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High-strength high-thermal-conductivity polyimide composite film and preparation method thereof

A technology of polyimide and composite film, which is applied in the field of high-strength and high-thermal-conductivity polyimide composite film and its preparation. Intertwining and other problems, to prevent accumulation and agglomeration, improve mechanical strength and thermal conductivity, and excellent mechanical strength

Inactive Publication Date: 2020-06-12
太湖方舟新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, carbon nanotubes have electrical conductivity, and the increase of the doping amount will reduce the insulating performance of polyimide film; moreover, carbon nanotubes are easy to entangle and agglomerate, and the improvement of the mechanical properties of the film is limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A preparation method of high strength and high thermal conductivity polyimide composite film, comprising the steps of:

[0027] S1. Add carbon nanotubes and flaky hexagonal boron nitride into N-methylpyrrolidone, and disperse evenly by ultrasonic to obtain a mixed dispersion with a solid content of 4%, wherein the weight ratio of carbon nanotubes to flaky hexagonal boron nitride is is 1:0.4;

[0028] S2. Under the protection of nitrogen, add pyromellitic dianhydride and 4,4'-diaminodiphenyl ether into N-methylpyrrolidone at a molar ratio of 1:1 to carry out polycondensation reaction, and obtain a compound with a solid content of 14%. Polyamic acid solution;

[0029] S3. Mix the mixed dispersion liquid with the polyamic acid solution evenly, and then coat it on the substrate. After drying and thermal imidization, a high-strength and high-thermal-conductivity polyimide composite film is obtained, wherein the mixed dispersion liquid and polyamide The weight ratio of the ...

Embodiment 2

[0031] A preparation method of high strength and high thermal conductivity polyimide composite film, comprising the steps of:

[0032] S1. Add surface carboxylated carbon nanotubes and flaky hexagonal boron nitride into N-methylpyrrolidone, and ultrasonically disperse evenly to obtain a mixed dispersion with a solid content of 4%, wherein the surface carboxylated carbon nanotubes The weight ratio to flake hexagonal boron nitride is 1:0.4;

[0033] S2. Under the protection of nitrogen, add pyromellitic dianhydride and 4,4'-diaminodiphenyl ether into N-methylpyrrolidone at a molar ratio of 1:1 to carry out polycondensation reaction, and obtain a compound with a solid content of 14%. Polyamic acid solution;

[0034] S3. Mix the mixed dispersion liquid with the polyamic acid solution evenly, and then coat it on the substrate. After drying and thermal imidization, a high-strength and high-thermal-conductivity polyimide composite film is obtained, wherein the mixed dispersion liqui...

Embodiment 3

[0037] A preparation method of high strength and high thermal conductivity polyimide composite film, comprising the steps of:

[0038] S1. Add carbon nanotubes and surface hydroxylated flaky hexagonal boron nitride into N-methylpyrrolidone, and disperse them uniformly by ultrasonic to obtain a mixed dispersion with a solid content of 4%, in which carbon nanotubes and surface hydroxylated The weight ratio of flake hexagonal boron nitride is 1:0.4;

[0039] S2. Under the protection of nitrogen, add pyromellitic dianhydride and 4,4'-diaminodiphenyl ether into N-methylpyrrolidone at a molar ratio of 1:1 to carry out polycondensation reaction, and obtain a compound with a solid content of 14%. Polyamic acid solution;

[0040] S3. Mix the mixed dispersion liquid with the polyamic acid solution evenly, and then coat it on the substrate. After drying and thermal imidization, a high-strength and high-thermal-conductivity polyimide composite film is obtained, wherein the mixed dispersi...

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Abstract

The invention discloses a high-strength high-thermal-conductivity polyimide composite film and a preparation method thereof. The preparation method comprises the following steps: S1, adding carbon nanotubes and flaky hexagonal boron nitride into a solvent, performing ultrasonic dispersion to be uniform, and obtaining mixed dispersion liquid; S2, adding dianhydride and diamine into the solvent forcondensation polymerization to obtain a polyamide acid solution under the protection of nitrogen; and S3, uniformly mixing the mixed dispersion liquid with the polyamic acid solution, then coating a substrate with the mixed solution and carrying out drying and thermal imidization to obtain the high-strength high-thermal-conductivity polyimide composite film. The prepared polyimide composite film has excellent mechanical strength and thermal conductivity, the insulating property meets the use requirements, the use performance of the polyimide film is effectively improved and the application range of the polyimide film is effectively widened.

Description

technical field [0001] The invention relates to the technical field of insulating materials, in particular to a polyimide composite film with high strength and high thermal conductivity and a preparation method thereof. Background technique [0002] Polyimide is a polymer produced by polycondensation of dianhydride and diamine. It has excellent thermal stability, radiation resistance, mechanical strength and dielectric properties, and is widely used in the field of electronic components. At present, polyimide film is mainly used in electronic and circuit insulation substrates. Due to the high integration of electronic components and large heat dissipation, if the thermal conductivity of the insulating substrate is not good, the heat is difficult to dissipate, which will seriously affect the operation stability and safety factor of electronic components. With the advancement of technology, in some high-end electrical and electrical equipment fields, higher requirements are p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/04C08K9/02C08K7/00C08K3/38C08J5/18C08G73/10C09K5/14
CPCC08J5/18C08G73/1071C08G73/1067C09K5/14C08J2379/08C08K3/041C08K9/02C08K7/00C08K2003/385C08K2201/003
Inventor 方晓栋宋丽英
Owner 太湖方舟新材料科技有限公司
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