Vacuum plating method adopting combination of composite magnetic field and lining porous baffle
A porous baffle and vacuum coating technology, applied in the field of material surface treatment, can solve the problems of film component pollution, large particle defects, low film deposition efficiency, etc., and achieve the effect of ensuring uniformity and improving utilization efficiency.
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specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination Figure 1-6 Describe this embodiment, the device used in this embodiment is a vacuum coating method combined with a combined magnetic field and a lining porous baffle, including a bias power supply (1), an arc power supply (2), an arc ion plating target source (3), twin Target high-power pulse magnetron sputtering power supply (4), twin target high-power pulse magnetron sputtering target source (5), bias power supply waveform oscilloscope (6), twin target high-power pulse magnetron sputtering power supply waveform oscilloscope ( 7), waveform synchronous matching device (8), movable coil device (9), movable coil device power supply (10), rheostat device (11), multi-level magnetic field device (12), multi-level magnetic field device power supply (13), internal Lining bias porous baffle device (14), lining bias power supply (15), sample stage (16) and vacuum chamber (17);
[0026] In this device:
[0027]The wor...
specific Embodiment approach 2
[0044] Specific Embodiment 2: The difference between this embodiment and Embodiment 1 is that a vacuum coating method in which a combined magnetic field is combined with a lining porous baffle is connected, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply (5) is turned on. Adjust the multi-stage magnetic field device (12), turn on the lining bias power supply (15) to adjust the bias voltage of the lining bias porous baffle device (14), turn on the movable coil device power supply (10) to adjust the movable coil device (9), Adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the twin target high-power pulse magnetron sputtering power supply (4) The period of the output pulse of the radio source (4) is an integer multiple of the output pulse of ...
specific Embodiment approach 3
[0045] Embodiment 3: The difference between this embodiment and Embodiment 1 is that a combination of magnetic field and lining porous baffle is connected by a vacuum coating method, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply (5) is turned on. Adjust the multi-stage magnetic field device (12), turn on the lining bias power supply (15) to adjust the bias voltage of the lining bias porous baffle device (14), turn on the movable coil device power supply (10) to adjust the movable coil device (9), Adjust the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the twin target high-power pulse magnetron sputtering power supply (4) The phase of the high-power pulse output by the radio source (4) and the bias pulse waveform output by the bias power source ...
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