Wet harmless extraction process for metal in waste mobile phone circuit board
An extraction process and circuit board technology, which is applied in the field of wet and harmless extraction of metals from waste mobile phone circuit boards, can solve the problems of complex structural components, reduced recovery rate of precious metals, low recovery rate of precious metals, etc.
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[0045] In order to make the technical purpose, technical solution and beneficial effect of the present invention clearer, the technical solution of the present invention will be further described below in conjunction with specific embodiments.
[0046] The invention provides a wet harmless extraction process for metals in waste mobile phone circuit boards, which comprises the following steps:
[0047] 1. Dismantling of waste mobile phone circuit boards: first remove the electronic components on the waste mobile phone printed circuit boards, collect them by category, collect IC chips and SMD components separately, and wait for shredding, and remove the light boards of IC chips and SMT components Standby for gold stripping recycling;
[0048] 2. Crushing and ball milling of IC chips and components
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