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A kind of high-resistivity high-entropy alloy thin film and its preparation method

A high-entropy alloy and high-resistivity technology, which is applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems that the low resistivity cannot meet the practical application, and achieve fast and convenient adjustment, improve efficiency, The effect of simplifying the production process

Active Publication Date: 2020-08-11
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a high-resistivity high-entropy alloy thin film and its preparation method in order to solve the problem that the existing low resistivity cannot meet the practical application

Method used

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  • A kind of high-resistivity high-entropy alloy thin film and its preparation method
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  • A kind of high-resistivity high-entropy alloy thin film and its preparation method

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Embodiment 1

[0031] A high-resistance high-entropy alloy film, the film contains six elements of iron, cobalt, nickel, aluminum, manganese, and tungsten, and the atomic percentage of the elements is 33:30:16:7:9:5.

[0032] A method for preparing a high-resistance high-entropy alloy thin film, the specific process method is as follows

[0033] 1) The monocrystalline silicon substrate polished on one side was placed in acetone, deionized water and alcohol for 15 minutes in sequence, ultrasonically cleaned for 15 minutes, dried and placed on the sample stage of the radio frequency magnetron sputtering vacuum chamber.

[0034] 2) Prepare corresponding proportions of pure metal fan-shaped targets according to the ratio of the required components. The apex angles of the six element fan-shaped targets of iron, cobalt, nickel, aluminum, manganese, and tungsten are 118.8°, 108°, 57.6°, 25.2°, 32.4°, 18°, assemble it into a complete circular composite target with a diameter of 60mm, and place it on...

Embodiment 2

[0042] A high-resistance high-entropy alloy film, the film contains six elements of iron, cobalt, nickel, aluminum, manganese, and tungsten, and the molar ratio of the elements is 30:30:16:8:10:6.

[0043] A method for preparing a high-resistance high-entropy alloy thin film, the specific process method is as follows

[0044] 1) The monocrystalline silicon substrate polished on one side was placed in acetone, deionized water and alcohol for 15 minutes in sequence, ultrasonically cleaned for 15 minutes, dried and placed on the sample stage of the radio frequency magnetron sputtering vacuum chamber.

[0045] 2) According to the proportion of the required components, prepare the corresponding proportion of pure metal fan-shaped targets. The apex angles of the six element fan-shaped targets of iron, cobalt, nickel, aluminum, manganese, and tungsten are 108°, 108°, 57.6°, 28.8°, 36°, 21.6°, put them together into a complete circular composite target with a diameter of 60mm, and pla...

Embodiment 3

[0052] A high-resistance high-entropy alloy film, the film contains six elements of iron, cobalt, nickel, aluminum, manganese, and tungsten, and the molar ratio of the elements is 33:30:16:7:9:5.

[0053] A method for preparing a high-resistance high-entropy alloy thin film, the specific process method is as follows

[0054] 1) The monocrystalline silicon substrate polished on one side was placed in acetone, deionized water and alcohol for 15 minutes in sequence, ultrasonically cleaned for 15 minutes, dried and placed on the sample stage of the radio frequency magnetron sputtering vacuum chamber.

[0055] 2) Prepare corresponding proportions of pure metal fan-shaped targets according to the ratio of the required components. The apex angles of the six element fan-shaped targets of iron, cobalt, nickel, aluminum, manganese, and tungsten are 118.8°, 108°, 57.6°, 25.2°, 32.4°, 18°, assemble it into a complete circular composite target with a diameter of 60mm, and place it on the t...

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Abstract

The invention relates to a high-resistivity high-entropy alloy film and a preparation method thereof, and belongs to the field of multi-principal-element alloy film materials. The novel high-entropy alloy film component contains six elements of Fe, Co, Ni, Al, Mn and W elements with different proportions, and the atomic percentages are 25%-35%, 25%-35%, 10%-25%, 5%-15%, 5%-15% and 5%-10% respectively. The preparation method comprises the following steps of ultrasonically cleaning a substrate, preparing a composite target, carrying out vacuumizing on a vacuum chamber, filling the vacuum chamberwith argon, carrying out pre-sputtering, heating the substrate and carrying out sputtering. A prepared film sample is smooth in surface, uniform in thickness and fine in structure, and the structureis a single-phase BCC solid solution, and is free of phase separation or intermetallic compound generation. According to the preparation method, the novel magnetic high-entropy alloy film with high hardness and high resistivity can be prepared, the thickness of the novel magnetic high-entropy alloy film is 500-2000 nm, and the highest resistivity is about 1800 microhm . m.

Description

technical field [0001] The invention relates to a high-resistivity high-entropy alloy film and a preparation method thereof, belonging to the field of multi-principal alloy film materials. Background technique [0002] A high-entropy alloy is a new type of alloy with five or more principal elements in approximately equimolar ratios or a configuration entropy greater than 1.6R. Due to its high strength, high wear resistance, high corrosion resistance, high temperature softening resistance, flexible formulation and manufacturing methods, high-entropy alloys can meet a wide range of actual needs and other excellent properties and characteristics, and have become a major field of metal materials. popular directions. [0003] In addition to the characteristics of high-entropy alloys, high-entropy thin films also have the advantages of fine grains down to nanoscale, uniform structure and easy formation of single-phase solid solutions, strong designability, and low cost. At the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/16C23C14/35C22C30/00C23C14/02
CPCC22C30/00C23C14/021C23C14/022C23C14/165C23C14/35
Inventor 程兴旺孙小尧蒋雯王梦徐子祁谭友德张洪梅刘安晋
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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