Efficient and uniform heat conduction polymer-based heat conduction material and preparation method thereof

Abstract

The invention discloses an efficient and uniform heat conduction polymer-based heat conduction material and a preparation method thereof. The efficient and uniform heat conduction polymer-based heat conduction material is composed of a polymer matrix material and a heat-conducting filler, the heat-conducting filler is of a multi-orientation network structure; according to the multi-orientation network structure, in the vertical direction, the heat-conducting filler is vertically oriented along a longitudinal axis, andin the horizontal direction, the heat-conducting filler is longitudinally oriented, namely oriented from the surrounding to the center. The preparation method comprises the following steps: putting a precursor slurry prepared from the heat-conducting filler and an adhesive into a specific multi-orientation freeze casting mold, carrying out freeze drying to obtain a filler skeleton with a multi-orientation structure, finally putting the filler skeleton into a polymer melt or a precursor, and carrying out vacuum impregnation, thereby obtaining the product. The efficient and uniform heat conduction polymer-based heat conduction materialprovided by the invention has a multi-orientation network structure, and can realize high heat conductivity coefficients in-plane and out-plane directions at the same time under low filling content.

Description

technical field [0001] The invention belongs to the technical field of heat management materials, and relates to a high-efficiency and uniform heat-conducting polymer-based heat-conducting material and a preparation method thereof. Background technique [0002] With the trend of high power and miniaturization of electronic devices, these devices will generate a lot of heat during use. If they cannot be dissipated in a timely and effective manner, the rise in device temperature will not only lead to a decline in its performance, but will also accelerate its performance. Component aging or even failure. Simultaneous packaging of thermal management materials with efficient heat transfer capabilities and electronic devices is an effective way to solve this problem. [0003] Polymer-based thermal management materials have good development potential because of their good insulation, easy processing, and low cost, but they are limited by their low thermal conductivity. To improve...

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Problems solved by technology

However, the orientation structures reported so far can only achieve the orientation of fillers in one direction, such as vertical orientation or parallel orientation (ACS Appl. Mater. Inter. 2017, 9, 22977-22984; Adv. Funct. Mater. 2019, 29, 1900412)

However, when the thermal conductivity along the orientation direction is increased, the thermal conductivity perpendicular to the orientation direction will inevitably decrease significantly (Compos. Inhomogeneous conduction inside

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