Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method for reinforced copper-based composite wire

A copper-based composite, reinforced technology, applied in conductive materials, conductive materials, metal processing equipment and other directions, can solve the problems of graphene defects, large graphene specific surface area, limited property research and functional development, etc., to reduce defects , the effect of improving quality

Active Publication Date: 2020-06-30
北京碳垣新材料科技有限公司
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Some researchers used the method of graphene oxide reduction to prepare graphene-copper composites, but the performance is not ideal. The graphene prepared by the redox method contains a large number of defects, and the quality needs to be improved. In further property research and functional development Severely limited
In addition, graphene often agglomerates during mechanical mixing due to its large specific surface area and poor wettability with metal surfaces.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method for reinforced copper-based composite wire
  • Preparation method for reinforced copper-based composite wire
  • Preparation method for reinforced copper-based composite wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Example 1 A preparation method of reinforced copper-based composite wire X1

[0030] The method adopts 99.9% pure copper granular powder as a base material, wherein the particle diameter of the granular powder is 75 μm. Specific steps are as follows:

[0031] With methane (CH 4 ) gas as a carbon source, under low pressure conditions, adopt chemical vapor deposition method (CVD method) to grow graphene in situ on the surface of copper powder. Put the container into the CVD furnace and close the furnace tube; use the vacuum pump to continuously pump out the residual air in the furnace, then turn off the vacuum pump and feed the gas, in which the amount of argon is 200Sccm, and the amount of hydrogen is 25Sccm; start to heat up at room temperature, 50min to 1070°C, keep warm After 60 minutes, the carbon source was introduced, and the amount of methane introduced was 2 Sccm. After 30 minutes of growth, the carbon source was turned off, and the temperature began to drop. A...

Embodiment 2

[0039] Example 2 A preparation method of reinforced copper-based composite wire X2

[0040] The method uses 99.9% pure copper flake powder as the base material, wherein the thickness of the flake powder is 20 microns, the longest dimension of the cross-section in the X-axis direction is 50 microns, and the longest dimension of the cross-section in the Y-axis direction is 40 microns. Specific steps are as follows:

[0041] With acetylene (C 2 h 2 ) gas as a carbon source, under low pressure conditions, adopt the chemical vapor deposition method (CVD method) to grow graphene in situ on the surface of copper powder, the specific process is: put the granular copper powder in a suitable container, Put the container into the CVD furnace and close the furnace tube; use a vacuum pump to continuously pump out the residual air in the furnace and then introduce gas, of which the amount of argon is 200Sccm, and the amount of hydrogen is 25Sccm; start to heat up at room temperature, 50mi...

Embodiment 3

[0044] Example 3 A preparation method of reinforced copper-nickel-based composite wire X3

[0045] The invention uses copper-nickel alloy particles as the base material, wherein the particle size of the copper-aluminum alloy is 100 microns. Specific steps are as follows:

[0046] Using liquid ethanol as a carbon source, under low pressure conditions, the chemical vapor deposition method (CVD method) is used to grow graphene in situ on the surface of copper-nickel alloy powder. The specific process is: put the granular copper-nickel alloy powder into a suitable In the container, put the container into a CVD furnace at room temperature, and close the furnace tube; use a vacuum pump to continuously pump out the residual air in the furnace, then turn off the vacuum pump and feed in the gas, wherein the amount of argon is 200 Sccm, and the amount of hydrogen is 25 Sccm; start to heat up at room temperature, The temperature was raised to 1000°C in 40 minutes, and the constant tempe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
tensile strengthaaaaaaaaaa
strengthaaaaaaaaaa
tensile strengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a preparation method for a reinforced copper-based composite wire. The preparation method comprises the following steps of: growing graphene on copper or copper alloy powder by adopting an atmospheric pressure chemical vapor deposition method; compacting the copper or copper alloy powder into an extrusion blank at a room temperature; carrying out hot extrusion to the extrusion blank to form an extrusion rod blank; drawing the extrusion rod blank at the room temperature to obtain a drawing wire; growing the graphene on the surface of the drawing wire by using the atmospheric pressure chemical vapor deposition method; cutting and bundling the drawing wire with the graphene growing on the surface, and repeating the hot extrusion process to the drawing wire and a roomtemperature drawing step for zero to many times; rapidly recrystallizing and continuously annealing to the bundling wire after repeated treatment, and then preparing the reinforced copper-base composite wire. The reinforced copper-based composite wire prepared by the invention has a low defect rate, and can form a graphene reinforced and micro-nano copper wire interpenetrating structure with goodinterface bonding to achieve the high strength and high conductivity target of graphene-copper composite material.

Description

technical field [0001] The invention relates to the technical field of metal composite material preparation, in particular to a method for preparing reinforced copper-based composite wire. Background technique [0002] Copper and copper alloy materials prepared by traditional techniques cannot have both high strength and high conductivity. For example, the current Cu-Ag alloy has a conductivity of 97% IACS, but its tensile strength is only 350MPa; Cu-Cr-Zr alloy has relatively high conductivity. High strength (greater than 500MPa), but conductivity is only 70% IACS. The development of high-performance copper materials with a conductivity exceeding 70% IACS and a strength greater than 500 MPa is of great significance for energy saving, emission reduction, and miniaturization of equipment and devices. [0003] Common methods for improving the strength and conductivity of copper and copper alloys through material compounding usually use particle reinforcement to increase the s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/26C23C16/455B22F1/02B22F1/00B22F3/20C22F1/08H01B13/00H01B1/02H01B1/04B21C37/04
CPCB22F1/0003H01B13/00H01B13/0006H01B13/0016H01B1/02H01B1/026H01B1/04C23C16/26C23C16/4418C23C16/455B22F3/20C22F1/08B21C37/045B22F2003/208B22F1/16
Inventor 李铁军
Owner 北京碳垣新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com