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Preparation method of mullite whisker low-temperature growth toughening type aluminum-phosphate-based high-temperature adhesive

A mullite whisker and aluminum phosphate-based technology is applied in the field of preparation of mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature glue, which can solve the problem of high starting temperature and limit the growth of mullite whisker in situ. Tough technology can implement temperature range and other issues to achieve the effects of improved bonding effect, extended fracture displacement, and high damage tolerance

Active Publication Date: 2019-12-10
CIVIL AVIATION UNIV OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, AlF 3 The starting temperature of the function is high, that is, the mullite whisker growth temperature is high, usually higher than 1000 ° C, which seriously limits the executable temperature range of the in-situ growth and toughening technology of mullite whisker

Method used

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  • Preparation method of mullite whisker low-temperature growth toughening type aluminum-phosphate-based high-temperature adhesive
  • Preparation method of mullite whisker low-temperature growth toughening type aluminum-phosphate-based high-temperature adhesive
  • Preparation method of mullite whisker low-temperature growth toughening type aluminum-phosphate-based high-temperature adhesive

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Experimental program
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Effect test

Embodiment 1

[0026] The method for preparing mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature glue provided in this example includes the following steps in order:

[0027] (1) Aluminum hydroxide powder, kaolin powder and ammonium molybdate tetrahydrate powder are mixed in a weight ratio of 1.21:1:0.293, then placed in a high-energy ball mill, and ball milled for 3 hours at a speed of 600r / min to obtain whiskers growth precursors;

[0028] (2) Alumina powder, silicon powder, boron carbide powder and BYBSO 2 The low-temperature molten glass powder is fully mixed with a weight ratio of 1.75:2.5:1.5:1.5 to make a raw material mixture;

[0029] (3) Dilute concentrated phosphoric acid with a concentration of 85% to 60% with water, and place it in a water bath at 85°C, then mix aluminum hydroxide powder into dilute phosphoric acid, wherein the molar ratio of Al:P is 1: 1. Continue mechanical stirring until it becomes a milky white glue solution with a v...

Embodiment 2

[0032] (1) Aluminum hydroxide powder, kaolin powder and ammonium molybdate tetrahydrate powder are mixed in a weight ratio of 1.21:1:0.232, then placed in a high-energy ball mill, and ball milled at a speed of 600r / min for 2.5h to obtain a crystal whisker growth precursors;

[0033] (2) Alumina powder, silicon powder, boron carbide powder and BYBSO 2 The low-temperature molten glass powder is fully mixed with a weight ratio of 1.5:1.5:1.25:1.75 to make a raw material mixture;

[0034] (3) Dilute concentrated phosphoric acid with a concentration of 85% to 60% with water, and place it in a water bath at 85°C, then mix aluminum hydroxide powder into dilute phosphoric acid, wherein the molar ratio of Al:P is 2: 3. Continue mechanical stirring until it becomes a milky white glue solution with a viscosity of 1500mPa·s;

[0035] (4) the whisker growth precursor prepared in step (1), the raw material mixture prepared in step (2) and the glue solution prepared in step (3) are placed ...

Embodiment 3

[0037] (1) Aluminum hydroxide powder, kaolin powder and ammonium molybdate tetrahydrate powder are mixed in a weight ratio of 1.21:1:0.171, then placed in a high-energy ball mill, and ball milled at a speed of 650r / min for 2 hours to obtain whiskers growth precursors;

[0038] (2) Alumina powder, silicon powder, boron carbide powder and BYBSO 2 The low-temperature molten glass powder is fully mixed with a weight ratio of 1:1.75:1.75:2.25 to make a raw material mixture;

[0039] (3) Dilute concentrated phosphoric acid with a concentration of 85% to 60% with water, and place it in a water bath at 85°C, then mix aluminum hydroxide powder into dilute phosphoric acid, wherein the molar ratio of Al:P is 1: 2. Continue mechanical stirring until it becomes a milky white glue solution with a viscosity of 1500mPa·s;

[0040](4) the whisker growth precursor prepared in step (1), the raw material mixture prepared in step (2) and the glue solution prepared in step (3) are placed in a bal...

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Abstract

The invention provides a preparation method of mullite whisker low-temperature growth toughening type aluminum-phosphate-based high-temperature adhesive. The preparation method comprises the steps ofusing aluminium hydroxide powder, kaolinite powder and an ammonium molybdate tetrahydrate powder prefabricated whisker growth precursor to mix aluminum oxide powder, silicon powder, boron carbide powder and glass powder to prepare a filler, taking a reaction solution of aluminum hydroxide and phosphoric acid as a glue solution, and finally preparing an adhesive by mixing the precursor, the fillerand the glue solution. The preparation method has the effects that the high-temperature adhesive can grow mullite whiskers in situ at 700 DEG C to be strengthened and toughened, and the bonding performance of the high-temperature adhesive can be greatly improved within the range of 700 DEG C to1300 DEG C. Especially after treatment at 1100 DEG C, the adhesive shows excellent bonding effect, compared with a blank sample without whisker growth, the adhesive strength of the adhesive is increased by 79.88% and reaches 49 MPa, and fracture displacement is increased by nearly 164%. In addition, thehigh-temperature adhesive also shows high damage resistant tolerance, and it is fully shown that the high-temperature adhesive has high use safety.

Description

technical field [0001] The invention belongs to the technical field of adhesive material preparation, and in particular relates to a method for preparing mullite whisker low-temperature growth toughened aluminum phosphate-based high-temperature adhesive. Background technique [0002] As a kind of inorganic adhesive, aluminum phosphate high-temperature adhesive has the characteristics of high temperature resistance, good bonding ability, can be cured at room temperature, good mixability and plasticity, and low price, so it has been widely used in aerospace, nuclear power, etc. and other industrial fields. According to reports, the aluminum phosphate high-temperature glue used by the Russian military can withstand high temperatures of 1700°C. Because of its high temperature resistance, the adhesive is also commonly used to make heat insulating materials and flame retardant materials. However, since most of its components are in the ceramic phase after high-temperature treatm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/81C04B35/447
CPCC04B35/447C04B2235/5276C04B2235/3218C04B2235/349C04B2235/3821C04B2235/36C04B2235/447C04B2235/96
Inventor 王明超冯钊杰罗星娜卢若云
Owner CIVIL AVIATION UNIV OF CHINA
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