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Vacuum film plating method with combined magnetic field, lined bias voltage cone-shaped tube and straight tube combined

A vacuum coating and tapered tube technology, which is applied in vacuum evaporation coating, sputtering coating, ion implantation coating, etc., can solve the problems of film component pollution, large particle defects, low film deposition efficiency, etc., to ensure uniform performance, and the effect of improving utilization efficiency

Pending Publication Date: 2019-07-09
魏永强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of low ionization rate and thin film deposition efficiency of traditional magnetron sputtering technology, the limitation of high melting point target material use, and the current high-power pulse magnetron sputtering. The plating method uses high melting point targets, low melting point pure metals (such as aluminum, tin) or multi-element alloy materials (such as AlSi alloys) and non-metallic materials (such as graphite and semiconductor materials Si) as targets that are prone to large particle defects, bending Low efficiency of arc plasma transmission caused by type magnetic filter technology, limitation of target element usage and uniform ablation, thin film deposition density and defects, deposition position limitation caused by vacuum chamber space and target source layout design, workpiece shape limitation and different target In order to solve problems such as contamination of film components caused by secondary sputtering of residues in multi-level magnetic field devices, pure metals with low melting points (such as aluminum, tin) or multi-element alloy materials (such as AlSi alloys) and non-metallic materials (such as graphite and Semiconductor material Si, etc.) as the target material of high-power pulsed magnetron sputtering, and then use the arc ion plating method to realize the high melting point refractory target material to produce continuous and stable plasma with high ionization rate, combined with multi-level magnetic field filtering method and The shape constraints of the lined bias tapered tube and the straight tube combination device and the composite effect of the bias electric field attraction eliminate the large particle defects contained in the arc plasma, and at the same time ensure that the arc plasma passes through the inner tube with high transmission efficiency. The combined device of the lined bias conical tube and the straight tube and the multi-stage magnetic field filter device, and then use the combined effect of the magnetic field confinement of the movable coil device and the self-bias electric field attraction to eliminate the interference from the multi-stage magnetic field device and the lined bias conical tube. The large particle defects contained in the arc plasma transmitted by the combined device of the tube and the straight tube, and the moving coil device is used to control the transmission direction of the composite plasma of the twin target high-power pulse magnetron sputtering and arc ion plating in the vacuum chamber, Realize the control and adjustment of film deposition and film composition on the surface of the substrate workpiece at any position in the vacuum chamber, reduce the loss of composite plasma in the vacuum chamber, and overcome the problem of uneven film deposition caused by the limitation of the position of the vacuum chamber and the target source or the limitation of the shape of the substrate. Thoroughly remove the large particle defects that may remain in the arc plasma transmitted from the multi-stage magnetic field device and the lined bias conical tube and straight tube combination device, so that the ion energy can be adjusted on the surface of the workpiece under the condition of negative bias , use the bias electric field suppression effect on the surface of the substrate to remove large particle defects in the arc plasma, prepare continuous and dense high-quality films, and at the same time realize the control of the content of target elements in the film, reduce the production cost of using alloy targets, and improve For the transmission efficiency of plasma, increasing the deposition rate of thin films and reducing or even eliminating the adverse effects of large grain defects on thin film microstructure, continuous dense deposition and service performance, a combination magnetic field and liner biased conical and straight pipes are proposed Composite vacuum coating method

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  • Vacuum film plating method with combined magnetic field, lined bias voltage cone-shaped tube and straight tube combined
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  • Vacuum film plating method with combined magnetic field, lined bias voltage cone-shaped tube and straight tube combined

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specific Embodiment approach 1

[0025] Specific implementation mode one: the following combination Figure 1-6 Describe this embodiment. In this embodiment, a vacuum coating method in which a combined magnetic field is combined with a lined bias conical tube and a straight tube is used. The device used includes a bias power supply (1), an arc power supply (2), and an arc ion plating target source. (3), twin target high power pulse magnetron sputtering power supply (4), twin target high power pulse magnetron sputtering target source (5), bias power waveform oscilloscope (6), twin target high power pulse magnetron sputtering Radio source waveform oscilloscope (7), waveform synchronous matching device (8), movable coil device (9), movable coil device power supply (10), rheostat device (11), multi-level magnetic field device (12), multi-level magnetic field device power supply (13), liner bias tapered tube and straight tube combination device (14), liner bias power supply (15), sample stage (16) and vacuum chamb...

specific Embodiment approach 2

[0044] Embodiment 2: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum coating method in which the lining bias conical tube and the straight tube are combined, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (12), turns on the lining bias power supply (15), adjusts the bias voltage of the liner bias conical tube and straight tube combination device (14), and turns on the movable coil device power supply (10 ) Adjust the movable coil device (9), adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously , the period of the output pulse of the twin target high-power pulse magnetron sputtering power supply (4) is an integer multiple of th...

specific Embodiment approach 3

[0045] Embodiment 3: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum coating method in which the lining bias conical tube and the straight tube are combined, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (12), turns on the lining bias power supply (15), adjusts the bias voltage of the liner bias conical tube and straight tube combination device (14), and turns on the movable coil device power supply (10 ) Adjust the movable coil device (9), adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously , the twin target high-power pulse magnetron sputtering power supply (4) outputs high-power pulses and the bias pulse waveform output b...

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Abstract

The invention discloses a vacuum film plating method with a combined magnetic field, a lined bias voltage cone-shaped tube and a straight tube combined, and belongs to the technical field of materialsurface treatment. The vacuum film plating method with the combined magnetic field, the lined bias voltage cone-shaped tube and the straight tube combined aims to solve the problems such as the pollution of macroparticles to a thin film, the use limitation of a target material, the loss of magnetically-filtered arc plasma and the instability of high-power pulsed magnetron sputtering discharge in arc ion plating. Devices relating to the vacuum film plating method comprise an arc ion plating target source, a multistage magnetic field device, a combined device of the lined bias voltage cone-shaped tube and the straight tube, a twin target high-power pulsed magnetron sputtering target source, a movable coil device, related power sources, a waveform matching device, a bias voltage power source,a sample table and a vacuum chamber. Thin film deposition comprises the steps that the devices are connected; a system is started; when the vacuum degree in the vacuum chamber is less than 10<-4> Pa,a working gas is introduced into the vacuum chamber, a film plating power source is started, the bias voltage power source adjusts the energy of the plasma, the multistage magnetic field device and the movable coil device eliminate defects of the macroparticles and guide the transmission of the composite plasma, the loss in the vacuum chamber is reduced, and technical parameters are set.

Description

technical field [0001] The invention relates to a vacuum coating method in which a combined magnetic field is combined with an inner-lined bias conical tube and a straight tube, and belongs to the technical field of material surface treatment. Background technique [0002] In the process of preparing thin films by arc ion plating, due to the arc spot current density as high as 2.5~5×10 10 A / m 2 , causing molten liquid metal to appear at the arc spot position on the target surface, which is splashed out in the form of droplets under the action of local plasma pressure, and adheres to the surface of the film or is embedded in the film to form "macroparticles" (Macroparticles) Defects (BoxmanR L, Goldsmith S. Macroparticle contamination in cathodic arc coatings: generation, transport and control [J]. Surf Coat Tech, 1992, 52(1): 39-50.). In the arc plasma, since the movement speed of electrons is much greater than that of ions, the number of electrons reaching the surface of ...

Claims

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Application Information

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IPC IPC(8): C23C14/32C23C14/35C23C14/54
CPCC23C14/325C23C14/352C23C14/3485C23C14/54
Inventor 魏永强王好平宗晓亚侯军兴蒋志强
Owner 魏永强
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