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Mask slurry and preparation method thereof

A paste and mask technology, used in metal material coating process, ion implantation plating, coating and other directions to achieve good printing performance, excellent thixotropic performance, and excellent anti-settling effect.

Inactive Publication Date: 2020-05-05
CHAOZHOU THREE CIRCLE GRP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The solvents in the emulsion system are water and ethanol, which evaporate quickly and are not suitable for long-term printing operations on the production line

Method used

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  • Mask slurry and preparation method thereof
  • Mask slurry and preparation method thereof
  • Mask slurry and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] An embodiment of the masking slurry of the present invention, the components and amounts of the masking slurry described in this embodiment are shown in Table 1. At least one of the inorganic powders A is used after hydrophilic treatment. The hydrophilic treatment operation is: adsorb, coat or coat the surface of powder particles with water-soluble polymers such as polyethylene glycol, polyvinyl alcohol, and acrylic acid polymers, so that the powder is hydrophilic.

[0037] The preparation method of the mask slurry described in this embodiment is:

[0038] (1) Preparation of the organic vehicle: add the solid resin into the organic solvent and mix evenly, fully stir and dissolve completely, and filter through a 250-325 mesh screen to obtain the organic vehicle for use;

[0039] (2) Preparation of mask slurry: Add the organic carrier, inorganic powder A, inorganic powder B, and pigment obtained in step (1) into a mixing tank for mixing, and then roll through a three-rol...

Embodiment 2～28

[0041] The components and dosages of the masking pastes described in Examples 2-28 are shown in Table 1. The preparation method of the masking pastes described in Examples 2-28 is the same as that of Example 1.

Embodiment 3

[0067] In Example 3 and Examples 12-22, the mass percentages of each component are the same, the specific substances of solid resin, organic solvent, inorganic powder B, and pigment are the same, and only the selected substances of inorganic powder A are different. It can be seen from Table 3 that the mask paste prepared in Example 3 has the best printing performance, washing ability and dry film adhesion; that is, when the inorganic powder A is silicon oxide and bentonite, the mask paste has the best Excellent printing performance, washing ability, dry film adhesion.

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Abstract

The invention relates to mask slurry and a preparation method thereof, and belongs to the technical field of chemical materials. The mask slurry comprises the following components (by mass): 1%-12% ofsolid resin, 20%-60% of an organic solvent, 30%-70% of inorganic powder A, 0%-40% of inorganic powder B and 0%-5% of a pigment. In a mask slurry system, the dosage, the particle size and the morphology of the inorganic powder A are limited; meanwhile, compounding with solid resin, an organic solvent, inorganic powder B and a pigment, the inorganic powder A can form hydrogen bonds with the polar solvent and the resin so as to form a cross-linked network structure, so that the mask slurry has good printing performance, washing performance, dry film adhesive force and volatile performance and excellent thixotropic performance under the condition that an organic thixotropic agent is not added.

Description

technical field [0001] The invention relates to a mask slurry and a preparation method thereof, belonging to the technical field of chemical materials. Background technique [0002] With the advent of the era of mechanical automation production, mass production and assembly line operation of electronic components has become an inevitable trend. In order to improve the market competitiveness of products, it is necessary to reduce costs. Generally, the easiest way to reduce the cost is to reduce the thickness of the film layer. In the prior art, the cost can be reduced more effectively through the sputtering forming process. Therefore, a new type of masking slurry is needed, which can protect the parts that do not need to be sputtered during the sputtering forming process, and after the sputtering is completed, the masking slurry on the parts that do not need to be sputtered is cleaned, thereby Get the desired product. [0003] The patent with publication number CN106384634...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D1/00C09D7/65C09D7/61C23C14/04
CPCC09D1/00C23C14/042C09D7/61C09D7/65
Inventor 邱基华黄雪云
Owner CHAOZHOU THREE CIRCLE GRP
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