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Diamond wire cutting fluid, and preparation method, application and use method thereof

A technology of diamond wire and cutting fluid, which is applied in the field of diamond wire cutting fluid and its preparation, can solve the problems of broken wire, foam overflowing the cylinder, and increased product scrap rate, so as to reduce wear, reduce foam generation, and improve cutting quality. rate effect

Active Publication Date: 2020-09-11
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the diamond wire cutting fluid currently used on the market still has certain defects, such as frequent wire breakage during the cutting process, which leads to an increase in product scrap rate; and the phenomenon of foam overflowing the cylinder is prone to occur during the cutting process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] (1) Raw materials and components of diamond wire cutting fluid:

[0045] Polyethylene glycol 600 27 parts

[0046] Diethylene glycol 5 parts

[0047] Isononanoic acid 10 parts

[0048] 12 parts triethanolamine

[0049] Isooctyl alcohol polyoxyethylene ether 1.2 parts

[0050] Super dispersant 27000 1.2 parts

[0051] Benzotriazole 3 parts

[0052] 41 parts of water.

[0053] (2) Preparation method of diamond wire cutting fluid

[0054] Add polyethylene glycol 600, diethylene glycol, and benzotriazole to water, and stir for 10 minutes at a stirring rate of 200r / min; add isooctyl alcohol polyoxyethylene ether, super dispersant 27000, and Stir at a stirring rate of 10 min for 10 min; add isononanoic acid until the system is clear and transparent, then add triethanolamine and stir for 15 min at a stirring rate of 200 r / min to obtain a diamond wire cutting fluid S1 with a pH value of 7.2.

Embodiment 2

[0056] (1) Raw materials and components of diamond wire cutting fluid:

[0057] Macrogol 200 25 parts

[0058] Diethylene glycol 10 parts

[0059] Neocapric acid 8.2 parts

[0060] 10 parts triethanolamine

[0061] Fatty alcohol polyoxyethylene ether 0.6 parts

[0062] Super dispersant 27000 0.6 parts

[0063] Benzotriazole 1.2 parts

[0064] 45 parts of water.

[0065] (2) Preparation method of diamond wire cutting fluid

[0066] Add polyethylene glycol 200, diethylene glycol, and benzotriazole to water, and stir for 10 minutes at a stirring rate of 220r / min; add fatty alcohol polyoxyethylene ether, super dispersant 27000, and stir at 220r / min Stir at a stirring rate of 220r / min for 10min; add neodecanoic acid until the system is clear and transparent, then add triethanolamine and stir for 12min at a stirring rate of 220r / min to obtain a diamond wire cutting fluid S2, wherein the pH value is 7.5.

Embodiment 3

[0068] (1) Raw materials and components of diamond wire cutting fluid:

[0069] Macrogol 400 20 parts

[0070] Diethylene glycol 15 parts

[0071] Isononanoic acid 4.1 parts

[0072] Sodium hydroxide 5.2 parts

[0073] Isooctyl alcohol polyoxyethylene ether 0.1 part

[0074] Super dispersant 27000 0.1 parts

[0075] Benzotriazole 0.25 parts

[0076] 55 parts of water.

[0077] (2) Preparation method of diamond wire cutting fluid

[0078] Add polyethylene glycol 400, diethylene glycol, and benzotriazole to water, and stir for 10 minutes at a stirring rate of 210r / min; add isooctyl alcohol polyoxyethylene ether, super dispersant 27000, and Stir at a stirring rate of 10 min for 10 min; add isononanoic acid until the system is clear and transparent, then add sodium hydroxide and stir for 10 min at a stirring rate of 210 r / min to obtain a diamond wire cutting fluid S3 with a pH value of 6.8.

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PUM

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Abstract

The invention relates to a diamond wire cutting fluid, and a preparation method, application and a use method thereof. The diamond wire cutting fluid is prepared from, by weight, 10 to 30 parts of polyethylene glycol, 5 to 25 parts of diethylene glycol, 0.5 to 15 parts of a solubilizer, 0.5 to 15 parts of an acid-base balance agent, 0.1 to 1.5 parts of a penetrating agent, 0.1 to 1.5 parts of a dispersing agent, 0.1 to 5 parts of a corrosion inhibitor and 40 to 85 parts of water. The diamond wire cutting liquid is low in surface tension value, abrasion of a fretsaw can be reduced, the wire breaking rate is reduced, and the cutting yield of products is increased; foam generated in the cutting process can be reduced, so the problem of cylinder overflowing is solved; and the COD value is low,so microbial degradation is facilitated, and environmental pollution is reduced.

Description

technical field [0001] The invention relates to the field of silicon wafer cutting, in particular to a diamond wire cutting liquid and its preparation method, application and use method. Background technique [0002] In the solar wafer cutting process, silicon wafer cutting fluid is an auxiliary material that must be used in the silicon wafer cutting process. Commonly used silicon wafer cutting fluids include mortar cutting fluid and diamond wire cutting fluid. The mortar cutting fluid itself does not contain water, and its actual water content It is difficult to control, and cutting with mortar cutting fluid takes a long time, has low efficiency and high production cost. At present, silicon wafers in the entire photovoltaic industry are basically cut with diamond wire saws instead of the original non-aqueous mortar cutting fluid. However, the diamond wire cutting fluid currently used on the market still has certain defects, such as frequent wire breakage during the cutting...

Claims

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Application Information

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IPC IPC(8): C10M169/04C10N40/22B28D7/02
CPCB28D5/0076C10M169/048C10M2201/062C10M2207/022C10M2207/126C10M2209/104C10M2209/108C10M2215/042C10M2215/30
Inventor 奚美珍魏鸣祥
Owner BYD CO LTD