Electric-conducting polyphenyl ether/polyamide 66 composition and preparation method thereof
A technology of polyamide and polyphenylene ether, applied in the field of conductive polyphenylene ether/polyamide 66 composition and preparation thereof, can solve the problems of difficult dispersion of polymers, flexibility and low mass density aspect ratio, etc., and improve compatibility , The effect of inhibiting thermal oxygen discoloration and improving interfacial adhesion
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Embodiment 1
[0073] In this embodiment, a conductive polyphenylene ether / polyamide 66 composition is prepared from the following raw materials in parts by weight:
[0074]
[0075] The preparation method of above-mentioned conductive polyphenylene ether / polyamide 66 composition, comprises the following steps:
[0076] (1) After drying the high-viscosity polyphenylene ether resin and the low-viscosity polyphenylene ether resin at a temperature of 80°C for 8 hours, and drying the low-viscosity polyamide 66 resin at a temperature of 110°C for 8 hours , cooling, the cooled high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, low-viscosity polyamide 66 resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate and pentaerythritol zinc were added to the high-speed mixer (the speed was 1000 rpm / min) for mixing;
[0077] (2) the styrene and glycidyl methacrylate copolyme...
Embodiment 2
[0081] In this embodiment, a conductive polyphenylene ether / polyamide 66 composition is prepared from the following raw materials in parts by weight:
[0082]
[0083] The preparation method of above-mentioned conductive polyphenylene ether / polyamide 66 composition, comprises the following steps:
[0084] (1) After drying the high-viscosity polyphenylene ether resin and the low-viscosity polyphenylene ether resin at a temperature of 110°C for 4 hours, and drying the low-viscosity polyamide 66 resin at a temperature of 140°C for 4 hours , cooling, the cooled high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, low-viscosity polyamide 66 resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate and pentaerythritol zinc were added to the high-speed mixer (the speed was 1000 rpm / min) for mixing;
[0085] (2) the styrene and glycidyl methacrylate copolym...
Embodiment 3
[0089] In this embodiment, a conductive polyphenylene ether / polyamide 66 composition is prepared from the following raw materials in parts by weight:
[0090]
[0091] The preparation method of above-mentioned conductive polyphenylene ether / polyamide 66 composition, comprises the following steps:
[0092] (1) After drying the high-viscosity polyphenylene ether resin and the low-viscosity polyphenylene ether resin at a temperature of 90°C for 6 hours, and drying the low-viscosity polyamide 66 resin at a temperature of 120°C for 6 hours , cooling, the cooled high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, low-viscosity polyamide 66 resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate and pentaerythritol zinc were added to the high-speed mixer (the speed was 1000 rpm / min) for mixing;
[0093] (2) the styrene and glycidyl methacrylate copolyme...
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Abstract
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