A kind of nanoparticle doping realizes high temperature service solder paste and preparation method thereof

Abstract

The invention belongs to a kind of nano-particle doping to achieve high-temperature service solder paste, which is specifically suitable for applications where the service temperature after welding is higher than 270°C, including tin alloys, nano-metals, rare earth alloys and solder pastes. The tin alloy powder It is a mixture of one or two kinds of tin-silver alloy powder, tin-antimony alloy powder and tin-copper alloy powder; the nano-metal powder is one or more mixtures of copper powder, nickel powder, titanium powder, cobalt powder and gold powder; The active ingredients of the solder paste include hydrogenated rosin, diethylene glycol monohexyl ether, succinic acid, tolyltriazole and citric acid; its preparation method includes preparing tin alloy powder, nanometer metal powder, rare earth alloy Powder, flux paste and mixing steps, adopting the invention of this technical scheme, by adding a certain proportion of nano-element metal particles or alloy particles in the solder paste, and adding corresponding nano-auxiliary additives, the preparation cost is lower than that of nano-soldering Paste, and easy to implement, a wider range of applications.

Description

technical field [0001] The invention belongs to nano particle doping to achieve high-temperature service solder paste and a preparation method thereof, and is particularly suitable for applications where the service temperature after welding is higher than 270°C. Background technique [0002] With the high speed of communication equipment and the high density of integrated circuits, the complexity of semiconductor devices is getting higher and higher, which puts forward higher requirements for packaging technology. With the expansion of multi-level packaging, printed circuit boards ( PCB) welding multiple times, in order to increase the production speed, after the first side A is welded, then when the B side is welded, the temperature of the printed circuit board (PCB) is higher during the second (multiple) welding, Usually above 240°C, when solder paste with a low melting point (usually at 216°C) is used, because the temperature of the printed circuit board (PCB) is higher ...

AI Technical Summary

Problems solved by technology

[0002] With the high speed of communication equipment and the high density of integrated circuits, the complexity of semiconductor devices is getting higher and higher, which puts forward higher requirements for packaging technology. With the expansion of multi-level packaging, printed circuit boards ( PCB) welding multiple times, in order to increase the production speed, after the first A side is welded, when the B side is welded next, during the second (multiple) welding, the temperature of the printed circuit board (PCB) is higher, Usually above 240°C, when solder paste with a low melting point (usually at 216°C) is used, because the temperature of the printed circuit board (PCB) is higher than that of the low melting point during secondary (or multiple) soldering Solder paste will cause the already welded solder paste with low melting point in service to melt again, resulting in false welding of the already welded A side, seriously affecting the quality of welding and reducing product performance; when using solder paste with high melting point in service When soldering solder paste, the melting point of the solder paste itself is required to be high. Although it solves the technical problem that the A-side solder paste that has been welded is not easy to melt during the second (or multiple) soldering, but in the first A-side soldering, Requires high melting point and high cost

In the current existing technology, solder paste cannot fully meet the requirements, either the cost is too high, or the performance cannot be achieved, or the use range is narrow