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Conductive polymer composite wave-absorbing material and preparation method thereof

A composite wave-absorbing material and conductive polymer technology, applied in the direction of electrical components, magnetic field/electric field shielding, etc., can solve the problems of different wave-absorbing frequency bands, uneven wave-absorbing performance, etc., and achieve the effect of strong adjustability

Active Publication Date: 2020-03-27
SUZHOU SHIHUA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electromagnetic wave absorbing layer prepared by this simple physical mixing method will cause the composite material prepared to have microwave absorption everywhere due to the uneven mixing of conductive polymer and silicon carbide and the different absorbing frequency bands of the two absorbing materials. uneven performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] 1. Add 5 parts of nano-silicon carbide, 0.2 parts of urea-modified polyurethane, and 2 parts of polyacrylamide into 120 parts of deionized water for 5 minutes, then change to mechanical stirring for 3 hours, and the mechanical stirring speed is 2500r / min. After the dispersion is uniform, add 60 parts of polythiophene and continue to stir for 4 hours to obtain a silicon carbide / polythiophene dispersion. Use a high-speed centrifuge to centrifuge the obtained dispersion. The centrifuge speed is 20000r / min to obtain a precipitate. The obtained precipitate The material was filtered, and the filtered precipitate was dried in an oven at a temperature of 80°C to obtain a silicon carbide / polythiophene wave absorbing agent.

[0024] 2. Dissolve 1 part of silicon carbide / polythiophene wave absorbing agent, 3 parts of SEBS resin, and 20 parts of ethyl acetate and mix them evenly. Transfer the above solution into a ball mill for ball milling. The ball milling time is 4 hours to obtai...

Embodiment 2

[0028] 1. Add 8 parts of nano-silicon carbide, 0.2 parts of urea-modified polyurethane, 0.1 part of modified urea solution, and 2 parts of polyacrylamide into 140 parts of deionized water for 5 minutes, and then change to mechanical stirring for 4 hours. The stirring speed is 2500r / min. After uniform dispersion, add 60 parts of polythiophene and continue to stir for 4 hours to obtain silicon carbide / polythiophene. Centrifuge the obtained emulsion with a high-speed centrifuge at a speed of 20,000r / min to obtain a precipitate. Filter the obtained precipitate , drying the filtered precipitate in an oven at a temperature of 80°C.

[0029] 2. Dissolve 1 part of silicon carbide / polythiophene wave absorbing agent, 3 parts of SEBS resin, and 20 parts of ethyl acetate and mix them evenly. Transfer the above solution into a ball mill for ball milling. The ball milling time is 4 hours to obtain a slurry. The above solution was transferred into a ball mill for ball milling, and the ball ...

Embodiment 3

[0033]1. Add 5 parts of nano-silicon carbide, 0.2 parts of modified urea solution, and 60 parts of polythiophene into deionized water and mechanically stir for 3 hours at a speed of 2500 r / min. After uniform dispersion, add 4 parts of silane coupling agent and continue to stir for 4 hours to obtain silicon carbide / polythiophene. Use a high-speed centrifuge to centrifuge the obtained solution at a speed of 20000r / min to obtain a precipitate. The obtained precipitate Filtration is performed, and the filtered precipitate is dried in an oven at a temperature of 80°C.

[0034] 2. Dissolve and mix 2 parts of silicon carbide / polythiophene wave absorbing agent, 3 parts of SEBS resin, and 20 parts of ethyl acetate evenly, transfer the above solution into a ball mill for ball milling, and mill for 4 hours to obtain a slurry.

[0035] 3. The ball-milled slurry is evenly coated on the release film through the coating process, and then dried and solidified; wherein, the coating speed is 12...

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Abstract

The invention provides a preparation method of a conductive polymer composite wave-absorbing material. The method comprises the following steps: step 1, preparing a nano material / conductive polymer composite wave absorbing agent; 2, preparing a nano material / conductive polymer / binder composite material; 3, preparing a composite material wave-absorbing coating; and 4, hot-pressing and rolling the composite wave-absorbing coating. Through the preparation method, the wave-absorbing agent can be more uniformly dispersed in a binder, so that the wave-absorbing effect of each part of the composite material is more uniform. Meanwhile, due to the unique three-dimensional space structure of silicon nitride and silicon carbide and the excellent wave-absorbing performance under the low frequency band, the toughness and tensile strength of the composite wave-absorbing material can be improved, and the absorption frequency range of the composite material is widened.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic wave absorbing materials, and in particular relates to a conductive polymer composite wave absorbing material and a preparation method thereof. Background technique [0002] In recent years, the intelligent electronic information industry has made great progress, the rise of 5G, the application of NFC and wireless charging technology. At the same time, mobile phones, computers and tablets are also developing in a light and thin direction. This puts forward more stringent requirements for various components inside electronic products. Nowadays, the components in electronic products are mainly presented in the form of integrated circuits. When various electronic components work at the same time, they will inevitably generate electromagnetic interference to other components around them, thus affecting their normal functions. In order to avoid this problem, wave-absorbing materials came into...

Claims

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Application Information

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IPC IPC(8): C08L53/02C08L65/00C08L79/02C08L79/04C08K3/34C08K9/04C08J5/18H05K9/00
CPCC08J5/18H05K9/0083C08J2353/02C08J2465/00C08J2479/02C08J2479/04C08K3/34C08K9/04C08K2201/011
Inventor 顾正青黄后强陈启峰周奎任
Owner SUZHOU SHIHUA NEW MATERIAL TECH
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