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Urea-formaldehyde resin adhesive with ultralow free formaldehyde content and preparation method thereof

A technology of free formaldehyde content and urea-formaldehyde resin, which is applied in the preparation of urea-formaldehyde resin adhesives and the field of urea-formaldehyde resin adhesives with ultra-low free formaldehyde content, can solve the problems of formaldehyde release, improve production efficiency, use convenience, reduce The effect of energy efficiency

Inactive Publication Date: 2019-07-09
永隆高新科技(青岛)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even traditional wood-based panels with an environmental protection rating as high as E0 have formaldehyde release

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A urea-formaldehyde resin adhesive with ultra-low free formaldehyde content, the formulation is as follows: the molar ratio of formaldehyde to urea is 1.4; the mass percentage of 37% liquid formaldehyde to polyoxymethylene is 100:32; hexamethylenetetramine is 0.8 % (accounting for glue); triethanolamine is 11% (accounting for hexamethylenetetramine); boric acid is 0.12% (accounting for glue); melamine is 18% (accounting for urea); the concentration of sodium hydroxide is 20%, chlorine The concentration of ammonium chloride was 20%, which was used to adjust the pH value.

[0041] The present invention also provides a method for preparing a urea-formaldehyde resin binder with ultra-low free formaldehyde content, comprising the steps of:

[0042] Step 1: Add a total amount of 92% liquid formaldehyde to the reactor, then triethanolamine, then add polyoxymethylene and urea accounting for 50% of the total amount, and adjust the pH value to 9.4-9.8 with 20% sodium hydroxide; ...

Embodiment 2

[0050] A urea-formaldehyde resin adhesive with ultra-low free formaldehyde content, the formulation is as follows: the molar ratio of formaldehyde to urea is 1.1; the mass percentage of 37% liquid formaldehyde to polyoxymethylene is 100:15; hexamethylenetetramine is 0.8 % (accounting for glue); triethanolamine is 3% (accounting for hexamethylenetetramine); boric acid is 0.06% (accounting for glue); melamine is 8% (accounting for urea); the concentration of sodium hydroxide is 20%, chlorine The concentration of ammonium chloride was 20%, which was used to adjust the pH value.

[0051] The present invention also provides a method for preparing a urea-formaldehyde resin binder with ultra-low free formaldehyde content, comprising the steps of:

[0052] Step 1: Add a total amount of 92% liquid formaldehyde to the reactor, then triethanolamine, then add polyoxymethylene and urea accounting for 50% of the total amount, and adjust the pH value to 9.4-9.8 with 20% sodium hydroxide;

...

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PUM

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Abstract

The invention discloses a urea-formaldehyde resin adhesive with an ultralow free formaldehyde content. The urea-formaldehyde resin adhesive comprises the following formula: the molar ratio of formaldehyde to urea is 1.05-1.48, the mass percentage of 37% liquid formaldehyde to polyformaldehyde is 100:(15-40), hexamethylenetetramine accounts for 0.5-2% of a glue solution, triethanol amine accounts for 2-12% of hexamethylene tetramine, boric acid accounts for 0.05-0.15% of the glue solution, melamine accounts for 3-20% of urea, the concentration of sodium hydroxide is 20%, the concentration of ammonium chloride is 20%, and a proper amount of sodium hydroxide and ammonium chloride are used for maintaining a certain pH range. According to the invention, the problems of easy glue permeation, lowcuring speed and the like of common urea-formaldehyde resin in hot-pressing lamination of solid wood veneers are solved, the hot pressing period is shortened, production efficiency is improved, use is convenient, the content of free aldehyde in the production environment is smaller than 0.5 mg / m<3> (MAC), vacuum dehydration is not needed during production of the high-solid-content adhesive, no wastewater is discharged, production is more environmentally friendly, and energy efficiency is reduced.

Description

technical field [0001] The invention belongs to the field of industrialized production and application of urea-formaldehyde adhesives, and more specifically relates to a urea-formaldehyde resin adhesive with ultra-low free formaldehyde content. At the same time, the invention also relates to a preparation method of a urea-formaldehyde resin binder with ultra-low free formaldehyde content. Background technique [0002] Urea-formaldehyde resin adhesive is a composite material with excellent performance. It has a history of more than 70 years since its production and application in the 1930s. As an adhesive, urea-formaldehyde resin has the characteristics of easy-to-obtain raw materials, low cost, and good gluing performance. It accounts for more than 80% of the total use in wood adhesives and occupies a very important position. With the rapid development of the wood industry and the improvement of people's living standards, higher requirements have been put forward for urea-f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/30C08G12/38
CPCC08G12/38C09J161/30
Inventor 朱金水
Owner 永隆高新科技(青岛)有限公司
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