A pre-measurement method for high-purity indium samples used for glow discharge mass spectrometry detection
A technique of glow discharge mass spectrometry and processing methods, which is applied in the field of high-purity metal composition analysis, can solve problems such as impurity dissolution and result deviation, and achieve the effects of no impurity introduction, improved accuracy, and low cost
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Embodiment 1
[0028] Embodiment 1: as figure 1 As shown, the pre-measurement method for the high-purity indium sample used for glow discharge mass spectrometry detection, the specific steps are as follows:
[0029] (1) Put 12g of high-purity indium sample 2 whose size is smaller than the sputtering hole 1 and does not meet the test requirements, and place it in a hydrochloric acid solution with a concentration of 6mol / L for ultrasonic corrosion for 15s (attached figure 1 as shown in 3);
[0030] (2) Place the ultrasonically etched sample in step (1) in deionized water for 360s ultrasonic cleaning (attached figure 1 4 in), and the samples after ultrasonic cleaning were blown dry with high-purity nitrogen (attached figure 1 shown in 5);
[0031] (3) Place the dried sample in step (2) between two clean and dust-free acrylic plates, and place the bottom acrylic plate on a horizontal plane;
[0032] (4) Use a clean hammer to hammer the upper acrylic plate from top to bottom above the acrylic...
Embodiment 2
[0034] Embodiment 2: The pre-measurement method of the high-purity indium sample used for glow discharge mass spectrometry detection, the specific steps are as follows:
[0035] (1) Put 7g of the high-purity indium sample 2 to be tested, which is smaller than the sputtering hole 1 and does not meet the test requirements, in a hydrochloric acid solution with a concentration of 3mol / L and ultrasonically corrode it for 85s;
[0036] (2) Place the sample after ultrasonic etching in step (1) into deionized water for ultrasonic cleaning for 170s, and dry the sample after ultrasonic cleaning with high-purity argon;
[0037] (3) Place the dried sample in step (2) between two clean and dust-free polytetrafluoroethylene plates, and place the bottom polytetrafluoroethylene plate on a horizontal plane;
[0038] (4) Use a clean hammer to hammer the upper PTFE plate from top to bottom above the upper PTFE plate of the sample. After the sample is squeezed, a plane will be formed at the botto...
Embodiment 3
[0040] Example 3: (1) Put 5 g of the high-purity indium sample 2 to be tested, which is smaller than the sputtering hole 1 and does not meet the test requirements, in a hydrochloric acid solution with a concentration of 1 mol / L for ultrasonic corrosion for 180 s;
[0041](2) Place the sample after ultrasonic etching in step (1) into deionized water for ultrasonic cleaning for 30s, and dry the sample after ultrasonic cleaning with high-purity argon and nitrogen;
[0042] (3) Place the dried sample in step (2) between two clean and dust-free non-metal hard plates, the upper non-metal hard plate is an acrylic plate, and the bottom non-metal hard plate is a tempered glass plate , and place the tempered glass plate at the bottom on a horizontal plane;
[0043] (4) Use a clean small hammer to hammer the upper acrylic plate from top to bottom above the upper acrylic plate of the sample. After the sample is squeezed, a plane will be formed at the bottom of the sample. Continue hammeri...
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