TVS protection device based on P-type SOI substrate, and manufacturing method thereof
A technology for protecting devices and substrates, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problem that leakage current and capacitance cannot increase significantly, circuit power consumption increases, and high-frequency signal transmission is prone to abnormalities, etc. problem, to achieve the effect of low capacitance value, lower clamping voltage, and increased contact area
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[0070] Such as figure 1 , a schematic diagram of the structure of a TVS protection device on a P-type SOI substrate and figure 2 , as shown in the equivalent circuit diagram of the TVS protection device on the P-type SOI substrate,
[0071] A TVS device, comprising a P-type SOI (Silicon-On-Insulator is on an insulating substrate) silicon wafer, a P-region, an N-region, a P+ region, an N+ region, a groove isolation oxide layer, an oxide layer, N+Poly, front metal, back metal, package metal frame, metal leads, such as figure 1 shown.
[0072] A TVS protection device based on a P-type SOI substrate, using an SOI substrate silicon wafer 1, packaged by a metal frame 10, the SOI substrate is a P-type SOI substrate 1, including from bottom to top P-substrate 11, buried oxide layer 12 and P-layer 13, wherein,
[0073] In the P-layer 13, there are first oxide layer deep groove 131, first P+ region 21, first P-region 31, first N-region 32, first N+ region 41, second oxide layer dee...
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