Lead-free thick-film resistors and electronic parts including them
A technology of thick film resistors and precursors, applied in resistor parts, resistors, electrical components, etc., can solve the problem of reducing resistivity, increasing changes in electrical characteristics, stability of resistance value of thick film resistors, and electrical characteristics of temperature characteristics. Reduce problems such as low resistance value variation coefficient, excellent surface uniformity, and excellent anti-static properties.
Active Publication Date: 2021-09-21
DAEJOO ELECTRONICS MATERIALS CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] However, in the case of changing the glass composition as described above or using ruthenium oxide having a rutile crystal structure, the growth of particles is suppressed and the resistivity is lowered when the resistor composition is fired, and the resistance value of the thick film resistor is stabilized. Electrical properties such as resistance, temperature characteristics (TCR) and C-Noise are significantly reduced
In addition, in the manufacture of resistance composition, due to the general RuO 2 It is produced by simply mixing powder and glass components, so it is difficult to obtain a uniform mixing state between constituent components
Therefore, in the thick film resistor, it is difficult to obtain a uniform fine structure after firing, and as a result, the change in the electrical characteristics of the thick film resistor increases, and there is still a problem that the stability of the thick film resistor decreases.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1-24 and comparative example 1-9
[0135] 1) Manufacture of conductive composite powder with first network formed
[0136] Including the composition of the first glass precursor mixture or the second glass precursor mixture described in the following Table 1, the ruthenium-based composite oxide and the first The glass precursor mixture or the second glass precursor mixture were ball milled for 2 hours. Then, the sintered body obtained after the heat treatment at 800° C. for 30 minutes was pulverized for 12 hours by a pulverizer to produce a conductive composite powder having a first network with an average particle diameter of the final powder of 1.5 μm.
[0137] 2) Manufacture of lead-free thick film resistor composition
[0138]Mixing according to the composition and content (g) described in the Examples and Comparative Examples in the following Table 3, 12% by weight of ethyl cellulose resin as an organic binder and BCA (butyl carbitol ethyl alcohol) were used. Acetate, Butyl CarbitolAcetate) 3: TPNL (Terp...
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Abstract
The present invention relates to a lead-free thick-film resistor and an electronic component containing the same. The above-mentioned lead-free thick-film resistor is characterized in that it comprises: A first network formed by a glass precursor mixture and a ruthenium-based composite oxide; and a second network formed by a second glass precursor mixture comprising silicon oxide, boron oxide and aluminum oxide, the first network and the first network Two networks cross each other to form.
Description
technical field [0001] The present invention relates to a lead-free thick film resistor and an electronic component including the same. More specifically, it relates to a lead-free thick film with improved temperature characteristics, current noise, overload characteristics, and antistatic characteristics in a wide resistance range even if the lead component is removed by forming a double network structure by intersecting the first network and the second network. Resistors and electronic components including them. Background technique [0002] The thick film resistor composition used to manufacture thick film resistors is generally composed of a glass component for adjusting the resistance value and imparting bonding properties, a conductive material, a binder, and an organic vehicle (organic vehicle) composed of a solvent. This composition is printed on a substrate and then fired to form a thick film resistor. [0003] Conventional thick film resistor compositions contain...
Claims
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IPC IPC(8): H01C7/00H01B1/14H01B1/08H01C1/142H05K1/16
CPCH01B1/08H01B1/14H01C1/142H05K1/167
Inventor 禹东俊李惠诚金庆容姜成学林锺赞
Owner DAEJOO ELECTRONICS MATERIALS CO LTD