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Conductive microsphere for anisotropic conductive adhesive/film and preparation method thereof

An anisotropic conductive adhesive and microsphere technology, which is applied in the direction of liquid chemical plating, coating, metal material coating process, etc., can solve the problems of not being able to improve the conductivity, and achieve the effect of maintaining consistency and high conductivity

Pending Publication Date: 2020-09-29
TAIZHOU TIANSHU NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method also does not improve the conductivity much

Method used

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  • Conductive microsphere for anisotropic conductive adhesive/film and preparation method thereof
  • Conductive microsphere for anisotropic conductive adhesive/film and preparation method thereof
  • Conductive microsphere for anisotropic conductive adhesive/film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0093] A conductive microsphere for anisotropic conductive adhesive / film is obtained according to the following steps (the conductive microsphere made by this example is called No. 1 sample):

[0094] (1) Microsphere initiator

[0095] With 2.5 micron microspheres of 25% hydroxyethyl methacrylate and 75% divinylbenzene copolymerization as starting microspheres (the microspheres are the TS025HM microspheres provided by Taizhou Tianshu New Material Technology Co., Ltd., the particle size distribution of the microspheres The coefficient of variation was 3.0%). 20 g of TS025HM microspheres and 9.5 g of triethylamine were added to a 500 ml round bottom flask containing 200 ml of tetrahydrofuran. Under electromagnetic stirring, 20 g of 2-bromopropionyl bromide was added dropwise to the above mixture, and the reaction continued for 12 hours. Filter and wash thoroughly with tetrahydrofuran and methanol. After vacuum drying at 100°C for two hours, the initiator microspheres were obt...

Embodiment 2

[0110] The conductive microsphere made by this example is called No. 2 sample, and other steps are the same as embodiment 1, except that:

[0111] (1) Microsphere initiator

[0112] 2.9-micron microspheres polymerized with 65% divinylbenzene were used as the starting microspheres (the number TS0029-Y microspheres were provided by Taizhou Tianshu New Material Technology Co., Ltd., and the coefficient of variation of the particle size distribution of the microspheres was 2.6%). (A) Add 20 g of TS0029-Y microspheres and 2.0 g of sodium borohydride into a 500 ml round bottom flask containing 200 ml of tetrahydrofuran, and place in an ice bath. 20ml containing 8.0BF 3 g of tetrahydrofuran solution was added dropwise to the above solution, and under electromagnetic stirring, the reaction was continued for 3 hours at room temperature. Then, 20ml of ice water was added to adjust the pH to 8, and then 20ml of 35% hydrogen peroxide was added. Filter and wash thoroughly with tetrahydr...

Embodiment 3

[0115] The conductive microsphere made by this example is called No. 3 sample. Other steps are with embodiment 1, difference is:

[0116] (1) Microsphere initiator

[0117] With 3.0 micron microspheres copolymerized with 25% chloromethylstyrene and 75% divinylbenzene as the starting microspheres, the particle size distribution coefficient of variation of the microspheres is 2.8% (the microspheres are provided by Taizhou Tianshu New Material Technology Co., Ltd. TS003CI microspheres).

[0118] (2) Core-shell microspheres

[0119] 20.0 g of microsphere initiator and 19.0 g of methylstyrene were added to a 1000 ml round bottom flask containing 550 ml of tetrahydrofuran (solution A), and oxygen was removed with nitrogen. Add 1.8g CuBr and 4.0g bipy into a 500ml round bottom flask containing 150ml THF (solution B), and deoxygenate with nitrogen. Add 4.0 g of chloromethyl styrene into a 500 ml round bottom flask containing 250 ml of tetrahydrofuran (solution C), and deoxygenate ...

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Abstract

The invention belongs to the field of preparation of conductive materials, and particularly relates to a conductive microsphere for an anisotropic conductive adhesive / film. The conductive microsphereis prepared through the following steps: with a monodisperse high-crosslinking microsphere as a base sphere for an inner core, grafting a linear polymer on the surface of the base sphere to form a soft-shell outer layer, thereby preparing a core-shell microsphere; and carrying out chemical plating of metal (nickel and silver) on the surface of the microsphere and carrying out secondary electrochemical gold plating to prepare the core-shell type conductive microsphere. According to the invention, the problems that the number of effective conductive microspheres between electrodes is reduced anda contact resistance is increased because the conductive microspheres of the existing common conductive microspheres are broken in a large fitting pressure range are effectively solved.

Description

technical field [0001] The invention belongs to the field of conductive material preparation, and in particular relates to a conductive microsphere used for anisotropic conductive adhesive / film and a preparation method thereof. Background technique [0002] Resin microspheres are used as the base material, conductive microspheres are electroless plated with conductive metal materials, and anisotropic conductive materials are mixed with adhesive resins, which are the mainstream direction of microelectronic circuit connections today. Anisotropic conductive materials are widely used in the packaging of microelectronic devices, such as LCD TV screens, personal computers, cameras, and mobile phones. [0003] The anisotropic conductive adhesive / film is composed of a relatively low ratio of conductive microspheres and binders. Generally, it does not conduct electricity. After placing the conductive adhesive / film between a pair of electrodes and applying a certain pressure , so tha...

Claims

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Application Information

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IPC IPC(8): C08F257/00C08F212/36C08F220/20C08F220/32C08F8/32C08F212/14C08F212/12C23C18/16C23C18/30C23C18/31
CPCC08F257/00C08F8/32C08F212/36C23C18/30C23C18/31C23C18/1646C08F220/14C08F220/325C08F220/20C08F212/18C08F212/12
Inventor 张竟郑国栋郑争
Owner TAIZHOU TIANSHU NEW MATERIAL TECH CO LTD
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