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Carbon nano-tube/nano-silver soldering paste heat-conduction material and preparing method thereof

A technology of carbon nanotubes and heat-conducting materials, applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., to achieve good application prospects, high thermal conductivity, and good bonding strength

Active Publication Date: 2019-12-10
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, diamond, micro-copper, and graphene have been used as the reinforcing phase of nano-silver solder paste. Although the sintering temperature and overall thermal conductivity required in the silver paste preparation process have been improved, it is still not possible. Fully meet the development needs of existing fields

Method used

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  • Carbon nano-tube/nano-silver soldering paste heat-conduction material and preparing method thereof
  • Carbon nano-tube/nano-silver soldering paste heat-conduction material and preparing method thereof
  • Carbon nano-tube/nano-silver soldering paste heat-conduction material and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] (1) Carrying out oxidation treatment and activation treatment on the carbon nanotube particles. Add 0.8g nano-carbon nanotube particles to the K of 0.35mol / L 2 Cr 2 o 7 Solution mixed with 0.25mol / L HCl solution, boiled at 70°C for 8h for oxidation treatment. Then place the oxidized carbon nanotubes in 0.024mol / L PdCl 2 Activation treatment is carried out in the solution, and finally the activated carbon nanotubes are repeatedly washed with deionized water until they become neutral;

[0031] (2) Electroless silver plating is performed on the carbon nanotube particles. At room temperature, add 0.06mol / L silver nitrate solution dropwise to analytically pure ammonia water with a concentration of 25% to configure the silver ammonia solution, then add activated carbon nanotube particles to the silver ammonia solution, and magnetically Stir, adjust the pH value of the mixed oxidation solution to 8, and finally add dropwise a formaldehyde solution with a concentration of ...

Embodiment 2

[0036] Other conditions are the same as in Example 1, and the properties of the materials prepared at different redox reaction temperatures are tested. The experimental results are shown in Table 1.

[0037] Table 1 Performance of thermally conductive materials at different redox reaction temperatures

[0038]

[0039] From the above results, it can be seen that the temperature ratio of the oxidation-reduction reaction is preferably 20° C. (Example 1).

Embodiment 3

[0041] Other conditions are the same as in Example 1, and the properties of the materials prepared with different pH values ​​of the mixed oxidation solution systems are tested, and the experimental results are shown in Table 2.

[0042] Table 2 The pH value of the mixed oxidation solution system on the performance of thermally conductive materials

[0043]

[0044]

[0045] From the above results, it can be seen that the pH ratio of the mixed oxidation solution system is preferably 8.0 (Example 1).

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Abstract

The invention discloses a carbon nano-tube / nano-silver soldering paste heat-conduction material and a preparing method thereof. A carbon nano-tube with the surface coated with silver is regarded as areinforced phase and doped in nano-silver soldering paste, so that nano-silver particles are effectively and uniformly adsorbed on the carbon nano-tube with the surface coated with silver. The heat-conduction material has the advantages of a high heat-conduction rate, high bonding strength, high shearing strength and the like; besides, by means of the carbon nano-tube / nano-silver soldering paste heat-conduction material and the preparing method thereof, the defect that the interface bonding capability between the carbon nano-tube and the nano-silver particles is weak is overcome, and the preparing technology is simple.

Description

technical field [0001] The invention relates to the technical field of preparation of composite nanomaterials, in particular to a carbon nanotube / nanometer silver solder paste heat-conducting material and a preparation process thereof. Background technique [0002] Nano-silver solder paste is prepared by mixing nano-silver particles with organic solvents such as dispersants, adhesives, and diluents, through mechanical stirring, ultrasonic oscillation, and other methods. And in recent years, relying on its own excellent thermal, electrical, mechanical properties and reliability, it has been paid more and more attention to electronic packaging such as light-emitting diodes (LEDs), semiconductor lasers, and IGBTs. However, the impact of high temperature on the reliability, life, stress-strain behavior and creep behavior of electronic products, as well as the temperature cycle caused by frequent switching of power devices will cause product failure. At the same time, the bondin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/22B23K35/24B23K35/36
CPCB23K35/22B23K35/24B23K35/36B23K35/40
Inventor 张平许晖周漫姜雄杨培培杨道国
Owner GUILIN UNIV OF ELECTRONIC TECH
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