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A kind of ultra-thin electrolytic copper foil and its preparation method

An electrolytic copper foil, ultra-thin technology, applied in the field of electrolytic copper foil, can solve problems such as the difficulty in preparing ultra-thin copper foil, and achieve the effect of facilitating large-scale industrial production, good tensile strength and flatness, and simple process

Active Publication Date: 2021-07-20
HUBEI ZHONGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an ultra-thin electrolytic copper foil and its preparation method, which is used to solve the problem that the electrolytic copper foil process is difficult to prepare in the prior art and the ultra-thin copper foil below 6 μm

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  • A kind of ultra-thin electrolytic copper foil and its preparation method

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preparation example Construction

[0016] See figure 1 , figure 1 It is a process flow diagram of an embodiment of the ultra-thin electrolytic copper foil in the present invention. The ultra-thin electrolyte copper foil is prepared in the present invention, and the steps include:

[0017] S1: Set the anode plate and the cathode roller and is immersed in the copper electrolyte. Specifically, the materials and ratios of the anode plate, the cathode roller, and the copper electrolyte in this step are respectively described.

[0018] In the present embodiment, the anode polar plate is an activated coating plate comprising an activated coating and a substrate, wherein the activation coating comprises palladium, ruthenium, ruthenium, cobalt, lead, manganese, etc., activated coating The total amount of precious metal in the layer is not less than 2g / m 2 And the density of the ruthenium is 0.5 ~ 5g / m 2 The purpose of the above-described various precious metals in the activation coating is to make the surface of the ano...

Embodiment 1

[0026] S1: Select 2G / m 2 The activated coating of the ruthenium composition is formed into an anode plate and a chromium-plated stainless steel roller, and copper electrolyte is mixed with copper electrolyte with copper sulfate, sulfuric acid and hydrochloric acid. The copper electrolytic solution is 60 g / L, 100 g of sulfate. L, the chloride ion concentration of 25 mg / L, so immersed the anode polar plate and the cathode roller in the copper electrolyte.

[0027] S2: Apparatus, N, N-dimethyl dithiocaroxamide propane sulfonate, hydroxyethyl cellulose, and collagen mixing, additive, glycyne, glycyne The concentration of sodium sulfonate is 25 mg / L, N, N-dimethyl dithiomethymethyl propane sulfonate is 30 mg / L, the concentration of hydroxyethyl cellulose is 25 mg / L, the concentration of collagen is 120 mg / L and the molecular weight is 2200, and the disposed additive is added to the S1 step and uniformly mixed.

[0028] S3: Apply a direct current between the anode plate an...

Embodiment 2

[0030] S1: Select 2G / m 2 The activation coating of the ruthenium composition into the titanium plate, surface chrome-plated stainless steel roller as a cathode roller, mixed copper electrolyte with copper sulfate, sulfuric acid and hydrochloric acid, copper electrolytic solution of 75 g / L, 120 g of sulfuric acid L, the chloride ion concentration of 35 mg / L, dip the anode polar plate and the cathode roller in the copper electrolyte.

[0031]S2: Apparatus, N, N-dimethyl dithiocaroxamide propane sulfonate, hydroxyethyl cellulose, and collagen mixing, additive, glycyne, glycyne The concentration of sodium sulfonate is 25 mg / L, N, N-dimethyl dithiomethymethyl propane sulfonate is 45 mg / L, and the concentration of hydroxyethyl cellulose is 35 mg / L, the concentration of collagen is 150 mg / L and the molecular weight is 2500, and the disposed additive is added to the S1 step and the copper electrolyte is configured and mixed well.

[0032] S3: Apply a direct current between t...

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Abstract

The invention discloses an ultra-thin electrolytic copper foil and a preparation method thereof. The steps of the method include: setting an anode plate and a cathode roll, and immersing them in a copper electrolyte; adding additives to the copper electrolyte and mixing them uniformly; A direct current is applied between the anode plate and the cathode roll for electrolysis, and copper foil is prepared on the surface of the cathode roll; the additives include sodium polydithiodibenzenesulfonate, N,N-dimethyl disulfide Sodium carboxamide propane sulfonate, hydroxyethyl cellulose and collagen, and the concentration of sodium polydithiodiphenyl sulfonate is 20-70mg / L, N,N-dimethyldithioformamide propane sulfonate sodium The concentration is 30-60 mg / L, the concentration of hydroxyethyl cellulose is 20-50 mg / L, the concentration of collagen is 100-180 mg / L and the molecular weight is 2000-4000. In the present invention, by introducing additives with a specific ratio, the crystal grains can be further refined during DC electrolysis, and ultra-thin copper foil with a thickness of less than 6 μm can be prepared while ensuring that the copper foil has good tensile strength and flatness. Simple and convenient, it is beneficial to industrial mass production.

Description

Technical field [0001] The present invention relates to the field of electrolytic copper foil, particularly a super thin electrolytic copper foil and a method of preparation. Background technique [0002] At present, the method of preparing the copper foil is mainly divided into a translucent copper foil and an electrolytic copper foil. The delayed copper foil has a higher density, and the surface is more smooth, and it is conducive to the rapid transmission of signals after the printed circuit board, and therefore often used for high The frequency high-speed transfer is transmitted and the circuit is finely printed on the circuit board, but since the translucent copper foil process is much higher than the electrolytic copper foil, there are many restrictions on the process conditions, so that it is difficult to apply a crimp foil process to a wide copper foil. Large-scale preparation; and electrolytic copper foil is a method of producing copper foil by continuous electrolysis, i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04H01M4/38H01M4/134
CPCC25D1/04H01M4/134H01M4/38H01M2004/027Y02E60/10
Inventor 张干成曾潮彭硕
Owner HUBEI ZHONGYI TECH