High-heat-conductivity silicone grease and preparation method thereof

A high thermal conductivity, high thermal conductivity filler technology, applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of low chemical stability, low thermal conductivity, poor heat resistance, etc., to achieve high thermal conductivity, thermal resistance Small size, good heat resistance

Pending Publication Date: 2019-12-03
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing thermal conductive silicone grease still has defects such as low thermal conductivity, high thermal resistance, poor heat resistance, low chemical stability, and silicone oil will precipitate out after a short period of time.

Method used

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  • High-heat-conductivity silicone grease and preparation method thereof
  • High-heat-conductivity silicone grease and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A high thermal conductivity silicone grease, including the composition of the following mass percentages:

[0024] 55% of high thermal conductivity filler, 1.5% of surface modifier, 1.5% of surface treatment agent, and the balance is silicone oil; among them, the high thermal conductivity filler includes 8% of modified graphene, and 92% of copper powder with two different particle sizes, There is a coating layer on the surface of the copper powder. The surface treatment agent is sodium stearate, the copper powder is spherical, the copper powder includes large particle copper powder and small particle copper powder, the median particle diameter D50 of the large particle copper powder is 3.0μm, and the median particle size The diameter D50 is 1.0 μm, the volume ratio of large-particle copper powder and small-particle copper powder is 8:2, the modified graphene is a sheet structure, the surface modifier is silane coupling agent KH560, and the coating layer on the surface o...

Embodiment 2

[0030]The difference from Example 1 is that the high thermal conductivity silicone grease in this example includes the following composition by mass percentage: 50% of high thermal conductivity filler, 2% of surface modifier, 2% of surface treatment agent, and the balance is silicone oil; Among them, the high thermal conductivity filler includes 5% modified graphene, and 95% copper powder with two different particle sizes. The surface of the copper powder has a coating layer. The surface treatment agent is sodium stearate. The copper powder is spherical. Including large-grain copper powder and small-grain copper powder, the median particle diameter D50 of large-grain copper powder is 5.5 μm, the median particle diameter D50 of small-grain copper powder is 1.5 μm, the volume of large-grain copper powder and small-grain copper powder The ratio is 7.5:2.5, the modified graphene is a sheet structure, the surface modifier is silane coupling agent KH560, the coating layer on the surf...

Embodiment 3

[0033] The difference from Example 1 is that the high thermal conductivity silicone grease in this example includes the following composition by mass percentage: 55% of high thermal conductivity filler, 1% of surface modifier, 1.5% of surface treatment agent, and the balance is organic silicone oil; Among them, the high thermal conductivity filler includes 10% of modified graphene, and 90% of copper powder with two different particle sizes. The surface of the copper powder has a coating layer. The surface treatment agent is calcium stearate. The copper powder is spherical. Including large-grain copper powder and small-grain copper powder, the median particle diameter D50 of large-grain copper powder is 1.0 μm, the median particle diameter D50 of small-grain copper powder is 0.5 μm, the volume of large-grain copper powder and small-grain copper powder The ratio is 8.5:1.5, the modified graphene has a sheet structure, the surface modifier is silane coupling agent KH570, the coati...

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Abstract

The invention belongs to the technical field of high molecular materials, and particularly relates to high-heat-conductivity silicone grease. The high-heat-conductivity silicone grease comprises the following components in percentages by mass: 50-60% of high-heat-conductivity filler, 1-2% of a surface modifier, 1-2% of a surface treatment agent and the balance of organosilicone oil. The high-heat-conductivity filler comprises 5-10% of modified graphene and 90-95% of copper powder with two different particle sizes, wherein a coating layer is arranged on the surface of the copper powder. The spherical copper powder with two particle sizes is adopted as a filler, so that the effective heat transfer area is increased; by coating the spherical copper powder with the two particle sizes, the high-temperature resistance and oxidation resistance of the heat-conductivity silicone grease are improved; the compatibility of the filler and the organosilicone oil is improved by modifying the graphene; and finally, the surface treatment agent is added into the system, so that heat resistance of the heat-conductivity silicone grease is reduced, and precipitation of the organosilicone oil is avoided. The invention also provides a preparation method of the high-heat-conductivity silicone grease, and the high-heat-conductivity silicone grease prepared by the method is high in heat conductivity, small in thermal resistance, good in heat resistance, good in compatibility with silicone oil and free of silicone oil precipitation after being placed for a long time.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high thermal conductivity silicone grease and a preparation method thereof. Background technique [0002] With the improvement of productivity and the development of science and technology, electrical equipment tends to be more powerful, and electronic components tend to be denser and miniaturized. These devices and components will release a lot of heat during work, which needs to be dissipated in time, otherwise failure will occur. [0003] In practical applications, heat can be transferred to the environment through the radiator, so that the equipment and components can maintain an appropriate temperature. Ideally, the heat sink is in close contact with the heat source without any gaps in between, and the heat transfer effect is the best at this time. However, due to the limitation of processing accuracy or consideration of processing cost, the actual ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/08C08L83/06C08L83/07C08K13/06C08K9/10C08K7/18C08K3/08C08K9/06C08K3/04C08K5/098C09K5/10C09K5/14
CPCC08K3/08C08K5/098C08K7/18C08K9/06C08K9/10C08K13/06C08K2003/085C08K2201/003C08L83/04C08L83/06C08L83/08C08L2201/08C08L2205/02C09K5/10C09K5/14C08K3/042
Inventor 黄剑滨黄伟希刘伟康刘准亮
Owner 东莞市新懿电子材料技术有限公司
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