High-nickel copper alloy glass mold strengthening method

Abstract

The invention discloses a high-nickel copper alloy glass mold strengthening method. The high-nickel copper alloy glass mold strengthening method includes the following steps that S1, oxide and dirt onthe surface of a copper mold are removed; S2, transition layer powder is prepared, wherein nickel-based superalloy powder is evenly mixed with pure copper powder with the weight ratio being 15%-30%,and drying is carried out to obtain the transition layer powder; and strengthening layer powder is prepared, wherein nickel-based alloy powder is adopted and dried to obtain the strengthening layer powder; S3, the transition layer powder covers the copper mold in a fusion manner, and a fusion covering layer formed by fusion covering is a transition layer; S4, the strengthening layer powder coversthe transition layer in a fusion manner, and a fusion covering layer formed by fusion covering is a strengthening layer; and S5, and the strengthening layer is modified by machining. The high-nickel copper alloy glass mold strengthening method effectively prevents occurrence of welding cracks and improves the strength of joints; meanwhile, copper alloy oxidizing at high temperature during preheatwelding is avoided, and the high quality of the welding interior on the mold is effectively ensured; and the transition layer improves the weldability and the bonding strength of the copper alloy glass mold and the strengthening layer.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a method for strengthening a high-nickel copper alloy glass mold. Background technique [0002] High-nickel-copper alloy glass mold is a mold used to produce glass products. The components in high-nickel-copper alloy are: Ni: 14-16%, Zn: 7.5-9.5, Al: 8.5-10.5%, Fe: 0.8 to 1.2%, Mn: 0.08 to 0.18%, Si: 0.8 to 1.2%, and the rest Cu. In use, the inner cavity of the copper alloy glass mold is prone to high temperature oxidation, wear, corrosion and other adverse conditions, which will lead to low mold life. At the same time, copper alloy has low hardness and wear resistance, and copper glass molds such as figure 2 As shown, the seam line, seam surface, and seam line have problems such as wear, deformation, and cracks caused by friction and impact during the mold opening and closing process, resulting in premature failure of the mold. [0003] In order to solve the above problems of ...

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Problems solved by technology

[0005] 1) The heat-affected zone is large and the bonding strength is low;

[0006] 2) The thickness of the surfacing layer is large, the processing allowance is large, and the waste of welding materials is large;

[0007] 3) The heat output is large, the closer to the copper substrate, the more serious the strengthening alloy will be diluted. If the retention of the strengthening layer is too small after machining, the hardness and wear resistance will be weakened, which will affect the service life of the mold; if the retention is too large , the heat conduction efficiency is reduced, thereby reducing the working efficiency of the mold;

[0008] 4) When the mold is working, copper conducts heat quickly, the surface temperature of the reinforced alloy layer is relatively high, and the temperature difference with the copper alloy substrate is large and the thermal expansion coefficient is different, which leads to fatigue cracks and shedding of the reinforced alloy layer;

[0009] Moreover, due to the surfacing of strengthening materials on the surface of copper alloys, the choice of materials is poor, and it is difficult to meet the following requirements at the same time:

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