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MEMS device, preparation method and electronic device

A technology of electronic devices and devices, which is applied in the direction of microelectronic microstructure devices, manufacturing microstructure devices, microstructure devices, etc., can solve the problems of device performance and yield decline, MEMS devices cannot be packaged, and contact pads fall off, etc., to achieve The effect of improving performance and yield

Inactive Publication Date: 2019-07-09
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the phenomenon that the contact pads fall off usually occurs in the device, so that the MEMS device cannot be packaged, and the performance and yield of the device are greatly reduced.

Method used

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  • MEMS device, preparation method and electronic device
  • MEMS device, preparation method and electronic device
  • MEMS device, preparation method and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Reference below figure 2 with Figure 3A-3B The preparation method of the MEMS device of the present invention is described in detail, figure 2 Shows a process flow chart of the preparation of the MEMS device of the present invention; Figure 3A-3B The structure of a MEMS device in an embodiment of the present invention is shown.

[0055] Among them, such as figure 2 As shown, the main steps of the preparation method include:

[0056] Step S1: Provide a MEMS substrate;

[0057] Step S2: forming a MEMS element on the MEMS substrate, wherein the MEMS element includes a functional material layer;

[0058] Step S3: forming contact pads on the functional material layer to be electrically connected to the functional material layer and used as an external connection during packaging;

[0059] Step S4: Perform a buffer etching step in a mixed solution of buffer etching solution and fatty alcohol to form a cavity in the MEMS element.

[0060] Hereinafter, specific implementations of the...

Embodiment 2

[0146] The invention also provides a MEMS device, such as Figure 3B As shown, the MEMS device in the present invention includes:

[0147] MEMS substrate;

[0148] The MEMS element is formed on the MEMS substrate, wherein the MEMS element includes a functional material layer;

[0149] The contact pad is electrically connected to the functional material layer and used as an external connection during packaging.

[0150] The contact pad includes a Cr layer and an Au layer arranged in sequence.

[0151] The MEMS element includes a MEMS microphone, and the MEMS microphone includes:

[0152] Vibrating membrane 303;

[0153] The cavity is located between the vibrating membrane and the back plate;

[0154] Sound holes 306, a number of the sound holes are spaced apart from each other and penetrate the back plate and expose the vibrating membrane;

[0155] The blocking structure 307 is embedded in the surface of the back plate facing the cavity, and the blocking member extends toward the vibrating ...

Embodiment 3

[0173] The present invention also provides an electronic device, which includes the MEMS device described in the second embodiment or the MEMS device prepared by the method described in the first embodiment.

[0174] The electronic device can be any electronic product or equipment such as mobile phone, tablet computer, notebook computer, netbook, game console, TV, VCD, DVD, navigator, camera, camcorder, voice recorder, MP3, MP4, PSP, etc., or It is an intermediate product with the above-mentioned MEMS devices, such as a mobile phone motherboard with the integrated circuit.

[0175] Since the included MEMS device has higher performance, the electronic device also has the above advantages.

[0176] among them, Figure 4 An example of a mobile phone handset is shown. The mobile phone handset 400 is provided with a display portion 402 included in a housing 401, operation buttons 403, an external connection port 404, a speaker 405, a microphone 406, and the like.

[0177] The electronic d...

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Abstract

The invention provides an MEMS device, a preparation method and an electronic device. The method comprises the following steps: providing an MEMS substrate; forming a MEMS element on the MEMS substrate, the MEMS element comprising a functional material layer; forming a contact pad on the functional material layer to be electrically connected with the functional material layer and used as an external connection during packaging; and performing a buffer etching step in a mixed solution of a buffer etchant and a fatty alcohol to form a cavity in the MEMS element. In order to avoid the phenomenonthat the contact pad falls off, the etching solution is improved, the etching solution comprises the buffer etching solution and the fatty alcohol, the contact pad is prevented from being etched and falling off through improvement of the etching solution, and the performance and the yield of the MEMS device are further improved.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, in particular to a MEMS device, a preparation method and an electronic device. Background technique [0002] With the continuous development of semiconductor technology, in the market of motion sensor products, smart phones, integrated CMOS and micro-electromechanical systems (MEMS) devices have increasingly become the most mainstream and advanced technologies, and with technological updates, The development direction of this kind of transmission sensor products is smaller size, high-quality electrical performance and lower loss. [0003] Among them, MEMS sensors are widely used in automotive electronics: such as TPMS, engine oil pressure sensors, automotive brake system air pressure sensors, automotive engine intake manifold pressure sensors (TMAP), diesel common rail pressure sensors; consumer electronics: such as tire pressure gauges , Sphygmomanometer, cabinet scale, health scale, pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B81B7/02
CPCB81C1/00539B81B7/02B81C2201/0133B81B2201/0257
Inventor 毛文行肖方罗仕洲
Owner SEMICON MFG INT (SHANGHAI) CORP
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