High-efficiency ultraviolet light-emitting diode based on gallium oxide substrate and preparation method thereof
A technology of light emitting diode and gallium oxide, which is applied in the field of microelectronics, can solve the problems of low hole carrier concentration, low Mg ionization rate, large lattice mismatch, etc., and achieves improved luminous efficiency, simple process, and reduced effect of stress
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Embodiment 1
[0043] See figure 1 , figure 1It is a schematic structural diagram of a high-efficiency ultraviolet light emitting diode based on a gallium oxide substrate provided by an embodiment of the present invention. As shown in the figure, the high-efficiency ultraviolet light emitting diode based on gallium oxide substrate in this embodiment includes a substrate layer 1, an AlN nucleation layer 2, an n-type GaN layer 3, a quantum well layer 4, a p-type BN layer 5, a first electrode 6 and second electrode 7 . Among them, the substrate layer 1, the AlN nucleation layer 2, the n-type GaN layer 3, the quantum well layer 4 and the p-type BN layer 5 are sequentially stacked from bottom to top; the first electrode 6 is arranged on the upper surface of the n-type GaN layer 3 ; The second electrode 7 is arranged on the upper surface of the p-type BN layer 5 .
[0044] In this embodiment, the substrate layer 1 is Ga 2 O 3 Material.
[0045] In the high-efficiency ultraviolet light emitti...
Embodiment 2
[0053] This embodiment provides a method for fabricating a high-efficiency ultraviolet light-emitting diode based on a gallium oxide substrate, please refer to figure 2 , figure 2 This is a flow chart of a method for preparing a high-efficiency ultraviolet light emitting diode based on a gallium oxide substrate provided by an embodiment of the present invention. As shown in the figure, the preparation method of this embodiment includes:
[0054] S1: for Ga 2 O 3 The substrate layer is subjected to heat treatment and nitridation treatment;
[0055] Specifically, S1 includes:
[0056] S11: The Ga 2 O 3 After the substrate is cleaned, it is placed in the MOCVD reaction chamber of metal organic chemical vapor deposition, and the vacuum degree of the reaction chamber is reduced to 2×10 -2 Torr, feed hydrogen into the reaction chamber, and keep it for 5-10min under the condition that the pressure of the MOCVD reaction chamber reaches 20-760 Torr and the reaction temperature...
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