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A kind of low modulus flexible acrylate adhesive and preparation method thereof

A technology of acrylate and urethane acrylate, applied in the direction of adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc., can solve the deformation of bonding parts, unfavorable bonding stability and durability, and internal stress Advanced problems, to achieve the effect of small shrinkage, suitable hardness and good flexibility

Active Publication Date: 2021-12-24
TECHSTORM MATERIAL TECH SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the addition of more bifunctional monomers or even multifunctional monomers, and the use of many hard-segment polymer elastomers, it has a higher cross-linking density after complete curing, but it will cause higher internal stress on the body. ;At the same time, the shrinkage rate exceeds 10%, which will cause a higher shrinkage force on the bonded structure, resulting in deformation of the bonded parts or structure, which is not conducive to the stability and durability of the bond

Method used

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  • A kind of low modulus flexible acrylate adhesive and preparation method thereof
  • A kind of low modulus flexible acrylate adhesive and preparation method thereof

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preparation example Construction

[0101] In one embodiment, the preparation method of the A component includes the following steps:

[0102] (1) Stir the acrylate monomer, polyurethane acrylate oligomer and core-shell particles for 1-3h;

[0103] (2) Add oxidizing agent, polymerization inhibitor, metal ion complex, fumed silica, stir for 5-20min, then evacuate and stir for 5-20min, and discharge to obtain the A component;

[0104] The stirring temperature is 25-45°C.

[0105] In a preferred embodiment, the preparation method of the A component comprises the following steps:

[0106] (1) Stir acrylate monomer, urethane acrylate oligomer and core-shell particles for 2 hours;

[0107] (2) Add oxidizing agent, polymerization inhibitor, metal ion complex, fumed silica, stir for 10 minutes, then vacuumize and stir for 10 minutes, and discharge to obtain the A component;

[0108] The stirring temperature is 45°C.

[0109] In another embodiment, metal ion complexes and core-shell particles may not be added in the ...

Embodiment 1

[0169] Embodiment 1 provides a low modulus flexible acrylate adhesive, including A component and B component; the volume ratio of the A component and B component is 1:3;

[0170] The A component includes, by weight, 65 parts of acrylate monomer, 15 parts of polyurethane acrylate oligomer, 20 parts of oxidant, 1 part of polymerization inhibitor, and 7.5 parts of fumed silica;

[0171] The B component includes, by weight, 65 parts of acrylate monomer, 10 parts of polyurethane acrylate oligomer, 5 parts of reducing agent, 1 part of polymerization inhibitor, and 5 parts of fumed silica;

[0172] The acrylate monomer in the A component includes, by weight, 20 parts of n-butyl methacrylate, 15 parts of solid acrylic resin, 20 parts of lauryl methacrylate, 3,4-epoxycyclohexyl methyl 10 parts of acrylate;

[0173] The grade of the polyurethane acrylate oligomer is CN-991NS, purchased from Sartomer Guangzhou Chemical Co., Ltd.;

[0174] Described oxidizing agent is cumene hydroperoxi...

Embodiment 2

[0184] Embodiment 2 provides a low modulus flexible acrylate adhesive, including A component and B component; the volume ratio of the A component and B component is 1:15;

[0185] The A component includes, by weight, 70 parts of acrylate monomers, 15 parts of polyurethane acrylate oligomers, 30 parts of oxidants, 4 parts of polymerization inhibitors, and 3 parts of fumed silica;

[0186] The B component includes, by weight, 75 parts of acrylate monomers, 10 parts of polyurethane acrylate oligomers, 4 parts of reducing agents, 0.5 parts of polymerization inhibitors, and 3 parts of fumed silica;

[0187] The acrylate monomer in the A component includes, by weight, 10 parts of n-butyl methacrylate, 25 parts of lauryl methacrylate, 15 parts of hydroxypropyl methacrylate, and 20 parts of solid acrylic resin;

[0188] The grade of the polyurethane acrylate oligomer is CN-991NS, purchased from Sartomer Guangzhou Chemical Co., Ltd.;

[0189] Described oxidizing agent is cumene hydrop...

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Abstract

The invention relates to the field of polymer chemical industry, in particular to a low-modulus flexible acrylic adhesive and a preparation method thereof. The low modulus flexible acrylate adhesive includes A component and B component; the A component includes acrylate monomer, urethane acrylate oligomer, core-shell particles, oxidizing agent, polymerization inhibitor and metal ion complex One or more combinations; the B component includes one or more of acrylate monomers, polyurethane acrylate oligomers, core-shell particles, reducing agents, polymerization inhibitors and metal ion complexes The combination; the volume ratio of the A component and the B component is 1: (1-20). The invention obtains the acrylic adhesive with good flexibility, long operating time and high shear strength after curing and forming by regulating and adding the type, parameters and other additives of the acrylate monomer.

Description

technical field [0001] The invention relates to the field of polymer chemical industry, in particular to a low-modulus flexible acrylic adhesive and a preparation method thereof. Background technique [0002] Methacrylate adhesives are very attractive high-performance engineering structural materials. It has the characteristics of convenient operation, room temperature curing, high peel strength, excellent adhesive performance, good water resistance, and universality of substrates. [0003] There are methacrylate adhesives on the market, which are mostly used in automotive, electronics, wind power and industrial bonding. Due to the addition of more bifunctional monomers or even multifunctional monomers, and the use of many hard-segment polymer elastomers, it has a higher cross-linking density after complete curing, but it will cause higher internal stress on the body. ; Simultaneously, the shrinkage rate exceeds 10%, which causes the presence of higher shrinkage force on t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J11/04C09J11/06
CPCC09J4/00C09J11/04C09J11/06
Inventor 王大光吉明磊陈翠萍
Owner TECHSTORM MATERIAL TECH SHANGHAI CO LTD
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