Vacuum coating method for compounding combined magnetic field and lining bias-voltage tapered tube

Abstract

The invention discloses a vacuum coating method for compounding a combined magnetic field and a lining bias-voltage tapered tube, belongs to the technical field of material surface treatment, and solves the problems of the pollution of the film, the target use restriction, the loss of the magnetic filtered arc plasma and the instability of high-power pulse magnetic-controlled sputtering discharging due to macroparticles in the arc ion plating. The vacuum coating device comprises a bias-voltage power supply, an arc ion plating target source, an arc ion plating power supply, a multi-stage magnetic field device, a multi-stage magnetic field device power supply, a lining bias-voltage tapered tube device, a lining bias-voltage power supply, an movable coil device, an movable coil device power supply, a waveform matching device, a twin-target high-power pulse magnetic-controlled sputtering target source, a twin-target high-power pulse magnetic-controlled sputtering power supply and the like.The vacuum coating method comprises the steps that the film is deposited, the device is connected, the system is started, when the vacuum degree in the vacuum chamber is less than 10 <-4>Pa, the working gas is fed, the coating power supply is started, the bias-voltage power supply adjusts the energy of the plasma, the multi-stage magnetic field device and the movable coil device eliminate the macroparticles defects and guide the transmission of the compound plasma, the loss in the vacuum chamber is reduced, and the preparation process parameters are set.

Description

technical field [0001] The invention relates to a vacuum coating method in which a combined magnetic field is compounded with a lining bias conical tube, and belongs to the technical field of material surface treatment. Background technique [0002] In the process of preparing thin films by arc ion plating, due to the arc spot current density as high as 2.5~5×10 10 A / m 2 , causing molten liquid metal to appear at the arc spot position on the target surface, which is splashed out in the form of droplets under the action of local plasma pressure, and adheres to the surface of the film or is embedded in the film to form "macroparticles" (Macroparticles) Defects (BoxmanR L, Goldsmith S. Macroparticle contamination in cathodic arc coatings: generation, transport and control [J]. Surf Coat Tech, 1992, 52(1): 39-50.). In the arc plasma, since the movement speed of electrons is much greater than that of ions, the number of electrons reaching the surface of large particles per unit...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of low ionization rate and thin film deposition efficiency of traditional magnetron sputtering technology, the limitation of high melting point target material use, and the current high-power pulse magnetron sputtering. The plating method uses high melting point targets, low melting point pure metals (such as aluminum, tin) or multi-element alloy materials (such as AlSi alloys) and non-metallic materials (such as graphite and semiconductor materials Si) as targets that are prone to large particle defects, bending Low efficiency of arc plasma transmission caused by type magnetic filter technology, limitation of target element usage and uniform ablation, thin film deposition density and defects, deposition position limitation caused by vacuum chamber space and target source layout design, workpiece shape limitation and different target In order to solve problems such as contamination of film components caused by secondary sputtering of residues in multi-level magnetic field devices, pure metals with low melting points (such as aluminum, tin) or multi-element alloy materials (such as AlSi alloys) and non-metallic materials (such as graphite and Semiconductor material Si, etc.) as the target material of high-power pulsed magnetron sputtering, and then use the arc ion plating method to realize the high melting point refractory target material to produce continuous and stable plasma with high ionization rate, combined with multi-level magnetic field filtering method and The shape constraints of the lined bias conical tube device and the complex effect of the bias electric field attraction eliminate the large particle defects contained in the arc plasma, and at the same time ensure that the arc plasma passes through the lined bias cone with high transmission efficiency Shaped tube device and multi-stage magnetic field filter device, and then use the combined effect of the magnetic field confinement of the movable coil device and the self-bias electric field attraction to eliminate the arc plasma transmitted from the multi-stage magnetic field device and the lined bias conical tube device At the same time, the moving coil device is used to control the transmission direction of the composite plasma of twin target high-power pulse magnetron sputtering and arc ion plating in the vacuum chamber, so as to realize the film deposition on the surface of the substrate workpiece at any position in the vacuum chamber And the control and adjustment of film composition, reduce the loss of compound plasma in the vacuum chamber, overcome the problem of uneven film deposition caused by the limitation of the position of the vacuum chamber and the target source or the limitation of the substrate shape, and completely eliminate the bias from the multi-level magnetic field device and the lining. Large particle defects may remain in the arc plasma transmitted from the conical tube device, so that the surface of the workpiece can adjust the ion energy under the condition of applying a negative bias voltage, and the bias electric field suppression effect on the surface of the substrate can be used to remove the arc plasma. To prepare continuous, dense and high-quality films, and at the same time realize the control of the content of target elements in the film, reduce the production cost of using alloy targets, improve the transmission efficiency of plasma, increase the deposition speed of films, and reduce or even eliminate large particles. Adverse effects of particle defects on thin film microstructure, continuous dense deposition and service performance, a vacuum coating method combined with a magnetic field and a lined biased conical tube is proposed

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