Polyimide adhesive film and preparation method and application thereof
A technology of polyimide film and polyimide, which is applied in the direction of adhesive, film/sheet adhesive, film/sheet without carrier, etc., which can solve the problem of high frequency signal transmission loss and dielectric loss High, difficult to accurately control and other issues, to achieve the effect of low dielectric loss, low dielectric constant, low transmission loss
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[0039] The preparation method of the polyimide film in one embodiment of the present invention specifically comprises the following steps:
[0040] S1, preparing a polyamide ester resin solution or a polyamic acid resin solution;
[0041] S2, coating the purified polyamide ester resin solution or polyamic acid resin solution on the surface of the support to form a liquid film; in one embodiment, the support carrier includes polyimide film, polyester film , stainless steel, aluminum foil, glass plate and other smooth-surfaced metal or non-metal support carriers.
[0042] S3, heating the liquid film to obtain a semi-cured adhesive film; in one embodiment, the liquid film is gradually heated to 80-180° C. in a drying tunnel or an oven.
[0043] S4, peeling off the semi-cured adhesive film from the support, fixing the four sides of the semi-cured adhesive film and applying stretching tension, heating at high temperature and then gradually cooling down to room temperature to obtai...
Embodiment 1
[0073] Prepare a 1L three-necked round-bottomed flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 21.411g of 6FAPB, 20.526g of BAPP and 158g of NMP in the bottle, stir to make it dissolve to form a homogeneous transparent solution, and use Cool the temperature of the homogeneous transparent solution to below 10°C in an ice bath, add 11.209g of HPMDA and 19.896g of TMEG into the homogeneous transparent solution in batches, the addition time is 0.5h, react at room temperature for 10h, and add 0.444g of phthalic anhydride , after stirring for 1 h, a viscous polyamic acid resin solution with a solid content of 20 wt.% was obtained.
[0074] Preparation of polyimide self-supporting film: Cool the polyamic acid resin solution to 0-10°C, add the chemical imidization reagent solution under mechanical stirring, stir evenly and perform defoaming treatment, and the defoamed polyamide The acid resin solution is evenly coated on the polyimide fil...
Embodiment 2
[0079] Prepare a 500ml three-necked round-bottom flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 11.209g of HPMDA, 9.016g of absolute ethanol, 15.82g of pyridine and 129g of NMP in the bottle, stir at room temperature for 6h, and add Under the action of the compound pyridine, an esterification reaction occurs to form the corresponding alicyclic diacid diethyl ester solution, and the alicyclic diacid diethyl ester and 23.79g of SOCl 2 React for 2h, react at room temperature for 4h, and form the corresponding HPMDA diacid chloride diethyl ester solution through acid chloride reaction.
[0080] Prepare another 500ml three-necked round-bottom flask equipped with a mechanical stirrer, a thermometer and a nitrogen protection device, add 19.896g of TMEG, 9.016g of absolute ethanol, 15.82g of pyridine and 129g of NMP in the bottle, stir at room temperature for 6h, and Under the action of the base compound pyridine, an esterification reacti...
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