Polyamic acid solution, and polyimide film and applications thereof

A technology of polyimide film and polyamic acid, which is applied in the field of polyimide film and polyamic acid solution, can solve the mismatch of film heat resistance, dimensional stability and mechanical performance process requirements, polyamic acid slurry Solve problems such as high solid content of the material and cannot meet the requirements of panel coating, etc., to achieve the effects of improving molecular structure stability, improving process performance and reducing viscosity

Active Publication Date: 2020-05-01
BEIJING SINEVA TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The solid content of the polyamic acid slurry prepared by the invention is too high, which will cause high viscosity and cannot meet the coating requirements of the panel production line process, and it is difficult to adjust the film thickness during the coating process
[0006] Therefore, a high-solid content, low-viscosity polyamic acid slurry was developed to solve slurry viscosity, solid content, film heat resistance, dimensional stability and mechanical The problem of mismatch between performance and flexible display process equipment and process requirements is the focus of current research in this field

Method used

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  • Polyamic acid solution, and polyimide film and applications thereof
  • Polyamic acid solution, and polyimide film and applications thereof
  • Polyamic acid solution, and polyimide film and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Add 5.67g of diamine compound B1 and 95g of N-methylpyrrolidone into the reaction flask respectively, start the mechanical stirring, replace the air in the flask with nitrogen, and place the system in an ice-water bath after the monomers are completely dissolved. Add 14.7g of A2 to the mixed solution in 4 times, and control the reaction temperature not to exceed 15°C. After the addition, the system naturally returns to room temperature and stirs for 6h, then adds 0.41g of compound C1, and continues stirring for 18h at room temperature to obtain a solid content of 18wt%. Polyamic acid solution (PAA1). The viscosity of the polyamic acid solution at 25° C. was tested to be 4800 cP.

Embodiment 2

[0067] Add 5.535g of diamine compound B1 and 94g of N-methylpyrrolidone into the reaction flask, turn on the mechanical stirring, replace the air in the flask with nitrogen, and add 1.0g of SiO 2 Inorganic nanoparticles (particle size: 20nm), after stirring for 30 minutes, place the system in an ice-water bath, add 14.7 g of A2 to the above mixed solution in 4 times, control the reaction temperature not to exceed 15°C, and the system will naturally return to room temperature after the addition Stir at low temperature for 6 h, then add 0.30 g of compound C, and continue stirring at room temperature for 18 h to obtain a polyamic acid solution (PAA2) with a solid content of 18 wt%. The viscosity of the polyamic acid solution at 25° C. was tested to be 7100 cP.

Embodiment 3

[0069] Add 3.89g of diamine compounds B1, 4.02g of B3 and 105g of N-methylpyrrolidone into the reaction flask respectively, start the mechanical stirring, replace the air in the flask with nitrogen, and add 1.1g of SiO 2 Inorganic nanoparticles (particle size: 20nm), after stirring for 30 minutes, put the system in an ice-water bath, add A13.27g and A2 10.29g to the above mixed solution in 4 times, control the reaction temperature not to exceed 15°C, after the addition, the system Naturally return to room temperature and stir for 6 hours, then add 0.38 g of compound C3, and continue stirring at room temperature for 18 hours to obtain a polyamic acid solution (PAA3) with a solid content of 18 wt%. The viscosity of the polyamic acid solution at 25° C. was tested to be 7800 cP.

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Abstract

The invention provides a polyamic acid solution, and a polyimide film and applications thereof, wherein the polyamide acid solution is prepared from the following raw materials: an aromatic tetracarboxylic dianhydride monomer, an aromatic diamine monomer, a polycarboxylic acid compound and a solvent. The polyamide acid solution prepared by the method has the characteristics of high solid content and low viscosity, has excellent casting film-forming performance, and is particularly suitable for a solution printing process. The polyimide film formed by the polyamic acid solution prepared by themethod has high heat resistance, low thermal expansion coefficient and good mechanical properties, and is suitable for being used as a flexible substrate in a display panel.

Description

technical field [0001] The invention belongs to the technical field of flexible display, and specifically relates to a polyamic acid solution, a polyimide film and applications thereof. Background technique [0002] With the rapid development of intelligent display terminals in the direction of thinning, high-definition, bendable, curly, and foldable, flexible display has gradually become an important mainstream display technology for intelligent display terminals, and is widely used in smartphones, wearable devices, In the field of display such as large-size TV. In flexible display devices, flexible substrates are the key materials for realizing flexible displays. Flexible substrates are used to replace traditional rigid glass substrates to realize display forms such as bending, folding and curling of display terminals. Among various flexible display substrate materials, polyimide has become an important class of display substrate materials due to its good heat resistance,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08C08K3/36
CPCC08G73/1067C08G73/1042C08G73/1071C08G73/1007C08G73/105C08J5/18C08J2379/08C08K3/36C08K2201/003C08K2201/011Y02E10/549
Inventor 吴京玮王雪岚李琳
Owner BEIJING SINEVA TECH
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