Epoxy resin composition, preparing method and application thereof and aluminum base copper-clad plate

A technology of epoxy resin and solid epoxy resin, applied in epoxy resin glue, chemical instruments and methods, adhesive types, etc., can solve the problems of poor heat resistance and poor heat dissipation performance

Active Publication Date: 2019-07-30
GOLDENMAX TECH HANGZHOU CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the defects of poor heat dissipation performance and poor heat resistance of aluminum-based copper-clad laminates in the prior art, and provide an epoxy resin composition, its preparation method and application, and aluminum-based copper-clad laminates.

Method used

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  • Epoxy resin composition, preparing method and application thereof and aluminum base copper-clad plate
  • Epoxy resin composition, preparing method and application thereof and aluminum base copper-clad plate
  • Epoxy resin composition, preparing method and application thereof and aluminum base copper-clad plate

Examples

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preparation example Construction

[0102] (1) The preparation method of epoxy resin glue:

[0103] Mix the ratio of raw materials shown in Table 1-1 and Table 1-2 as follows:

[0104] ①Add dimethylformamide, methyl ethyl ketone, and acetone into the dissolution kettle, add diaminodiphenyl sulfone under stirring, and stir for about 30-60 minutes until the solution is uniform and transparent;

[0105] ② Add other raw materials to the solution in ① according to the mass ratio shown in Table 1, and mix them with a high-shear mixer emulsifier at a speed of 5000 rpm for 5-10 minutes to prepare epoxy resin glue.

[0106] The epoxy resin glue system prepared in Examples 1-4 is uniformly dispersed without agglomeration and settlement.

[0107] (2) Preparation method of double-sided aluminum-based copper clad laminate:

[0108] ① Preparation of glue-coated copper foil: Take the epoxy resin glue prepared in Examples 1-4 and Comparative Examples 1-13, and evenly coat the rough surface of the electrolytic copper foil, and...

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Abstract

The invention discloses an epoxy resin composition, a preparing method and application thereof and an aluminum base copper-clad plate. The composition is prepared from solid epoxy resin, liquid epoxyresin, a flexibilizer, a curing agent, a curing accelerator, an inorganic filler, a solvent, tetrapod-like zinc oxide whiskers, a bisphenol A poly(ether-ester) blocked epoxy resin polymers and polycarboxylic acid polymers. The epoxy resin composition has good heat resistance, thermal conductivity and electric insulativity. The two-sided aluminum base copper-clad plate prepared by means of the epoxy resin composition has good heat resistance, the thermal conductivity and electric insulativity are significantly improved, the thermal conductivity coefficient can be up to 2.3 W/m.K, the safety ofan LED product is effectively guaranteed, and the service life is effectively prolonged.

Description

technical field [0001] The invention relates to an epoxy resin composition, a preparation method and application thereof, and an aluminum-based copper-clad laminate. Background technique [0002] With the maturity of LED manufacturing technology, the luminous brightness of LED has been greatly improved, the lifespan has been greatly improved, and the production cost has been greatly reduced, making LED lighting widely popular and becoming the main lighting method to replace traditional light sources such as incandescent lamps. The photoelectric conversion efficiency of high-power LEDs is low, and about 80% of the input electrical energy is converted into heat. Due to the small area of ​​the LED chip, if the heat generated cannot be dissipated in time, the luminous efficiency will drop sharply, and the lifespan will also drop rapidly. Therefore, the heat dissipation of high-power LEDs is a problem that must be solved. [0003] Aluminum-based copper-clad laminates are compos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L13/00C08K13/04C08K7/08C08K3/22C08K5/5435C09J163/00C09J11/04C09K5/14B32B15/20B32B7/12B32B15/01B32B7/08B32B33/00B32B37/12B32B38/00B32B37/06B32B37/10F21V29/508F21V29/89F21Y115/10
CPCC08L63/00C09J163/00C09J11/04C09K5/14B32B15/20B32B7/12B32B15/01B32B7/08B32B33/00B32B37/12B32B38/0036B32B37/06B32B37/10F21V29/508F21V29/89C08K2003/2227C08K2003/222C08L2201/08C08L2205/025C08L2205/035B32B2307/306B32B2307/302B32B2307/206F21Y2115/10C08L13/00C08K13/04C08K7/08C08K3/22C08K5/5435
Inventor 李强利郑科民
Owner GOLDENMAX TECH HANGZHOU CO LTD
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