Conductive gel and preparation method thereof

A conductive gel and gel technology, which is applied in the field of conductive gel and its preparation, can solve the problems of affecting the conductivity, the conductive gel is prone to cracks, and the device is damaged, and achieves the effects of fast and convenient preparation process and shortening the preparation cycle.

Pending Publication Date: 2020-03-06
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing conductive gels cannot take into account both high mechanical properties and high elongation rates. The conductive gels with high mechanical properties are prone to cracks during stretching and affect the electrical conductivity. The existence of cracks will cause damage to the device and cause damage. Limit further application of conductive gel materials

Method used

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  • Conductive gel and preparation method thereof
  • Conductive gel and preparation method thereof
  • Conductive gel and preparation method thereof

Examples

Experimental program
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preparation example Construction

[0066] Specifically, the preparation method comprises the following steps:

[0067] S1: adding the first conductive filler, the first polymer and the first gel factor into the first dispersion medium to prepare the first mixed solution;

[0068] S2: adding the second conductive filler, the second gel factor, and the second polymer into the second dispersion medium and mixing to prepare a second mixed solution;

[0069] S3: Provide a printer nozzle 4, the printer nozzle 4 includes a first nozzle 41 and a second nozzle 42 covering the first nozzle 41, place the first mixed solution in the first nozzle 41, and place the second mixed solution in the second nozzle 42, and print the first mixed solution and the second mixed solution through the printer nozzle 4 to obtain a preform;

[0070] S4: Curing the preform to prepare a conductive gel.

[0071] Preferably, in step S1, the mass ratio of the first polymer, the first gelling factor, the first dispersion medium and the first con...

Embodiment 1

[0101] Add 1wt% gold nanoparticles, 0.5wt% polyacrylic acid (molecular weight: 5000), and 0.1wt% borax to 98.4wt% water and mix evenly to prepare a first mixed solution.

[0102] The sodium chloride of 1wt%, the polyvinyl alcohol (molecular weight is 10000) of 0.5wt%, the borax of 0.1wt%, the acrylamide of 10wt%, the N-N'-methylenebisacrylamide of 0.1wt% and 0.1 The wt% 2959 initiator was added into 88.2 wt% water and mixed uniformly to obtain the second mixed solution.

[0103] The first mixed solution is placed in the first nozzle, the second mixed solution is placed in the second nozzle, and printed by a printer nozzle to obtain a preform, wherein the second nozzle is sleeved on the first nozzle and arranged coaxially with the first nozzle.

[0104] The preform is cured to obtain a conductive gel.

[0105] Among them, the outer diameter of the first nozzle in the printer nozzle is 0.2mm, and the outer diameter of the second nozzle is 0.5mm; the printing speed during the pr...

Embodiment 2

[0109] This embodiment is basically the same as Embodiment 1, the only difference is:

[0110] Add 5wt% silver nanoparticles, 5wt% agarose (molecular weight: 2000), 1wt% boric acid to 89wt% water and mix evenly to prepare a first mixed solution.

[0111] Add 5wt% lithium chloride, 5wt% polyethylene glycol (molecular weight: 5000), and 1wt% boric acid into 89wt% water and mix evenly to obtain a second mixed solution.

[0112] Among them, the outer diameter of the first nozzle in the printer nozzle is 6mm, and the outer diameter of the second nozzle is 10mm; the printing speed during the printing process is 0.5mm / s, and the printing air pressure is 0.5psi; the wave band range during curing treatment is 200nm~ 400nm, light time is 5s, light intensity is 50mW / cm 2 .

[0113] The conductive gel is roughly in a double-layer core-shell structure. After testing, the outer diameter of the conductive gel is 10mm, the resistance is 20Ω / m, the elongation rate is 600%, and the Young's mo...

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Abstract

The invention provides a conductive gel comprising a central layer and a first shell layer coating the central layer; the material of the central layer comprises a first gel, and the first gel contains a first reversible bond; the material of the first shell layer comprises a second gel, the second gel contains a second reversible bond, the Young modulus of the second gel is greater than that of the first gel, and the first reversible bond and the second reversible bond can form a chemical bond. The conductive gel provided by the invention has no fault during stretching, so as to ensure that the conductive gel still has good conductivity at a high stretching rate; the conductive gel has high mechanical properties and high stretching rate. The invention also provides a method for rapidly and conveniently preparing the conductive gel.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, in particular to a conductive gel and a preparation method thereof. Background technique [0002] Conductive gel (Hydrogel) has a hydrophilic three-dimensional network structure, can rapidly swell in the dispersion medium and in this swelling state can maintain a large volume of dispersion medium without dissolving. The network structure endows the conductive gel with solid-like mechanical properties, while the dispersion medium can quickly diffuse, endowing the conductive gel with liquid-like transport properties. [0003] Conductive gels are based on certain electrical conductivity, mechanical properties, flexibility and biocompatibility. They can withstand huge mechanical loads and large strains in applications and still maintain high electrical conductivity for signal transmission, while also avoiding accidental breakage. Cause system crashes and other problems, and have a wide ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/075C08L33/02C08L51/00C08F220/56C08F222/38C08K3/08C08K3/16C08L5/12C08L71/02C08L29/04C08L5/08C08F265/02C08F220/06C08F261/04C08K3/38C08K5/55
CPCC08J3/075C08F220/56C08F265/02C08F261/04C08K2201/001C08K2201/011C08K2003/0831C08J2333/02C08J2351/00C08K2003/0806C08J2305/12C08J2371/02C08J2305/08C08K2003/085C08K2003/0862C08K2003/387C08K5/55C08F222/385C08F220/06
Inventor 冯雪刘兰兰陈颖唐瑞涛张柏诚蒋晔付浩然
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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