Polymer thermal conductive film containing uniformly dispersed and highly oriented graphene and preparation method thereof

Abstract

The invention relates to the technical field of performance enhancing and functionalization of carbon nanocomposite materials, in particular to a polymer thermal conductive film containing uniformly dispersed and highly oriented graphene and a preparation method thereof. The thermal conductive film material is composed of the following components: a polymer matrix, graphene, second thermal conductive filler, a surface treatment agent, a filler coating agent and a processing aid. A technical route combining "high shear melting dispersion" and "high stretching" is employed to promote the uniformdispersion of graphene nanosheets and other thermal conductive filler in the polymer matrix and the acquisition of high orientation, graphene itself is utilized to construct a long-range continuous and three-dimensional hybrid thermal conductive network structure, thus overcoming the anisotropy of graphene, and constructing a stable and effective thermal conductive network.

Description

technical field [0001] The invention relates to a polymer heat-conducting film, in particular to a polymer heat-conducting film containing uniformly dispersed and highly oriented graphene and a preparation method thereof. Background technique [0002] Due to their versatility and ease of processing, thermally conductive polymer materials play an increasingly important role in applications such as thermal management in modern electrical systems and electronic devices. Polymer materials have excellent electrical insulation properties, flexibility, and design freedom, and are increasingly used in electronic packaging and other fields, but their poor intrinsic thermal conductivity limits their applicability in thermal management. One of the urgent problems to be solved. With the rapid evolution of the performance of electrical systems and electronic devices, traditional polymer composite materials can no longer meet many high requirements for thermal management, such as molding...

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Problems solved by technology

[0007] (1) Poor filler-matrix affinity: thermally conductive fillers have poor compatibility with the polymer matrix, weak interfacial bonding, and are difficult to disperse in the matrix, which has become the main obstacle to improving thermal conductivity, especially the construction of a perfect thermal conduction path requires a large amount of thermally conductive fillers in the case of

[0008] (2) It is difficult to meet the multifunctional requirements: high-end applications put forward an urgent need for multiple functions of thermal conductive films. Electromagnetic interference, the development of packaging materials with electromagnetic shielding effect is an important direction of current research

[0009] (3) Poor heat resistance: In many application scenarios such as power LEDs and flexible heating devices, a lot of heat will be generated, and the heat is easy to accumulate and cause overheating

However, limited by the low heat dissipation capacity and poor heat resistance of the polymer matrix, the composite film is prone to local high temperature and burnt

[0010] (4) Poor fatigue resistance: flexible electronic devices, that is, devices that can function normally during and after bending, electrode materials used in flexible electronic devices are prone to material fatigue, resulting in attenuation of mechanical and electrical properties, and the final device The performance cannot be performed normally and the service life is shortened

[0011] (5) Poor processability: When using traditional thermally conductive fillers (such as alumina and boron nitride), the required addition amount is often high (generally greater than 30 vol%), which easily leads to serious deterioration of the mechanical properties and processability of composite materials

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