Multi-component triblock fluorosilicone copolymer electronic protective agent with sequence structure and preparation method thereof

A technology of fluorine-silicon copolymer and three-block, which is applied in the field of multi-component tri-block fluorine-silicon copolymer electronic protective agent and its preparation, and can solve the problems of high fluorine monomer content, difficult coating, and low coating efficiency , to achieve the effect of improving the overall performance, improving the hydrophobic and oleophobic properties of the surface, and being environmentally friendly

Active Publication Date: 2020-06-26
ZIBO YINGQIANG CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, acrylic resin, polyurethane, and epoxy resin are commonly used to coat the surface of electronic products to achieve the purpose of waterproofing, but usually there are high fluorine monomer content, weak hydrophobicity, low coating efficiency, and difficult coating major issues
It has been reported that low-molecular-weight organosilicon or fluorine-based compounds (perfluoropolyether oligomers, etc.) Defects that do not form a coating and gradually become less effective

Method used

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  • Multi-component triblock fluorosilicone copolymer electronic protective agent with sequence structure and preparation method thereof
  • Multi-component triblock fluorosilicone copolymer electronic protective agent with sequence structure and preparation method thereof
  • Multi-component triblock fluorosilicone copolymer electronic protective agent with sequence structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 0.3 g of RAFT reagent 2-[(dodecylsulfanyl)thioacyl]-sulfanyl propionic acid, 0.5 g of 3-trimethoxysilane propyl acrylate, and 10 g of butyl acrylate were mixed with 21 g of perfluorohexanone Mix evenly, raise the temperature to 60°C, add 0.08 g of initiator AIBN, and keep the reaction in a nitrogen atmosphere for 5 hours to obtain a prepolymer with active groups at both ends. At this temperature, a mixed solution composed of 6 g of perfluorobutyl ethyl acrylate and 18 g of perfluorohexanone was added dropwise to carry out a block copolymerization reaction. The dropping time was 4 hours. After cooling to room temperature, a fluorosilicone triblock copolymer solution can be obtained.

Embodiment 2

[0026] 0.35 g of RAFT reagent 2-[(dodecylsulfanyl)thioacyl]-sulfanylpropionic acid, 1.0 g of 3-(methacryloyloxy)propyl]trimethoxysilane, methacrylic acid Mix 8 g of isooctyl ester with 20 g of hydrofluoroether evenly, raise the temperature to 58°C, add 0.10 g of initiator azobisisoheptanonitrile, and keep it in a nitrogen atmosphere for 6 hours to obtain a prepolymerized compound with active groups at both ends. things. At this temperature, a mixed solution consisting of 8 g of trifluorooctyl methacrylate and 20 g of hydrofluoroether was added dropwise to carry out a block copolymerization reaction. The dropwise addition time was 3 hours. After cooling to room temperature, a fluorosilicone triblock copolymer solution can be obtained.

Embodiment 3

[0028]0.4 g of RAFT reagent 2-[(dodecylsulfanyl)thioacyl]-sulfanyl propionic acid, 1 g of 3-acryloyloxypropyltriethoxysilane, and 8 g of hexyl acrylate were mixed with 25 g of six Fluorotoluene was mixed evenly, the temperature was raised to 68°C, 0.08 g of dimethyl azobisisobutyrate was added as an initiator, and the reaction was maintained for 4 hours in a nitrogen atmosphere to obtain a prepolymer with active groups at both ends. At this temperature, a mixed solution composed of 5 g of perfluorohexylethyl acrylate and 16 g of hexafluorotoluene was added dropwise to carry out block copolymerization reaction. The time for the addition was 4 hours. Fluorosilicone triblock copolymer solution can be obtained at room temperature.

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Abstract

The invention provides a multi-component triblock fluorosilicone copolymer with a sequence structure. The multi-component triblock fluorosilicone copolymer has extremely low surface energy, and can beused as an electronic protective agent to coat and modify various electronic components such as printed circuit boards, resistors, capacitors, sensors, display screens, touch screens and the like. Therefore, the multi-component triblock fluorosilicone copolymer has a waterproof effect in a humid environment, and the functional damage caused by water is avoided. According to the invention, trithioester is used as an RAFT reagent; a triblock fluorine-silicon copolymer with a sequence structure can be formed; the fluorine-containing hydrophobic and oleophobic coating has an ordered and controllable structure, can generate a surface micro-phase separation behavior in a film forming process, forms a gradient structure, promotes the enrichment of fluorine-containing chain segments on the surface, remarkably improves the surface hydrophobic and oleophobic properties of the material under the condition of low fluorine content, can improve the adhesive force between the coating and a base material, and has the effect of remarkably improving the comprehensive properties of the coating.

Description

technical field [0001] The invention relates to the technical field of protection of electronic components, in particular to a multi-component triblock fluorosilicon copolymer electronic protection agent with a sequence structure and a preparation method thereof. Background technique [0002] With the advancement of technology, electronic products have become more and more popular in daily life and work, and new electronic products such as smartphones, tablet computers, smart watches and bracelets have been widely used. Electronic products continue to develop towards the direction of stronger functions and more outstanding performance, and new products that are thinner, lighter, more portable, and more intelligent gradually emerge. However, due to the relatively open use environment of electronic products, humidity, corrosion, and water ingress are important factors that cause damage or shorten the life of electronic products. Therefore, focusing on improving the hardware p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F293/00C08F2/38C09D153/00C09D5/16
CPCC08F293/005C08F2/38C09D153/00C09D5/1656C08F2438/03
Inventor 夏伟涛崔应强裴秀君苏克梁福风
Owner ZIBO YINGQIANG CHEM TECH
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