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Preparation method of reinforced copper-based composite wire

A copper-based composite, reinforced technology, applied in conductive materials, conductive materials, metal processing equipment and other directions, can solve the problems of graphene defects, large graphene specific surface area, graphene agglomeration, etc., to avoid dispersion and agglomeration problems, The effect of promoting the homogenization of composition and realizing electromechanical performance

Active Publication Date: 2022-03-29
北京碳垣新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Some researchers used the method of graphene oxide reduction to prepare graphene-copper composites, but the performance is not ideal. The graphene prepared by the redox method contains a large number of defects, and the quality needs to be improved. In further property research and functional development Severely limited
In addition, graphene often agglomerates during mechanical mixing due to its large specific surface area and poor wettability with metal surfaces.

Method used

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  • Preparation method of reinforced copper-based composite wire
  • Preparation method of reinforced copper-based composite wire
  • Preparation method of reinforced copper-based composite wire

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Example 1 A preparation method of reinforced copper-based composite wire X1

[0030] The method adopts 99.9% pure copper granular powder as a base material, wherein the particle diameter of the granular powder is 75 μm. Specific steps are as follows:

[0031] With methane (CH 4 ) gas as a carbon source, under low pressure conditions, adopt chemical vapor deposition method (CVD method) to grow graphene in situ on the surface of copper powder. Put the container into the CVD furnace and close the furnace tube; use the vacuum pump to continuously pump out the residual air in the furnace, then turn off the vacuum pump and feed the gas, in which the amount of argon is 200Sccm, and the amount of hydrogen is 25Sccm; start to heat up at room temperature, 50min to 1070°C, keep warm After 60 minutes, the carbon source was introduced, and the amount of methane introduced was 2 Sccm. After 30 minutes of growth, the carbon source was turned off, and the temperature began to drop. A...

Embodiment 2

[0039] Example 2 A preparation method of reinforced copper-based composite wire X2

[0040] The method uses 99.9% pure copper flake powder as the base material, wherein the thickness of the flake powder is 20 microns, the longest dimension of the cross-section in the X-axis direction is 50 microns, and the longest dimension of the cross-section in the Y-axis direction is 40 microns. Specific steps are as follows:

[0041] With acetylene (C 2 h 2 ) gas as a carbon source, under low pressure conditions, adopt the chemical vapor deposition method (CVD method) to grow graphene in situ on the surface of copper powder, the specific process is: put the granular copper powder in a suitable container, Put the container into the CVD furnace and close the furnace tube; use a vacuum pump to continuously pump out the residual air in the furnace and then introduce gas, of which the amount of argon is 200Sccm, and the amount of hydrogen is 25Sccm; start to heat up at room temperature, 50mi...

Embodiment 3

[0044] Example 3 A preparation method of reinforced copper-nickel-based composite wire X3

[0045] The invention uses copper-nickel alloy particles as the base material, wherein the particle size of the copper-aluminum alloy is 100 microns. Specific steps are as follows:

[0046] Using liquid ethanol as a carbon source, under low pressure conditions, the chemical vapor deposition method (CVD method) is used to grow graphene in situ on the surface of copper-nickel alloy powder. The specific process is: put the granular copper-nickel alloy powder into a suitable In the container, put the container into a CVD furnace at room temperature, and close the furnace tube; use a vacuum pump to continuously pump out the residual air in the furnace, then turn off the vacuum pump and feed in the gas, wherein the amount of argon is 200 Sccm, and the amount of hydrogen is 25 Sccm; start to heat up at room temperature, The temperature was raised to 1000°C in 40 minutes, and the constant tempe...

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Abstract

The invention relates to a method for preparing a reinforced copper-based composite wire, comprising the steps of: growing graphene on copper or copper alloy powder by using an atmospheric pressure chemical vapor deposition method; compacting the copper or copper alloy powder at room temperature into an extrusion billet; hot extruding the extruded billet to form an extruded billet; drawing the extruded billet at room temperature to obtain a drawn wire; adopting an atmospheric pressure chemical vapor deposition method to grow graphene on the surface of the drawn wire; The drawn wires for growing graphene are cut off and clustered, and the hot extrusion process and room temperature drawing steps are repeated zero to multiple times; the clustered wires that have been repeatedly processed are subjected to rapid recrystallization and continuous annealing to make enhanced copper-based Composite wire. The reinforced copper-based composite wire prepared by the invention has a low defect rate, can form a graphene-reinforced and micro-nano copper wire interpenetrating structure with good interface bonding, and achieve the goal of high strength and high conductivity of the graphene-copper composite material.

Description

technical field [0001] The invention relates to the technical field of metal composite material preparation, in particular to a method for preparing reinforced copper-based composite wire. Background technique [0002] Copper and copper alloy materials prepared by traditional techniques cannot have both high strength and high conductivity. For example, the current Cu-Ag alloy has a conductivity of 97% IACS, but its tensile strength is only 350MPa; Cu-Cr-Zr alloy has relatively high conductivity. High strength (greater than 500MPa), but conductivity is only 70% IACS. The development of high-performance copper materials with a conductivity exceeding 70% IACS and a strength greater than 500 MPa is of great significance for energy saving, emission reduction, and miniaturization of equipment and devices. [0003] Common methods for improving the strength and conductivity of copper and copper alloys through material compounding usually use particle reinforcement to increase the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/26C23C16/455B22F1/16B22F1/00B22F3/20C22F1/08H01B13/00H01B1/02H01B1/04B21C37/04
CPCB22F1/0003H01B13/00H01B13/0006H01B13/0016H01B1/02H01B1/026H01B1/04C23C16/26C23C16/4418C23C16/455B22F3/20C22F1/08B21C37/045B22F2003/208B22F1/16
Inventor 李铁军
Owner 北京碳垣新材料科技有限公司
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