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Multilayer composite film and application thereof

A technology of multi-layer composite film and fluorescent adhesive layer, applied in the field of fluorescent adhesive film, can solve the problems of LED packaging structure, adverse effects of light extraction efficiency and heat dissipation performance, inconsistent phosphor powder distribution, and need to improve the shelf life, etc., and achieve good fluorescent particle distribution. performance, low cost, and small thickness

Pending Publication Date: 2019-08-30
FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These fluorescent tapes and fluorescent adhesive sheets have the advantages of low cost and easy use, but they also have some defects. For example, it is inevitable to use glue and other substances. Adverse effects on light extraction efficiency and heat dissipation performance
In view of this, the applicant also proposed a fluorescent adhesive film that can be directly combined with LED chips by using its own pressure-sensitive adhesive properties without adhesive substances, etc. After that, there will be problems such as reduced viscosity, and its shelf life needs to be improved
[0004] Furthermore, US2014091346A1 also utilizes lamination to embed LED chips into fluorescent adhesive sheets, but this method will cause inconsistent distribution of phosphor powder on the upper part of the chip and around the chip, resulting in optical imperfections

Method used

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  • Multilayer composite film and application thereof
  • Multilayer composite film and application thereof
  • Multilayer composite film and application thereof

Examples

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preparation example Construction

[0095] In an embodiment of the present invention, a method for preparing the phenylsiloxane epoxy containing multiple silicon-hydrogen bonds or its isomers may include: making the cyclic compound containing multiple vinyl groups , Cyclic compounds containing multiple silicon-hydrogen bonds and compounds containing multiple silicon-hydrogen bonds and phenyl groups undergo hydrosilylation reactions in the presence of catalysts to generate phenylsiloxanes containing six silicon-hydrogen bonds Alkane epoxides or their isomers.

[0096] Preferably, the preparation method specifically includes: mixing a cyclic compound containing multiple vinyl groups, a compound containing multiple silicon-hydrogen bonds and a phenyl group, a cyclic compound containing multiple silicon-hydrogen bonds, a catalyst and an organic solvent After that, it is heated to reflux for hydrosilylation reaction to generate phenylsiloxane epoxy or its isomers containing six silicon-hydrogen bonds.

[0097] Prefe...

Embodiment approach

[0151] In some embodiments, the preparation method of the fluorescent adhesive layer may specifically include:

[0152] S1: film formation, the fluorescent encapsulation composition is formed into a film by means of solution film formation, casting coating, screen / stencil printing, spin coating, (vacuum) extrusion film formation, etc.;

[0153] S2: Preliminary curing to form a non-sticky and peelable pre-cured film, that is, the fluorescent adhesive layer, which has properties similar to pressure-sensitive adhesives.

[0154] In an optional embodiment, the step S2) may include: removing the organic solvent in the film under the conditions of radiation and / or heating and ventilation, so as to form the pre-cured film. The heating temperature adopted may be 20-200° C., preferably 80-120° C., and the heating time is 10-100,000 seconds, preferably 10-8,000 seconds.

[0155] Further, the fluorescent adhesive layer has a certain deformability, especially under certain pressure condi...

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Abstract

The invention discloses a multilayer composite film. The multilayer composite film comprises a fluorescent adhesive layer and a hot-melt material layer, wherein the hot-melt material layer is a fluidafter being molten, and the fluorescent adhesive layer at least can keep the initial physical morphology when the hot-melt material layer is molten into the fluid. The invention also discloses a packaging method of a light emitting semiconductor device. The method comprises steps as follows: the hot-melt material layer in the multilayer composite film is attached to a light emitting surface of thelight emitting semiconductor device. By means of the multilayer composite film, a packaging process of the light emitting semiconductor device is simpler and efficient and particularly suitable for packaging of a Mini LED, the formed light emitting semiconductor device can be more power-saving, thinner, higher in light quality and wider in color gamut, and the multilayer composite film can be flexible, longer in service life and lower in cost.

Description

technical field [0001] The invention relates to a phosphor film (Phosphor Film or Phosphor Sheet) in the field of semiconductors, in particular to a multilayer composite film, which can be used in packaging semiconductor light-emitting elements such as LEDs. Background technique [0002] LED (Semiconductor Light Emitting Diode) is widely used in lighting, backlighting and other fields due to its advantages of low energy consumption, long life, small size and the like. The packaging process is a very important process in the LED manufacturing process, which has a very significant impact on the performance and cost of the LED. [0003] US7294861B, US2014091346A1, etc. have proposed technical solutions for LED packaging using fluorescent tape or fluorescent adhesive sheet. Phosphor powder, fluorescent nanocrystals, etc. are dispersed in these fluorescent tapes and fluorescent adhesive sheets to realize the wavelength conversion of the light emitted by the LED. These fluoresce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/35C09J7/30C09J129/04C09J131/04C09J123/08C09J11/06C09J11/04C09J183/07C09J183/05H01L33/50
CPCC09J7/10C09J7/35C09J7/30C09J129/04C09J11/06C09J11/04C09J183/04H01L33/502H01L33/505C09J2203/326C09J2429/00C09J2431/00C09J2423/04C09J2483/00C08L2205/025C08L2205/03C08L2203/206C09J2301/304C09J2301/408C08L31/04C08L23/0853C08K5/13C08K5/11C08L83/04
Inventor 张汝志陆加林
Owner FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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