Vacuum film plating method with combined magnetic field, lined bias voltage cone-shaped tube and straight tube combined
A vacuum coating and tapered tube technology, which is applied in vacuum evaporation coating, sputtering coating, ion implantation coating, etc., can solve the problems of film component pollution, large particle defects, low film deposition efficiency, etc., to ensure uniform performance, and the effect of improving utilization efficiency
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specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination Figure 1-6 Describe this embodiment. In this embodiment, a vacuum coating method in which a combined magnetic field is combined with a lined bias conical tube and a straight tube is used. The device used includes a bias power supply (1), an arc power supply (2), and an arc ion plating target source. (3), twin target high power pulse magnetron sputtering power supply (4), twin target high power pulse magnetron sputtering target source (5), bias power waveform oscilloscope (6), twin target high power pulse magnetron sputtering Radio source waveform oscilloscope (7), waveform synchronous matching device (8), movable coil device (9), movable coil device power supply (10), rheostat device (11), multi-level magnetic field device (12), multi-level magnetic field device power supply (13), liner bias tapered tube and straight tube combination device (14), liner bias power supply (15), sample stage (16) and vacuum chamb...
specific Embodiment approach 2
[0044] Embodiment 2: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum coating method in which the lining bias conical tube and the straight tube are combined, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (12), turns on the lining bias power supply (15), adjusts the bias voltage of the liner bias conical tube and straight tube combination device (14), and turns on the movable coil device power supply (10 ) Adjust the movable coil device (9), adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously , the period of the output pulse of the twin target high-power pulse magnetron sputtering power supply (4) is an integer multiple of th...
specific Embodiment approach 3
[0045] Embodiment 3: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum coating method in which the lining bias conical tube and the straight tube are combined, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (12), turns on the lining bias power supply (15), adjusts the bias voltage of the liner bias conical tube and straight tube combination device (14), and turns on the movable coil device power supply (10 ) Adjust the movable coil device (9), adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously , the twin target high-power pulse magnetron sputtering power supply (4) outputs high-power pulses and the bias pulse waveform output b...
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