GaN/AlGaN heterojunction material based on monocrystalline diamond substrate and preparation method of GaN/AlGaN heterojunction material

A single crystal diamond and heterojunction technology, applied in the field of microelectronics, can solve the problems of large lattice mismatch between GaN and diamond, difficult growth of diamond substrates, limiting device characteristics, etc., and achieves low cost, reduced stress, and simplified The effect of craft difficulty

Inactive Publication Date: 2020-02-21
XIDIAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the AlN nucleation layer grown by MOCVD (Metal Organic Chemical Vapor Deposition) was directly used in the above paper to carry out epitaxial growth of GaN material on the (111) plane diamond substrate. On the one hand, the lattice mismatch between GaN and diamond is large, resulting in Poor material quality and difficult growth limit the characteristics of the resulting device; on the other hand, the (111) surface diamond substrate is difficult to grow and small in size, making the overall manufacturing cost of the device higher

Method used

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  • GaN/AlGaN heterojunction material based on monocrystalline diamond substrate and preparation method of GaN/AlGaN heterojunction material
  • GaN/AlGaN heterojunction material based on monocrystalline diamond substrate and preparation method of GaN/AlGaN heterojunction material

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Embodiment 1

[0042] See figure 1 , figure 1 It is a flowchart of a method for preparing a GaN / AlGaN heterojunction material based on a single crystal diamond substrate provided by an embodiment of the present invention. The preparation method of the present embodiment comprises:

[0043] S1: Select a single crystal diamond substrate;

[0044] S2: generating a graphene layer on the upper surface of the single crystal diamond substrate;

[0045] S3: growing an AlN nucleation layer on the upper surface of the graphene layer;

[0046] S4: growing a low-temperature GaN transition layer on the upper surface of the AlN nucleation layer;

[0047] S5: growing a GaN buffer layer on the upper surface of the low-temperature GaN transition layer;

[0048] S6: growing an AlGaN barrier layer on the upper surface of the GaN buffer layer to finally form a GaN / AlGaN heterojunction material based on a single crystal diamond substrate.

[0049] Further, the S1 includes:

[0050] A single crystal diamon...

Embodiment 2

[0070] On the basis of the above examples, to prepare a GaN / AlGaN heterogeneous diamond substrate based on (100) crystal plane single crystal diamond substrate and including 20nm AlN nucleation layer, 20nm low temperature GaN transition layer, 0.1μm GaN buffer layer and 10nm AlGaN barrier layer Taking the textured material as an example, this embodiment describes the preparation method of the embodiment of the present invention in detail.

[0071] The preparation method of the present embodiment comprises:

[0072] Step 1: Select a single crystal diamond substrate;

[0073] A single crystal diamond with a thickness of 0.5 mm and a crystal plane of (100) was selected as the substrate.

[0074] Step 2: generate a graphene layer on the upper surface of the (100) single crystal diamond substrate;

[0075] Specifically, a graphene layer of 0.2 mm is grown on a metal substrate by chemical vapor deposition; 18 hours in the mixed solution of 2 mixing, remove metal substrate; Finall...

Embodiment 3

[0087] In this example, by preparing a GaN / AlGaN heterogeneous substrate based on (110) crystal plane single crystal diamond substrate, including 100nm AlN nucleation layer, 200nm low temperature GaN transition layer, 0.5μm GaN buffer layer and 100nm AlGaN barrier layer Taking the junction material as an example, the preparation method of the embodiment of the present invention is described in detail.

[0088] The preparation method of the present embodiment comprises:

[0089] Step 1: Select a single crystal diamond substrate;

[0090] A single crystal diamond with a thickness of 0.5 mm and a crystal plane of (110) was selected as the substrate.

[0091] Step 2: generate a graphene layer on the upper surface of the (110) single crystal diamond substrate;

[0092] Specifically, adopt chemical vapor deposition method to grow 0.3mm graphene layer on metal substrate; Then the metal substrate covered with graphene layer is placed in 1mol / L ferric chloride and 2mol / L hydrochloric...

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Abstract

The invention relates to a GaN / AlGaN heterojunction material based on a monocrystalline diamond substrate and a preparation method of the GaN / AlGaN heterojunction material. The method comprises stepsof selecting a monocrystalline diamond substrate; generating a graphene layer on an upper surface of the monocrystalline diamond substrate; growing an AlN nucleating layer on an upper surface of the graphene layer; growing a low-temperature GaN transition layer on an e upper surface of the AlN nucleating layer; growing a GaN buffer layer on an upper surface of the low-temperature GaN transition layer; and growing an AlGaN barrier layer on an upper surface of the GaN buffer layer. The preparation method is advantaged in that graphene is transferred to the monocrystalline diamond substrate withany crystal face, the GaN / AlGaN heterojunction material can be grown on the monocrystalline diamond substrate with any crystal face, the limitation on a crystal face of a substrate when the GaN material is extended on the diamond is broken through, process difficulty is simplified, and the quality of the heterojunction material is improved.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a GaN / AlGaN heterojunction material based on a single crystal diamond substrate and a preparation method thereof. Background technique [0002] Nitride semiconductor materials have the advantages of large band gap, high carrier mobility, and strong breakdown field, and have great application potential in high-frequency, high-voltage, and high-power semiconductor devices. Usually, nitride semiconductor materials are epitaxially grown on Si, sapphire or SiC substrates, but the thermal conductivity of these substrates is relatively low, resulting in poor heat dissipation performance of nitride-based semiconductor devices, which severely limits the performance of nitride semiconductors. Applications of semiconductor devices under high power conditions. [0003] Diamond has the highest thermal conductivity in nature and is especially suitable for heat dissipation...

Claims

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Application Information

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IPC IPC(8): H01L21/02C30B25/18C30B29/04
CPCH01L21/02376H01L21/02538C30B25/18C30B29/04
Inventor 任泽阳张雅超张金风张进成宁静郝跃
Owner XIDIAN UNIV
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