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Halogen-free resin composition and flexible copper-clad plate containing same

A resin composition, flexible copper clad laminate technology, applied in epoxy resin glue, synthetic resin layered products, adhesive types, etc. Unevenness, inability to produce large rolls, etc., to achieve the effect of improving cross-linking density and compatibility, reducing the risk of delamination, and suitable for touch stickiness

Active Publication Date: 2020-04-21
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the existing adhesive-type flexible copper-clad laminates, the epoxy system toughened by nitrile rubber is generally used as the adhesive. In order to obtain better heat resistance and pot life, aromatic amine or dicyandiamide is usually used as the curing agent. Although the adhesive has a long pot life, it needs to be cured in an environment greater than 120°C
Since flexible copper-clad laminates are mostly produced by roll-to-roll, high-temperature curing will cause uneven heating between the inside and outside of the roll-shaped flexible copper-clad laminate, which has potential performance risks, and cannot be produced in large rolls, seriously affecting production efficiency and Rate of qualified products

Method used

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  • Halogen-free resin composition and flexible copper-clad plate containing same
  • Halogen-free resin composition and flexible copper-clad plate containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] A halogen-free resin composition, comprising the following components in parts by weight: 20 parts by weight of epoxidized polybutadiene L680, 18 parts by weight of phenolic novolac epoxy resin, 10 parts by weight of carboxyl-containing saturated polyester resin BX-39SS , 5 parts by weight of polyester polyol XCP-2000M, 20 parts by weight of curing agent Baxxodur EC301 and 15 parts by weight of flame retardant SPB-100.

[0073] The halogen-free resin composition is used for the preparation of flexible copper-clad laminates, and the specific method is as follows:

[0074] (1) Mix and disperse the halogen-free resin composition with acetone evenly to obtain a resin glue with a solid content of 20%;

[0075] (2) Coat the resin glue solution obtained in step (1) on both surfaces of a polyimide film with a thickness of 12.5 μm, and the coating thickness is 10 μm; place it at 80° C. for 2 minutes, remove the solvent and make the polyimide film A partially cured resin layer i...

Embodiment 2

[0077] A halogen-free resin composition, comprising the following components in parts by weight: 25 parts by weight of epoxidized polybutadiene L681, 20 parts by weight of bisphenol A novolac epoxy resin, 15 parts by weight of carboxyl-containing saturated polyester resin H204 , 8 parts by weight of polyester polyol XCP-3000M, 25 parts by weight of curing agent Versamid 125 and 20 parts by weight of flame retardant OP-930.

[0078] The halogen-free resin composition is used for the preparation of flexible copper-clad laminates, and the specific method is as follows:

[0079] (1) Mix and disperse the halogen-free resin composition and butanone evenly to obtain a resin glue with a solid content of 25%;

[0080] (2) Coat the resin glue solution obtained in step (1) on both surfaces of a polyimide film with a thickness of 25 μm, and the coating thickness is 20 μm; place it at 100° C. for 5 minutes, remove the solvent and make the polyimide film A partially cured resin layer is fo...

Embodiment 3

[0082] A halogen-free resin composition, comprising the following components in parts by weight: 30 parts by weight of epoxidized polybutadiene L682, 25 parts by weight of tetraphenol ethane tetraglycidyl ether epoxy resin, 20 parts by weight of carboxyl-containing saturated Polyester resin BX-39SS, 10 parts by weight of polyester polyol XCP-2000M, 30 parts by weight of curing agent Versamid 140 and 25 parts by weight of flame retardant OP-935.

[0083] The halogen-free resin composition is used for the preparation of flexible copper-clad laminates, and the specific method is as follows:

[0084] (1) Mix and disperse the halogen-free resin composition with toluene evenly to obtain a resin glue with a solid content of 30%;

[0085] (2) Coat the resin glue solution obtained in step (1) on both surfaces of a polyimide film with a thickness of 75 μm, and the coating thickness is 35 μm; place it at 120° C. for 8 minutes to remove the solvent and make the polyimide film A partially...

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Abstract

The invention provides a halogen-free resin composition and a flexible copper-clad plate containing the same. The halogen-free resin composition comprises the following components in parts by weight:20-30 parts of epoxidized polybutadiene, 18-25 parts of multifunctional epoxy resin, 10-20 parts of carboxyl-containing saturated polyester resin, 5-10 parts of polyester polyol, 20-30 parts of a curing agent and 15-25 parts of a flame retardant. Multiple chemical reactions among the components can realize medium-temperature rapid curing of a system, and a compact and stable interpenetrating cross-linked network is formed after curing, so the halogen-free resin composition is endowed with relatively long working life, proper thixotropy, extremely low hygroscopicity and excellent bonding stability, and is suitable for a roll-to-roll preparation process of the flexible copper-clad plate. The flexible copper-clad plate containing the halogen-free resin composition has excellent peel strength,heat resistance, secondary appearance and chemical resistance, and can meet the requirements of stability and reliability of a flexible printed circuit.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a halogen-free resin composition and a flexible copper-clad laminate containing the same. Background technique [0002] In recent years, electronic products have continued to develop towards thinner, smaller, and wearable products. This development trend has effectively driven the upgrading and updating of circuit boards. Flexible printed circuit boards are very suitable for three-dimensional space installation, which can make the wiring more reasonable, the structure more compact, and save the installation space, so it is widely used in mobile phones, digital cameras, laptops and other portable electronic devices, as well as flat-screen TVs, Automotive electronics, instrumentation, medical equipment, aerospace, military and other fields. Flexible copper clad laminates are the basic elements of flexible printed circuits. The structural properties of fle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/08C08L67/00C08K5/49C09J163/08C09J163/00C09J167/00C09J11/06B32B27/28B32B15/20B32B15/08B32B33/00B32B37/06B32B37/10B32B38/00
CPCC08L63/08C09J163/08C09J11/06B32B27/281B32B15/20B32B15/08B32B33/00B32B37/06B32B37/10B32B38/00C08L2201/02C08L2201/22C08L2201/08C08L2205/035B32B2038/0076B32B2255/10B32B2255/26B32B2307/306B32B2307/3065B32B2307/558B32B2457/08C08L63/00C08L67/00C08K5/49C08K5/5313
Inventor 左陈茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH