Polyimide film with high transparency and high surface hardness and preparation method thereof

A technology of polyimide film and surface hardness, applied in the field of polyimide film and its preparation, can solve the problem of poor compatibility between inorganic filler and polymer matrix, increased haze of polyimide film, and difficulty in uniform dispersion. and other problems to achieve the effects of improving compatibility and dispersion, improving surface hardness and high light transmittance

Inactive Publication Date: 2020-05-29
WUXI CHUANGCAI OPTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the introduction of inorganic particles often leads to an increase in the haze of the polyimide film, which is mai

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] At room temperature, add 890 g of N,N-dimethylacetamide and 0.7576 g of polyphenylsilsesquioxane microspheres (average particle size 0.05 μm) to the reactor, stir rapidly until uniformly dispersed; ℃, under the protection of nitrogen, add 152.11g (0.475mol) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl and 3.80g (0.025mol) 3,5-diaminobiphenyl to the system Benzoic acid; after it dissolves, add 222.12g (0.50mol) of 4,4-hexafluoroisopropylphthalic anhydride, and react for 48 hours to prepare a polyamic acid solution. The solid content of the polyimide resin in the reaction system is about 30wt%, and the viscosity at 25°C is 4.9×10 5 cP.

[0030] The above-prepared polyamic acid solution was coated on a glass substrate, dried at 180°C for 60 minutes, then gradually raised to 380°C within 40 minutes, dried for 30 minutes, and lowered to room temperature to prepare a film with a thickness of 50 μm. The mass percentage of polyphenylsilsesquioxane microspheres contained in ...

Embodiment 2

[0032] At room temperature, add 840 g of N,N-dimethylacetamide and 3.6619 g of polyphenylsilsesquioxane microspheres (average particle size 0.05 μm) into the reactor, and stir rapidly until uniformly dispersed; , Under nitrogen protection, add 144.10g (0.45mol) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl and 7.61g (0.05mol) 3,5-diaminobenzene to the system Formic acid; after it dissolves, add 199.91g (0.45mol) of 4,4-hexafluoroisopropylphthalic anhydride and 10.91g (0.05mol) of pyromellitic dianhydride, and react for 24 hours to obtain a polyamic acid solution . The solid content of the polyimide resin in the reaction system is about 30wt%, and the viscosity at 25°C is 1.3×10 6 cP.

[0033]The above-prepared polyamic acid solution was coated on a glass substrate, dried at 180°C for 60 minutes, then gradually raised to 380°C within 40 minutes, dried for 30 minutes, and lowered to room temperature to prepare a film with a thickness of 50 μm. The mass percent of polyphenyls...

Embodiment 3

[0035] At room temperature, add 870g of N,N-dimethylacetamide and 1.8743g of polyphenylsilsesquioxane microspheres (average particle size 0.05μm) into the reactor, and stir rapidly until uniformly dispersed; , Under nitrogen protection, 32.02g (0.10mol) 3,3'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 110.48g (0.345mol) 2,2'-bis( Trifluoromethyl)-4,4'-diaminobiphenyl and 8.37g (0.055mol) 3,5-diaminobenzoic acid; add and add 222.12g (0.50mol) 4,4-hexafluoro Isopropyl phthalic anhydride, polyamic acid solution was prepared after 18 hours of reaction. The solid content of the polyimide resin in the reaction system is about 30wt%, and the viscosity at 25°C is 7.8×10 5 cP.

[0036] The above-prepared polyamic acid solution was coated on a glass substrate, dried at 180°C for 60 minutes, then gradually raised to 380°C within 40 minutes, dried for 30 minutes, and lowered to room temperature to prepare a film with a thickness of 50 μm. The mass percent of polyphenylsilsesquioxane mic...

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Abstract

The invention relates to a polyimide film with high transparency and high surface hardness and a preparation method thereof. The polyimide film has the characteristics of high transparency and high surface hardness and contains 0.2-5wt% of polyphenyl silsesquioxane microspheres, and the polyimide molecular structure contains a bis(trifluoromethyl) biphenyl unit and a carboxyl functional group. Asthe polyphenyl silsesquioxane microspheres have good interface interaction with carboxyl in a polyimide structure, the compatibility and dispersity between particles and matrix resin are effectively improved. The prepared polyimide film shows high optical light transmittance, low haze and high surface hardness, so that the polyimide film can be applied to the fields of electronics and optical display.

Description

technical field [0001] The invention relates to a polyimide film with high transparency and high surface hardness and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] Because of its unique temperature resistance, mechanical properties, insulation properties, solvent resistance, etc., polyimide is widely used in the fields of electronics and microelectronics industries, such as intermediate insulating dielectric layers and shielding protection for large-scale integrated circuits layers etc. However, due to the high density of the aromatic structure of polyimide, the film is usually brown or yellow, has low light transmittance in the visible light region and has a high refractive index, so it cannot be used in the field of optical devices that require high light transmittance. . [0003] In order to reduce the luster of the polyimide film and improve the light transmittance, a large number of studies have focused on the...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L83/04C08J5/18
CPCC08J5/18C08J2379/08C08J2483/04
Inventor 周浪
Owner WUXI CHUANGCAI OPTICAL MATERIALS
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