is necessary to solder or bond the DUT in package form such as BGA, PGA or QFN on the test board. This method has the following problems: (1) Welding or bonding is a rigid connection, and after the test is passed, it is easy to cause damage to the pad and affect the reliability of the subsequent use process; (2) There are many process steps before and after the test, which consumes The time is long, resulting in low test efficiency. [0003] If the anisotropic elastic con...

Claims

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Application Information

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IPC IPC(8): H01B5/14H01B5/16H01B13/00D04C1/02D04C1/06
CPCD04C1/02D04C1/06D10B2401/16H01B5/14H01B5/16H01B13/00
Inventor 吕英飞刘志辉王辉
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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