Method for 3D printing of catalyst-carrier system with high specific surface area and high efficiency
A high specific surface area, 3D printing technology, applied in the field of additive manufacturing, can solve the problems such as the inability to control the microscopic morphology and pore structure of the carrier material, the lightweight, controllable structure and high specific surface area of the carrier material, etc. The morphology and pore structure are simple and controllable, avoiding structural deformation, and the effect of high specific surface area
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Example Embodiment
[0035] Example one:
[0036] Design the carrier structure through SolidWorks software, the bottom plate is 10*10*0.8mm 3 Square sheet, the designed geometric array unit has a square hole with a side length of 0.8mm and a depth of 0.8mm. The wall thickness between adjacent holes is 0.2mm, such as figure 2 Shown. The slices are sliced through the software bound by the 3D printer manufacturer, the slice thickness is 50μm, and 3 layers of the bottom plate are added, and then imported into the 3D printer. Weigh 50wt.% of alumina powder, 1wt.% of trimethylbenzoyl-diphenyl phosphine oxide, 1wt.% of Triton X-100, 2wt.% of magnesium oxide, 2wt.% of silicon oxide and 16wt.% of sodium chloride. %, mixed with a ball mill for 48h. The obtained powder was added at a rate of 5 g / min to a 30 wt.% light-curable resin stirred at 120 r / min, and stirring was continued for 8 hours to obtain a ceramic slurry. Set the 3D printer parameters as high-level exposure time 6000ms, high-level static time...
Example Embodiment
[0037] Embodiment two:
[0038] Design the carrier structure through SolidWorks software, the base plate is 10*10*0.6mm 3 Square sheet, the designed geometric array unit is a regular quadrangular pedestal with a bottom side length of 0.8mm, a top side length of 0.4mm, and a height of 1mm. The distance between the bottom squares of adjacent pedestals is 0.2mm, such as image 3 Shown. The slices are sliced through the software bound by the 3D printer manufacturer, the slice thickness is 50μm, and 3 layers of the bottom plate are added, and then imported into the 3D printer. Weigh 40wt.% zirconia powder, 2wt.% trimethylbenzoyl-diphenylphosphine oxide, 2wt.% Triton X-100, 2wt.% magnesium oxide, 2wt.% silicon oxide and 12wt.% polyvinyl alcohol. %, mixed by a ball mill for 72h. The obtained powder was added at a rate of 5 g / min to a 40 wt.% photo-curable resin stirred at 180 r / min, and stirring was continued for 10 hours to obtain a ceramic slurry. Set the 3D printer parameters as ...
Example Embodiment
[0039] Embodiment three:
[0040] Design the carrier structure through SolidWorks software, the bottom plate is 10*10*0.8mm 3 Square sheet, the designed geometric array unit is a truncated cone-shaped through hole with a bottom surface diameter of 0.8mm, a top surface diameter of 0.4mm, and a height of 0.8mm. The distance between the bottom centers of adjacent through holes is 1mm, such as Figure 4 Shown. The slices are sliced through the software bound by the 3D printer manufacturer, the slice thickness is 50μm, and 3 layers of the bottom plate are added, and then imported into the 3D printer. Weigh trimethylbenzoyl-diphenyl phosphine oxide 2wt.%, Triton X-100 1wt.%, magnesium oxide 2wt.%, silicon oxide 2wt.% and sodium bicarbonate 8wt.%, and mix for 48h with a ball mill . The obtained powder was added to 55wt.% liquid polycarbosilane and 30wt.% light-curable resin stirred at 120r / min at a rate of 5g / min, and continuously stirred for 8h to obtain ceramic slurry. Set the 3D ...
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