Method for preparing high-thermal-conductivity graphene radiating fin

A technology of high thermal conductivity graphite and heat sink, applied in graphene, chemical instruments and methods, modification by conduction and heat transfer, etc. Effect

Active Publication Date: 2019-08-30
DONGXU OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the case of using graphite heat dissipation film in the heat dissipation solution of electronic products, the thermal conductivity of graphite heat dissipation film can only reach about 1500W / m·K, which cannot meet the needs of some high heat dissipation products

Method used

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  • Method for preparing high-thermal-conductivity graphene radiating fin
  • Method for preparing high-thermal-conductivity graphene radiating fin
  • Method for preparing high-thermal-conductivity graphene radiating fin

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preparation example Construction

[0040] In a specific embodiment, refer to figure 1 , the preparation method of the high thermal conductivity graphene heat sink includes the following five steps: the first step is to add graphite oxide to deionized water, then add a dispersant, and prepare an aqueous graphene oxide solution through stirring, oscillation or ultrasonic; the second step In the second step, the polyimide film (PI film) is placed in a carbonization furnace, filled with inert gas, and then subjected to high-temperature carbonization treatment; in the third step, the aqueous graphene oxide solution is coated on the carbonized On the polyimide film, obtain the composite graphene oxide-polyimide film; the 4th step, put described graphene oxide-polyimide film into the graphitization furnace, fill inert gas, then carry out Graphitization treatment; in the fifth step, the film obtained after the graphitization treatment is rolled / calendered to obtain a graphene heat sink.

[0041] In a specific embodime...

Embodiment 1

[0050] Graphite oxide was added to deionized water, then a dispersant was added, and an aqueous graphene oxide solution was prepared by stirring, shaking or ultrasonication, wherein the graphene oxide sheet diameter was 80 μm, and the concentration of the graphene oxide solution was 1 mg / mL. The polyimide film was placed in a carbonization furnace, filled with nitrogen, and carbonized. The carbonization temperature was 1250° C., and the carbonization time was 20 hours. The graphene oxide solution is coated on the carbonized polyimide film by means of transfer coating, and dried. Then put it into a graphitization furnace, fill it with argon gas, and carry out graphitization treatment. The graphitization treatment temperature is 2700° C., and the graphitization treatment time is 48 hours. The above film was rolled to obtain a graphene composite heat sink with a thickness of 10 μm. After testing, the obtained graphene heat sink has a horizontal thermal conductivity of 2265W / m·K....

Embodiment 2

[0052] Set the sheet diameter of graphene oxide to 50 μm, the concentration of graphene oxide solution to 0.5 mg / mL, the carbonization treatment temperature to 600°C, the graphitization treatment temperature to 2200°C, and the coating method to be gravure Printing, the thickness of the obtained graphene composite heat sink was set to 36 μm, except that, a graphene heat sink was prepared in the same manner as in Example 1, and various evaluations were performed. After testing, the obtained graphene heat sink has a horizontal thermal conductivity of 2001W / m·K.

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Abstract

The invention discloses a method for preparing a graphene radiating fin, comprising the steps: adding graphite oxide to deionized water, adding a dispersing agent, and performing stirring, shaking orultrasonicizing to prepare an aqueous graphene oxide solution; placing a polyimide film in a carbonization furnace, introducing an inert gas, and then performing carbonization treatment; coating the carbonized polyimide film with the aqueous graphene oxide solution to obtain a graphene oxide-polyimide film; placing the graphene oxide-polyimide film in a graphitization furnace, introducing an inertgas, and then performing graphitization treatment; and rolling the the film obtained by the graphitization treatment to obtain a graphene radiating fin. According to the invention, a graphene radiating fin with excellent heat dissipation performance can be prepared by adopting a technology of combining graphene oxide with a carbonized polyimide film, the process is easy to control, and the purityis high.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electronic products, in particular to a method for preparing a high thermal conductivity graphene heat sink. Background technique [0002] With the rapid development of modern technology, the miniaturization of electronic devices, the continuous increase of the main frequency of the chip, the increasing function, and the gradual increase of the power consumption of a single chip, all of these lead to a sharp increase in heat flux. For example, current electronic products such as mobile phones and computers have become the necessities of people's life. With the continuous upgrading of hardware, the calculation of the tasks it performs becomes more complex and cumbersome. Core components such as CPU and GPU will face heat problems. The main frequency of the chip increases and the power increases to generate a lot of heat. If the heat cannot be dissipated in time, It will caus...

Claims

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Application Information

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IPC IPC(8): C01B32/19H05K7/20
CPCC01B32/19H05K7/2039C01B2204/24
Inventor 李青孙峰陈韵吉
Owner DONGXU OPTOELECTRONICS TECH CO LTD
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