Transparent polyimide film and preparation method thereof

A technology of polyimide film and transparent polyimide, applied in the field of transparent polyimide film and its preparation, can solve the problems of increased expansion or shrinkage, influence of electronic device performance, and high polyimide film , to reduce thermal expansion coefficient, improve thermal dimensional stability and mechanical modulus, and make film formation easier

Inactive Publication Date: 2020-05-29
WUXI CHUANGCAI OPTICAL MATERIALS
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the practical application of flexible display and other fields, in addition to high light transmittance, polyimide film has a high thermal expansion coefficient and low modulus, which also leads to the use of flexible display devices such as TFT-LCD and OLED. many problems
For example, under the situation that polyimide film has high transparency but thermal expansi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transparent polyimide film and preparation method thereof
  • Transparent polyimide film and preparation method thereof
  • Transparent polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example 1

[0035] (1) Disperse 0.095g small particle size silica (particle size: 10nm) and 0.0094g large particle size silica (particle size: 30nm) uniformly in 0.4176g N,N-dimethylacetamide, Prepare a silica sol. Put it into a three-necked flask, continue to add 0.125g heptafluoropentyltriethoxysilane, turn on stirring and heat to 100°C, stop heating after 2h reaction, and drop to room temperature.

[0036] (2) Add 910g of N,N-dimethylacetamide and 96.07g (0.3mol) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl to the above reaction system, After dissolving, add 133.27g (0.3mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, control the reaction temperature at 0-30°C, and react for 6 hours to prepare a polyamic acid solution. The solid content of the system is adjusted to be about 20% by weight, and the viscosity at 25°C is 140,000 cP.

[0037] (3) The polyamic acid solution prepared above was coated on a glass substrate, dried at 180° C. for 20 minutes, and...

Example Embodiment

[0038] Example 2

[0039] (1) Disperse 2.00g of small particle size silica (particle size: 5nm) and 0.04g of large particle size silica (particle size: 10nm) uniformly in 8.164g of N,N-dimethylacetamide, Prepare a silica sol. Put it into a three-necked flask, continue to add 2.449 g of perfluorooctylethyltriethoxysilane, turn on the stirring and heat to 100°C, stop heating after 2 hours of reaction, and drop to room temperature.

[0040] (2) Add 820g of N,N-dimethylacetamide, 100.27g (0.3mol) 2,2'-bis(4-aminophenyl)hexafluoropropane to the above reaction system, and add 119.94g after dissolving (0.27mol) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, controlling the reaction temperature at 0-30°C, and reacting for 6 hours to prepare a polyamic acid solution. The solid content of the system is adjusted to be about 20wt%, and the viscosity at 25°C is 100000 cP.

[0041] (3) The polyamic acid solution prepared above was coated on a glass substrate, dried at 180° C. for 20...

Example Embodiment

[0042] Example 3

[0043] (1) Disperse 0.618g of small particle size silica (particle size: 10nm) and 0.031g of large particle size silica (particle size: 20nm) uniformly in 2.596g of N,N-dimethylacetamide, Prepare a silica sol. Put it into a three-necked flask, continue to add 0.779g heptafluoropentyltriethoxysilane, turn on the stirring and heat to 100°C, stop heating after 2 hours of reaction, and drop to room temperature.

[0044] (2) Add 850g of N,N-dimethylacetamide, 155.53g (0.3mol) 2,2'-bis[4(3-aminophenoxy)phenyl)]hexafluoropropane to the above reaction system After dissolving, add 17.65g (0.06mol) biphenyltetracarboxylic dianhydride, 111.06g (0.25mol) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, and control the reaction temperature at 0 ~30℃, after 6h reaction, a polyamic acid solution is prepared. Adjust the solid content of the system to be about 20wt%, and the viscosity at 25°C is 80,000 cP.

[0045] (3) The polyamic acid solution prepared above was coa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a transparent polyimide film and a preparation method thereof. The polyimide film has the characteristics of low expansion, high modulus, high transparency and the like, and is characterized by containing fluorine-containing siloxane grafted modified silicon dioxide particles with different particle sizes. The structural formula of the fluorine-containing siloxane is shownin the specification, and in the formula, X is Cl or any one of methoxyl, ethoxyl and alkyl with 1-10 carbon atoms; and R is a fluorine-containing alkyl group with 1-20 carbon atoms. Due to the factthat the fluorine-containing siloxane grafted modified silicon dioxide particles and the fluorine-containing polyimide matrix resin have good compatibility and dispersity, the prepared polyimide filmis low in thermal expansion coefficient, high in mechanical modulus and excellent in optical light transmittance and can be applied to the fields of flexible display, microelectronics and the like.

Description

technical field [0001] The invention relates to a transparent polyimide film and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] Because of its unique temperature resistance, mechanical properties, insulation properties, solvent resistance, etc., polyimide is widely used in the fields of electronics and microelectronics industries, such as intermediate insulating dielectric layers and shielding protection for large-scale integrated circuits layers etc. However, due to the high density of the aromatic structure of polyimide, the film is usually brown or yellow, has low light transmittance in the visible light region and has a high refractive index, so it cannot be used in the field of optical devices that require high light transmittance. . [0003] In order to reduce the luster of the polyimide film and improve the light transmittance, a large number of studies have focused on the structural improvement of polyimide,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L79/08C08K9/06C08K3/36C08J5/18
CPCC08J5/18C08J2379/08C08K9/06C08K3/36C08K2201/003C08K2201/014
Inventor 周浪
Owner WUXI CHUANGCAI OPTICAL MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap