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High-temperature hot-pressing pad layer paper manufacturing method

A technology of high temperature hot pressing and manufacturing method, applied in pulp beating method, pulp beating/refining method, papermaking and other directions, can solve problems such as difficulty in meeting electronic circuit boards, low qualified product rate of circuit boards, inconvenient recycling, etc. The effect of good high temperature resistance, good flatness and good air permeability

Active Publication Date: 2019-11-19
YUEYANG FOREST & PAPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional cushion material adopts silicone rubber sheet, which is prone to delamination during processing and use. The qualified product rate of the produced circuit board is low, the cost is high, it is inconvenient to recycle, and it is difficult to meet the technical requirements of the rapid development of the electronic circuit board industry. Therefore, a new cushion material is needed to replace the traditional cushion material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: High-temperature hot-pressed cushion paper

[0022] First, mix 25% broad wood chips and 75% coastal pine chips in the silo. After mixing evenly, the mixed wood chips are pulped through sulfate cooking and hydrogen peroxide micro-bleaching pulping technology. The ISO whiteness is controlled at 20 degrees to prepare a mixed slurry; then the mixed slurry is beaten through three conical mills in series, the beating degree is 15ºSR, the wet weight is 12 grams, and the beating concentration is 2.7%; The total dry weight of the slurry is 2% heat-resistant agent and 0.1% penetrant in the total dry weight of the slurry. The heat-resistant agent is urea, and the penetrant is fatty alcohol polyoxyethylene ether. The material is fed into the headbox, the opening of the lip of the headbox is 30.6mm, and double-sided dehydration is carried out by stacking the net to ensure that the fibers are evenly dispersed, and the vertical and horizontal fibers are arranged in an or...

Embodiment 2

[0024] A method for manufacturing high-temperature hot-pressed cushion paper, comprising the following steps:

[0025] Step (A), pulping: first mix 26% broadwood chips with 70% coastal pine chips to form mixed chips, then kraft cook the mixed chips to form pulp, and finally add to the pulp after kraft cooking The hydrogen peroxide of 1kg / ton of slurry is bleached, and the whiteness of slurry is controlled to be 20 degrees for pulping;

[0026] Step (B), beating: the slurry prepared in step (A) is beaten through a conical grinding and refining process, the beating concentration is 2.7%, and the beating degree of the slurry is 15 0 SR, the wet weight is 12g; the slurry after beating is introduced into the slurry tank;

[0027] Step (C), addition of auxiliary materials: add 2.0% of urea and 0.1% of fatty alcohol polyoxyethylene ether to the slurry after the beating process, and add the added auxiliary materials The slurry is sent into the headbox with a lip opening of 30.6mm; ...

Embodiment 3

[0032] A method for manufacturing high-temperature hot-pressed cushion paper, comprising the following steps:

[0033] Step (A), pulping: first mix 28% broadwood chips with 72% coastal pine chips to form mixed chips, then kraft cook the mixed chips to form pulp, and finally add to the pulp after kraft cooking The hydrogen peroxide of 3kg / ton of slurry is bleached, and the whiteness of slurry is controlled to be 21 degrees for pulping;

[0034] Step (B), beating: beat the slurry prepared in step (A) through a conical grinding and refining process, the beating concentration is 2.9%, and the beating degree of the slurry is 17 0 SR, the wet weight is 14g; the slurry after beating is introduced into the slurry tank;

[0035] Step (C), addition of auxiliary materials: add 3% of urea and 0.2% of fatty alcohol polyoxyethylene ether to the slurry after the beating process, and add the auxiliary materials The slurry is sent into the headbox with a lip opening of 30.6mm;

[0036] Step...

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Abstract

The invention discloses a high-temperature hot-pressing pad layer paper manufacturing method, which comprises: (A) pulping: mixing softwood sheets and hardwood sheets to form mixed wood sheets, and pulping by using sulfate cooking and micro-bleaching pulping; (B) beating: grinding the prepared pulp by a conical mill; (C) auxiliary material adding: adding an auxiliary material to the pulp; (D) wetpaper sheet making: loading the pulp on a net part, carrying out laminating dewatering, and pressing to obtain a wet paper sheet; (E) wet paper sheet drying, wherein the dryness after drying is 95%; and (F) calendering and coiling: carrying out calendering and coiling treatment on the paper sheet. A purpose of the present invention is to provide a high-temperature hot-pressing pad layer paper manufacturing method, wherein the pad layer paper manufactured by the method has good performances, and can fully meet the requirements of printed circuit board pad layer materials in the electronics industry.

Description

technical field [0001] The invention belongs to papermaking technology, in particular to a method for manufacturing high-temperature hot-pressed pad paper. Background technique [0002] In the thermoforming of copper-clad laminates and insulating boards for circuit boards in the electronic industry, a cushion material is needed to ensure the manufacture and product quality of circuit boards. When the material is used at a high temperature of 190-250°C and a pressure of about 2.5MPa, it needs to maintain its relatively stable performance; it needs to have a certain degree of elasticity and cushioning capacity to avoid damage to the electronic circuit board due to excessive local pressure; Good cleanliness, no corrosion and contamination of circuit boards during use. The traditional cushion material uses silicone rubber sheet, which is prone to delamination during processing and use. The qualified rate of the circuit board produced is low, the cost is high, and it is inconven...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21C3/02D21C9/10D21D1/02D21D1/20D21H21/06D21G1/00
CPCD21C3/02D21C9/10D21D1/02D21D1/20D21G1/00D21H21/06
Inventor 吴恒李丹刘成良刘春景周金涛
Owner YUEYANG FOREST & PAPER CO LTD