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Machining method of high-precision superhard-abrasive integral abrasive cutting wheel

A technology for cutting grinding wheels and super-hard abrasives, applied in abrasives, bonded grinding wheels, metal processing equipment, etc., can solve problems such as low efficiency, low yield, operating conditions and environmental pollution, and reduce deformation and damage. The effect of improving and improving the processing yield

Active Publication Date: 2020-05-22
北京道天技术研发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a high-precision superabrasive integral cutting wheel in view of the problems of low efficiency, low yield, easy operation conditions and environmental pollution when the grinding process is used to process thin cutting wheels in the prior art processing method

Method used

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  • Machining method of high-precision superhard-abrasive integral abrasive cutting wheel
  • Machining method of high-precision superhard-abrasive integral abrasive cutting wheel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Manufacture of cutting wheels with a thickness of 0.3mm, which are made of metal bond and diamond sintered blanks

[0053] A. Use a blank with a thickness of 0.35mm, and the parallelism of the two surfaces of the blank AB is 0.02mm; use a ratio measuring platform and a dial gauge to measure the original thickness and parallelism accuracy of the blank one by one, and make a good mark and record;

[0054] Rosin is used as a thermoplastic material, and alumina ceramic is used as a fixed carrier. It is ground by a precision CNC horizontal axis round table surface grinder; the grinding wheel is 180 mesh green silicon carbide, its width is 6mm, and its hardness is L-level;

[0055] B. Heat the alumina ceramic carrier on the heating platform at a heating temperature of 150-200°C. Coat the hot thermoplastic material rosin on the carrier, put the B surface of the blank on the coated rosin and connect with the carrier, and let it stand for 2 minutes. Move the carrier as a whole to the p...

Embodiment 2

[0062] Processing and manufacturing 0.3mm cutting wheels. The cutting wheel material is ceramic bond and diamond sintered blank;

[0063] A. A blank with a thickness of 0.35mm is used, and the parallelism of the AB sides is 0.03mm.

[0064] Solid wax is used as a thermoplastic material, and silicon carbide ceramic is used as a fixed carrier: a vertical precision round-table grinding machine is used for grinding; the grinding wheel is made of 240 mesh single crystal corundum, the hardness is G level, and the structure is a 4mm single ring grinding wheel;

[0065] B. Heat the silicon carbide ceramic carrier through the heating platform at a heating temperature of 90-140°C, apply the solid wax to the carrier, and place the blank on the coated solid wax. The surface B is used as the fixed surface and let it stand for 2 minutes. Move the carrier as a whole to the pressurizing device, apply 400kgf to the carrier, fixing material, and cutting wheel blank as a whole, and cool to room temper...

Embodiment 3

[0071] Manufacturing a cutting wheel with a thickness of 0.05mm, the cutting wheel is made of metal bond and diamond sintered blank

[0072] Using a blank with a thickness of 0.1mm, the parallelism of the two sides of the blank AB is 0.03mm;

[0073] Thermoplastic adhesive such as JY-1 is used as a thermoplastic material, and zirconia ceramic is used as a fixed carrier: horizontal precision grinding machine is used for grinding; the grinding wheel particle size is 240 mesh, the hardness of green silicon carbide is K grade, and its width is 12mm single ring structure Grinding wheel,;

[0074] The heating temperature of the carrier is 90-140℃, the linear speed of the grinding wheel is 10m / s, the feed speed is 0.3um / s, and the grinding wheel feed is 0.2mm;

[0075] When the two sides are alternately processed, the feed speed is 0.1um / s, and the grinding wheel feed is 0.05mm;

[0076] The cutting wheel with a thickness of 0.05mm obtained by the above method has a thickness uniformity of 0....

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Abstract

The invention provides a machining method of a high-precision superhard-abrasive integral abrasive cutting wheel. The problems that in the prior art, when a grinding process is adopted for machining athin abrasive cutting wheel, efficiency is low, the rate of finished products is low, and operation condition and environment pollution are likely to be caused are solved. The method is characterizedin that the abrasive cutting wheel is a sintered body formed by blending a binding agent and a superhard abrasive material, an abrasive cutting wheel blank is fixed to a carrier through a thermoplastic material, then the carrier is fixed to a workbench of a grinding machine tool, material removing machining is conducted on the blank through an abrasion wheel grinding method, and a finished product with the needed form and location tolerance and size precision is obtained, the abrasion wheel is a common abrasive grinding wheel, by the adoption of the machining method of the high-precision superhard-abrasive integral abrasive cutting wheel, deformation and damage of the abrasive cutting wheel are reduced, the machining yield is increased, and an unexpected technical effect is achieved.

Description

Technical field [0001] The invention relates to the technical field of manufacturing high-precision thin super-hard abrasive abrasive tools, in particular to a high-precision integral cutting grinding wheel processing method. Background technique [0002] The high-precision integral cutting wheel is commonly known as "scribing knife" or soft knife. It is widely used in cutting precision materials such as optical glass, semiconductor materials, and magnetic materials. It has the characteristics of high cutting accuracy and small incisions. The cutting wheel used in this type of grinding wheel generally has a thickness of 0.1mm-0.5mm, and the thinnest is up to 0.05mm. The thickness uniformity of the product is required to be less than or equal to 0.01mm, and the warpage deformation is less than 0.2mmm, so it is called the cutting used for this type of grinding wheel. The grinding wheel is a high-precision super-abrasive monolithic cutting wheel. The material is generally a sintered...

Claims

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Application Information

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IPC IPC(8): B24D18/00B24D5/06B24D5/12
CPCB24D18/0009B24D18/0072B24D5/06B24D5/12
Inventor 林东高天一
Owner 北京道天技术研发有限公司
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