Method for preparing ultra-thick hard thin film based on energy regulation principle

Abstract

The invention discloses a method for preparing an ultra-thick hard thin film based on an energy regulation principle. The method comprises the following steps of 1, cleaning a substrate and then drying to obtain a clean substrate; 2, loading an arc target and the clean substrate into multi-arc ion plating equipment, vacuumizing a vacuum chamber and then heating; 3, performing sputtering cleaning and activation on the clean substrate to obtain an activated substrate; 4, plating a metal priming coat on the activated substrate; 5, depositing a transition layer on the surface of the plated metal priming layer; and 6, preparing an energy adjusting layer on the transition layer through an energy adjusting process, and performing annealing to obtain the ultra-thick hard thin film on the surface of the substrate after cooling. Based on the energy regulation principle, the ultra-thick hard thin film composed of the metal priming layer, the transition layer and the energy adjusting layer is prepared, the internal stress is reduced by adjusting the energy input in the growth process of the energy adjusting layer, the thin film cracking and peeling are avoided, the film layer tissue structureis optimized, and the ultra-thick hard thin film with the thickness greater than 20 microns is obtained.

Description

technical field [0001] The invention belongs to the technical field of metal surface film protection, and in particular relates to a method for preparing an ultra-thick hard film based on the principle of energy regulation. Background technique [0002] Due to its excellent mechanical properties and good physical and chemical properties, hard films are widely used in the surface strengthening of cutting tools, molds, and mechanical parts. It is one of the effective ways to realize the potential of materials. The application of hard film on the surface of metal parts can not only greatly improve the service performance of materials, but also save a lot of production costs. Usually, the thickness of vapor-deposited hard films is only a few microns, which seriously restricts their application in extreme environments such as deep sea, aviation, and nuclear energy. In recent years, with the rapid development of emerging technology fields, the working environment of coated compon...

AI Technical Summary

Problems solved by technology

In recent years, with the rapid development of emerging technology fields, the working environment of coated components has become increasingly harsh, and the requirements for comprehensive performance of films have been continuously improved, so that traditional thin films with a thickness of several microns are becoming more and more difficult to meet the needs of practical engineering applications.

In the research on the preparation of ultra-thick vapor-deposited hard films, early researchers tried to prolong the deposition time to prepare ultra-thick hard films with a thickness of more than tens of microns, but found that as the deposition time prolongs, the internal energy of the film increases, causing The internal stress gradually accumulates, and the stress value can be as high as several GPa or even tens of GPa. Excessive internal stress makes the film prone to cracking and spontaneous peeling, and it is finally difficult to prepare ultra-thick hard films.

Later, many researchers used the method of metal intercalation layer to prepare multi-layer hard film, and released the internal stress of the film through the flexible metal layer and the interface between layers. Although a certain effect was achieved, the matching between layers Problems and interlayer interface bonding problems are also highlighted, and it is often difficult to obtain satisfactory film structure and mechanical properties.

[0003] For single-layer hard films, special coating devices and technologies such as ultra-high power and multiple assists have begun to be developed in the world to prepare hard films with a thickness of more than 20 μm. Although some achievements have been made, a complete technical system has not yet been formed. , equipment procurement will also cost a lot of money

The essential reason for the difficulty in preparing ultra-thick hard films is that there is too much energy inside the film. According to the results of literature research, the preparation of ultra-thick hard films is still difficult for traditional vapor deposition methods such as magnetron sputtering and multi-arc ion plating. There is no effective solution, and there are few reports at home and abroad on the preparation of ultra-thick hard films using the idea of ​​energy regulation

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