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Strong acid corrosion resistant negative photoresist composition

A negative photoresist, strong acid resistance technology, applied in the field of photoresist, to achieve the effect of improving production environment, reducing production cost, good acid corrosion resistance and chemical stability

Pending Publication Date: 2020-06-19
SUNTIFIC MATERIALS WEIFANG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a negative photoresist composition resistant to strong acid corrosion to solve the technical problem that the preparation and use of cyclized rubber-based photoresists inevitably need to contact toxic organic solvents such as xylene

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A negative photoresist composition resistant to strong acid corrosion, its composition is as shown in Table 1 below;

[0018] Table 1: Components of the negative photoresist composition I resistant to strong acid corrosion

[0019] Phenolic Resin 100g Melamine 2.0g Triphenylhexafluoroantimonate 50g Propylene Glycol Methyl Ether 100g

[0020] A photolithographic process of a strong acid corrosion-resistant negative photoresist composition, comprising the following steps:

[0021] (1) Mix phenolic resin, melamine, triphenylhexafluoroantimonate and propylene glycol methyl ether in proportion, and after fully dissolving, filter with a filter membrane with a pore size of 0.2 microns to obtain a photoresist solution;

[0022] (2) Spin-coat the photoresist prepared by the above components on the treated substrate, pre-bake (PAB) 100°C / 120s with a hot plate, adjust the speed so that the film thickness after drying is 10 μm, and pass through the ...

Embodiment 2

[0027] A negative photoresist composition resistant to strong acid corrosion, its composition is as shown in Table 2 below;

[0028] Table 2: Components of the negative photoresist composition II resistant to strong acid corrosion

[0029] Phenolic Resin 50g Benzomelamine 0.5g Diphenyl-p-benzylidene triflate 20g Propylene glycol methyl ether acetate 47g

[0030] A photolithographic process of a strong acid corrosion-resistant negative photoresist composition, comprising the following steps:

[0031] (1) Mix phenolic resin, benzomelamine, diphenyl-p-benzylidene trifluoromethanesulfonate and propylene glycol methyl ether acetate in proportion. After fully dissolving, filter with a filter membrane with a pore size of 0.2 microns to obtain light Resist solution;

[0032] (2) Spin-coat the photoresist prepared by the above components on the treated substrate, pre-bake (PAB) 100°C / 90s with a hot plate, adjust the speed so that the film thickness aft...

Embodiment 3

[0037] A negative photoresist composition resistant to strong acid corrosion, its composition is as shown in the following table three;

[0038] Table 3: Components of strong acid corrosion resistant negative photoresist composition III

[0039] Phenolic Resin 30g Melamine Derivatives 0.8g Diphenyliodohexafluorophosphate 20g Propylene glycol methyl ether acetate 40g

[0040] A photolithographic process of a strong acid corrosion-resistant negative photoresist composition, comprising the following steps:

[0041] (1) Mix phenolic resin, melamine derivatives, diphenyl iodine hexafluorophosphate and propylene glycol methyl ether acetate in proportion, and after fully dissolving, filter with a filter membrane with a pore size of 0.2 microns to obtain a photoresist solution;

[0042] (2) Spin-coat the photoresist prepared by the above components on the treated substrate, pre-bake (PAB) 100°C / 60s with a hot plate, adjust the speed so that the film th...

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PUM

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Abstract

The invention discloses a strong acid corrosion resistant negative photoresist composition which comprises matrix resin, an acid generator, a cross-linking agent and a solvent, wherein based on the total solid content of photoresist, the amount of the matrix resin accounts for 10-50% of the total solid content, the amount of the acid generator accounts for 10-30% of the total solid content, the amount of the cross-linking agent accounts for 0.4-5% of the total solid content, and the amount of the solvent accounts for 10-55% of the total solid content. The negative photoresist composition is good in adhesion, can bear strong acid corrosive liquid, can replace existing cyclized rubber, does not contain harmful solvents such as dimethylbenzene, the development is carried out by adopting a weakly alkaline aqueous solution, the fixation is carried out by deionized water, the hidden danger of environmental protection is avoided, the production environment is greatly improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to a photoresist, in particular to a negative photoresist composition resistant to strong acid corrosion. Background technique [0002] With the miniaturization of electronic components, micro-electromechanical systems (MEMS) have become a key technology for the production of micro-devices such as micro-machines, sensors, and control circuits, and their integration into chips. Since the integration and manufacture of chips are mostly based on silicon, the wet etching process of silicon, which is the most basic and key technology in silicon substrate processing, is widely used to process various microstructures on silicon substrates, such as Groove structures, membrane structures, cantilever beams, etc. have also been used in the manufacture of many nanostructures in recent years. Among them, the planar etching groove technology is the most widely used. This technology often integrates semiconductor planar technology, mesa techno...

Claims

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Application Information

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IPC IPC(8): G03F7/038G03F7/004
CPCG03F7/038G03F7/004
Inventor 王安栋于凯孙逊运腾立
Owner SUNTIFIC MATERIALS WEIFANG LTD