Vacuum plating method adopting combination of composite magnetic field, lining ladder pipe and porous baffle
A porous baffle, vacuum coating technology, applied in vacuum evaporation coating, sputtering coating, ion implantation coating and other directions, can solve the problems of film component pollution, large particle defects, low film deposition efficiency, etc., to ensure uniformity the effect of improving the utilization efficiency
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specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination Figure 1-6Describe this embodiment. In this embodiment, a device used in a vacuum coating method that combines a magnetic field with a lined stepped tube and a porous baffle includes a bias power supply (1), an arc power supply (2), and an arc ion plating target source (3 ), twin target high power pulse magnetron sputtering power supply (4), twin target high power pulse magnetron sputtering target source (5), bias power waveform oscilloscope (6), twin target high power pulse magnetron sputtering power supply Waveform oscilloscope (7), waveform synchronous matching device (8), movable coil device (9), movable coil device power supply (10), rheostat device (11), multi-level magnetic field device (12), multi-level magnetic field device power supply (13 ), lined bias ladder tube and porous baffle combined device (14), lined bias power supply (15), sample stage (16) and vacuum chamber (17);
[0026] In this device...
specific Embodiment approach 2
[0044] Embodiment 2: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with the vacuum coating method of lining the stepped tube and the porous baffle, and the arc power supply (2) is turned on, and the multi-stage magnetic field power supply is turned on. (5) Adjust the multi-level magnetic field device (12), turn on the lining bias power supply (15), adjust the bias voltage of the lining bias stepped tube and porous baffle combination device (14), turn on the movable coil device power supply (10) to adjust The movable coil device (9) adjusts the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the twin target The period of the output pulse of the target high-power pulse magnetron sputtering power supply (4) is an integer multiple of t...
specific Embodiment approach 3
[0045]Embodiment 3: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum coating method in which the lined stepped tube and the porous baffle are combined, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply is turned on. (5) Adjust the multi-level magnetic field device (12), turn on the lining bias power supply (15), adjust the bias voltage of the lining bias stepped tube and porous baffle combination device (14), turn on the movable coil device power supply (10) to adjust The movable coil device (9) adjusts the output resistance of the rheostat device (10), and the waveform synchronous matching device (8) controls the bias power supply (1) and the twin target high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously, and the twin target The target high-power pulse magnetron sputtering power supply (4) outputs high-power pulses and the bias pulse wavef...
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