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A kind of shape memory phenolic resin and preparation method thereof

A technology of phenolic resin and resole phenolic resin, which is applied in the field of shape memory phenolic resin and its preparation, can solve the problems of high brittleness, poor deformation resistance, restricting the development of phenolic resin, etc., and achieves improved toughness and fast shape recovery rate. , the effect of easy availability of raw materials

Active Publication Date: 2021-12-10
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high brittleness and poor deformation resistance of phenolic resins, the further development of phenolic resins is limited.

Method used

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  • A kind of shape memory phenolic resin and preparation method thereof
  • A kind of shape memory phenolic resin and preparation method thereof
  • A kind of shape memory phenolic resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0043] The preparation method of above-mentioned shape memory phenolic resin, comprises the following steps:

[0044] S1, adding a basic catalyst to the molten phenolic compound, stirring evenly, then adding an aldehyde compound, heating and condensing to reflux, and finally vacuuming and dehydrating to obtain a resole phenolic resin;

[0045] S2. Add isocyanopolyurethane prepolymer and curing agent to the resole phenolic resin in sequence, stir evenly, and inject the mixture into a preset mold, heat and solidify in a vacuum heating furnace;

[0046] S3, cooling to room temperature and demoulding to obtain the shape memory phenolic resin.

[0047] Specifically, in step S1, taking the phenolic compound as phenol and the aldehyde compound as formaldehyde as an example, the chemical reaction formula of the reaction is:

[0048]

[0049] In step S1, the basic catalyst includes: one or more of ammonia water, sodium hydroxide, barium hydroxide or aluminum hydroxide. Wherein, th...

Embodiment 1

[0064] This example provides a kind of preparation method of shape memory phenolic resin, specifically carries out according to the following steps:

[0065] 1) Take melted phenol, add it to a three-necked flask, preheat and stir in an oil bath at 55°C; drop ammonia water into the three-necked flask, the molar ratio of ammonia water and phenol is 0.05:1, and heat it at 55°C Stir for 5 minutes; then slowly add formaldehyde solution to the three-necked flask, the molar ratio of formaldehyde solution and phenol is 1:1.6, continue to stir, then raise the temperature to 70°C, keep it warm for 30 minutes, then raise the temperature to 98°C to condense and reflux for 30 minutes, and finally cool naturally Lower the temperature to below 70°C, and vacuum dehydrate to obtain the resole phenolic resin.

[0066] 2) Take 100 parts of resole phenolic resin prepared in step 1), and mix 5 parts of isocyanopolyurethane prepolymer evenly. After stirring for 30 minutes, add 2 parts of curing age...

Embodiment 2

[0068] The difference between this example and the above-mentioned examples is that the preparation method of a shape memory phenolic resin provided in this example is specifically carried out according to the following steps:

[0069] 1) Take melted phenol, add it to a three-necked flask, preheat and stir in an oil bath at 55°C; drop ammonia water into the three-necked flask, the molar ratio of ammonia water and phenol is 0.05:1, and heat it at 55°C Stir at low temperature for 5 minutes; then slowly add formaldehyde solution to the three-necked flask, the molar ratio of formaldehyde solution and phenol is 1:2, continue to stir, then raise the temperature to 70°C, keep it warm for 30 minutes, then raise the temperature to 98°C to condense and reflux for 30 minutes, and finally cool naturally Lower the temperature to below 70°C, and vacuum dehydrate to obtain the resole phenolic resin.

[0070] 2) Take 100 parts of resole phenolic resin prepared in step 1), and mix 5 parts of i...

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Abstract

The invention provides a shape memory phenolic resin and a preparation method thereof. The shape memory phenolic resin comprises, in parts by weight, 100 parts of resole phenolic resin, 5 to 15 parts of isocyanopolyurethane prepolymer, 1 to 15 parts of Hardener. The shape memory phenolic resin provided by the present invention reduces the crosslinking density of the phenolic resin and increases the crosslinking point by introducing a polyurethane flexible segment on the benzene ring and using a longer molecular segment of the polyurethane flexible segment to modify the phenolic resin. The length of the molecular segments in between, so that the molecular structure of the shape memory phenolic resin has two molecular segment structures of hard segment and soft segment, which improves the toughness of the phenolic resin and makes the shape memory phenolic resin have the shape memory effect. be applied in more fields.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a shape memory phenolic resin and a preparation method thereof. Background technique [0002] Shape memory polymer (shape memory polymer, SMP) is a new type of intelligent polymer material. Compared with shape memory alloys and shape memory ceramics, it has the characteristics of low density, large deformation, easy shaping, and adjustable response temperature. When this kind of material is stimulated by temperature, light, electric field, solvent, magnetic field and other environmental stimuli, it can respond accordingly and return to the preset shape. Shape memory polymer not only has a large amount of deformation, is easy to form, and is easy to adjust the shape response temperature, but also has the advantages of heat preservation, good insulation, no rust, easy coloring, printable, light weight and low price, etc. , flexible electronics, optoelectronic products a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/28
CPCC08G8/28
Inventor 冷劲松刘彦菊邓永蝶张风华
Owner HARBIN INST OF TECH
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